00198442-04_UM_TX-V2_EN - 第137页

Instruction manual SIPLACE TX 3 Technical data and assemblies From software version 714.0 12/2020 3.5 Placement head 137 3.5.6.1 T echnical dat a T win S t ar SIPLACE T winSt ar With compo nent camera type 33 (fine pitch…

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3 Technical data and assemblies Instruction manual SIPLACE TX
3.5 Placement head From software version 714.0 12/2020
136
3.5.6 SIPLACE TwinStar for high precision IC placement
3
Fig. 3.5 - 11 SIPLACE TwinStar for high precision IC placement
3
(1) Pick&Place module 1 (P&P1)
(2) Pick&Place module 2 (P&P2)
(3) DP axis
(4) Z axis drive
(5) Incremental distance measuring system for the Z axis
Instruction manual SIPLACE TX 3 Technical data and assemblies
From software version 714.0 12/2020 3.5 Placement head
137
3.5.6.1 Technical data Twin Star
SIPLACE TwinStar
With component camera type 33
(fine pitch camera)
With component camera type 25
(flip chip camera)
Component range
*a
0402 to SO, PLCC, QFP, BGA, special
components, bare dies, flip-chips
0201 to SO, PLCC, QFP, sockets,
plugs, BGA, special components, bare
dies, flip-chips, shields
Component specs
*b
Max. height
Min. lead pitch
Min. lead width
Min. ball pitch
Min. ball diameter
Min. dimensions
Max. dimensions
Max. weight
*c
25 mm (higher available on request)
300 µm
150 µm
350 µm
200 µm
1.0 mm x 0.5 mm
55 mm x 45 mm (single measurement)
Up to
200 mm x 125 mm (multiple measurement)
*d
160 g
*e
25 mm (higher available on request)
250 µm
100 µm
140 µm
80 µm
0.6mm x 0.3mm
16 mm x 16 mm (single measurement)
160 g
e
Set-down force 1.0 N - 15 N
2.0 N - 30 N with OSC package
1.0 N - 15 N
2.0 N - 30 N with OSC package
Nozzle types
*f
5xx (standard)
20xx/28xx + adapter
4xx + adapter
9xx + adapter
Gripper
5xx (standard)
20xx/28xx + adapter
4xx + adapter
9xx + adapter
Gripper
Nozzle spacing for P&P
heads
70.8 mm 70.8 mm
X/Y accuracy
*g
± 28 µm/3σ ± 22 µm/3σ
Angular accuracy ± 0.05° / 3σ, ± 0.05° / 3σ
Illumination level 6 6
*)a Please note that the placeable component range is also affected by the pad geometry, the customer-specific standards, the
component packaging tolerances and the component tolerances.
*)b If the MultiStar and TwinStar are combined in the same placement area, the maximum component height may be restricted.
*)c If standard nozzles are used
*)d Depending on the component dimensions and component infeed, other restrictions may also apply, which SIPLACE Pro will
automatically take into account.
*)e Up to 100 g is standard. Over 100 g available with reduced acceleration.
*)f Over 300 different nozzles and 100 gripper types are available, with an extensive nozzle database available online.
*)g The accuracy values fulfill the conditions in the SIPLACE scope of supply and services.
3 Technical data and assemblies Instruction manual SIPLACE TX
3.6 Gantry system From software version 714.0 12/2020
138
3.6 Gantry system
3.6.1 Position of gantries (SIPLACE TX2 /TX2i)
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Fig. 3.6 - 1 Position of gantries - example of SIPLACE TX2i - location 2
(1) Gantry 1
(2) Y axis, gantry 1 and gantry 2
(3) Gantry 2
(T) Direction of PCB transport
(3)
(2)
(1)