SIPLACE X4 S micron X4i S micron - 第12页

12 Placement heads SIPLACE SpeedStar (C&P20 M) SIPLACE SpeedS tar (C&P20 M) With component camera type 41 Component range a a) Please note that the placeable component range is al so affected by the pad geometry,…

Placement heads

General

Head modularity

The SIPLACE placement

machines are distinguished

by maximum flexibility in the

production process. This

flexibility is in part due to the

head modularity of the place-

ment machines, which allows

different placement head

variants to be configured to

suit the production require-

ments.

The SIPLACE SpeedStar

and the SIPLACE MultiStar

operate according to the

Collect&Place principle i.e.

one cycle includes pickup or

"collection" of 20 or 12 com-

ponents, their optical center-

ing on the board and their

rotation into the required

placement angle and posi-

tion. They are then placed

gently and accurately onto

the PCB. This principle is

particularly suitable for high-

speed placement of standard

components.

The SIPLACE MultiStar also

functions according to the

Pick&Place principle. Two

components are picked up

by the SIPLACE MultiStar,

optically centered on the way

to the placement position

and rotated into the required

placement angle. This princi-

ple is particularly suitable for

fast and precise placement

of large components.

The SIPLACE MultiStar uses

both the Collect&Place and

the Pick&Place principle.

Mixed Mode allows com-

bined use of these two

modes, which were previ-

ously separated from one

another, in one placement

cycle.

Control and self-learning

functions

The reliability of the

SIPLACE placement heads

can be enhanced even fur-

ther with various checking

and self-learning functions.

• Component sensor

Checks the presence of

the components on the

nozzle before the pickup

and placement process

• Digital camera

Checks the position of

each component on the

nozzle. This check is per-

formed in a single step,

with no extra time involved

but with optimum scan-

ning of each individual

component.

• Force sensor

Monitors the prescribed

component set-down

force.

The sensor stop proce-

dure enables compensa-

tion of height differences

during pickup and PCB

warpage during place-

ment.

• Vacuum sensor

Checks whether the com-

ponent was correctly

picked up or placed.

Collect&Place mode

Pick&Place mode

(SIPLACE MultiStar)

Mixed mode

Placement heads

SIPLACE SpeedStar (C&P20 M)

With component camera type

Component range

a) Please note that the placeable component range is also affected by the pad geometry, the customer-

specific standards, the component packaging tolerances and the component tolerances.

03015 mmto 2220, Melf, SOT,

SOD, Bare-Die, Flip-Chip

Component spec.

Max. height

Min. lead pitch

Min. lead width

Min. ball pitch

Min. ball diameter

Min. dimensions

Max. dimensions

Max. weight

4 mm

0.08 mm

0.03 mm

0.10 mm

0.05 mm

0.12 mm x 0.12 mm

6 mm x 6 mm

1 g

Programmable set-down force 1.5 N - 4.5 N

Nozzle types 10xx, 11xx, 12xx

X/Y accuracy

SIPLACE X4 S micron

With "High Precision" flag

Without "High Precision" flag

SIPLACE X4i S micron

b) The benchmark and accuracy values are measured during the machine acceptance tests and corre-

spond to the conditions set out in the ASM scope of service and supply.

± 20 µm / 3σ

± 25 µm / 3σ

Angular accuracy

SIPLACE X4 S micron

SIPLACE X4i S micron

± 0.5° / 3σ

Illumination levels 5

Standard functions High-resolution camera, vacuum sensor, force measurement,

component sensor, integrated turning station per segment, PCB

warpage check, individual image of each component

Placement heads

SIPLACE MultiStar (CPP)

With component camera

type 30

With component camera

type 45

With component camera

type 33

(stationary camera)

Component range

a) Please note that the placeable component range is also affected by the pad geometry, the customer-specific stan-

dards, the component packaging tolerances and the component tolerances.

01005 mm to 27 mm x

27 mm

0201 (metric) to

15 mm x 15 mm

0402 to 50 mm x 40 mm

b) A diagonal of 69 mm is possible during multiple measurements (e.g. 60 mm x 10 mm).

Component spec.

Max height

Max. height

Min. lead pitch

Min. lead width

Min. ball pitch

Min. ball diameter

Min. dimensions

Max. dimensions

Max. weight

c) CPP head: in low installation position (stationary component camera not possible).

d) CPP head: in high installation position

6.0 mm

8.5 mm

0.25 mm

0.10 mm

/ 0.2 mm

0.25 mm

/ 0.35 mm

0.14 mm

/ 0.20 mm

0.4 mm x 0.2 mm

27 mm x 27 mm

4 g

e) For components < 18 mm x 18 mm

f) For components ≥ 18 mm x18 mm

6. mm

8.5 mm

0.25 mm / 0.12 mm

0.10 mm / 0.05 mm

0.25 mm

/ 0.14 mm

0.14 mm

/ 0.07 mm

0.18 mm x 0.18 mm

0.11 mm x 0.11 mm

15 mm x 15 mm

4 g

g) Only possible for components which are within the camera focal area of ± 1.3 mm.

h) For components < 18 mm x 18 mm

11.5 mm

0.3 mm

0.15 mm

0.35 mm

0.2 mm

1.0 mm x 0.5 mm

50 mm x 40 mm

8 g

Programmable set-down

force

1.0 - 10 N 1.0 - 10 N 1.0 - 10 N

Nozzle types 20xx, 28xx 20xx, 28xx 20xx, 28xx

X/Y accuracy

i) The accuracy values are measured during the machine acceptance tests. They correspond to the conditions set

out in the ASM scope of service and supply.

± 41 µm/3σ

± 55 µm/4σ

± 41 µm/3σ

± 55 µm/4σ

± 34 µm/3σ

± 45 µm/4σ

Angular accuracy ± 0.4° / 3σ

, ± 0.5° / 3σ

± 0.5° / 4σ

, ± 0.7° / 4σ

j) Component dimensions between 6 mm x 6 mm and 27 mm x 27 mm.

k) Component dimensions smaller than 6 mm x 6 mm.

± 0.4° / 3σ

, ± 0.5° / 3σ

± 0.5° / 4σ

, ± 0.7° / 4σ

± 0.2° / 3σ

± 0.3° / 4σ

Illumination levels 5 5 6

Standard functions High-resolution camera, vacuum sensor, force measurement, component sensor,

integrated turning station per segment, PCB warpage check, individual image of

each component