SIPLACE X4 S micron X4i S micron - 第27页

27 Component feeding SIPLACE JTF-S/JTF-M Technical data SIPLACE JTF-S SIPLACE JTF-M Width 162 mm 177 mm Height 587 mm 587 mm JEDEC waffle pack tray spec- ification JEDEC Standard: 95-1 & IEC 60286-5 Storage capa city…

Component feeding

SIPLACE JTF-S/JTF-M

The SIPLACE JTF-S/JTF-M

is an automatic and fast

changer for standard JEDEC

waffle pack trays. When

using the SIPLACE X4i S

micron placement machine,

you can install a SIPLACE

JTF-S/JTF-M on a fixed

table, in place of a

component trolley. The

SIPLACE JTF-S/JTF-M

occupies a fixed area of

tracks on the fixed table.

The SIPLACE JTF-S/JTF-M

is available in two versions

• SIPLACE JTF-S

• SIPLACE JTF-M

SIPLACE JTF-S

The SIPLACE JTF-S stores

a stack of up to 30 thin or 20

thick JEDEC waffle pack

trays and supplies them in

succession. The placement

machine can be supplied

with one component type at

constant waffle pack tray

changeover time.

SIPLACE JTF-M

Depending on the magazine

type, the SIPLACE JTF-M

stores up to 18 thin or 14

thick JEDEC waffle pack

trays in an exchangeable

cassette and supplies them

as required. The placement

machine can therefore be

supplied with different com-

ponent types at variable waf-

fle pack tray changeover

times.

JTF-S/JTF-M

Fixed component table

Component feeding

SIPLACE JTF-S/JTF-M

Technical data

SIPLACE JTF-S SIPLACE JTF-M

Width

162 mm 177 mm

Height

587 mm 587 mm

JEDEC waffle pack tray spec-

ification

JEDEC Standard: 95-1 & IEC 60286-5

Storage capacity

Waffle pack tray, thin 30 JEDEC waffle pack trays 18 JEDEC waffle pack trays

Thick waffle pack tray 20 JEDEC waffle pack trays 14 JEDEC waffle pack trays

Waffle pack tray changeover

time

< 5 seconds (depending on

application)

Slot n to n+1 -- 3.5 seconds

Slot 1 to 18 -- 10 seconds

Slot 18 to 1 -- 8.9 seconds

Cassette

Dimensions -- approx. 330 mm x 150 mm x 230

Max. load capacity -- 2.7 kg (150 g each for 18 slots)

Pneumatics

4.1 bar to 5.5 bar 5.2 bar to 9 bar

Compressed air consumption

< 28.3 NL/min. < 28.3 NL/min.

SIPLACE Vision

High placement performance and best quality

SIPLACE Vision is designed

to recognize and measure

components and boards

(substrates), so that these

can then be placed and con-

nected precisely.

In the placement area,

SIPLACE Vision determines

the position of the compo-

nent on the nozzle and there-

fore facilitates exact

positioning of components

on the printed circuit boards.

There is a large component

library available which

already contains all standard

component shapes. Wizard

assistants, such as the Com-

ponent Shape Wizard, make

it easier to create new com-

ponent shapes.

Component recognition

SIPLACE Vision identifies each individual component by its geometry and color. Even complex com-

ponent shapes are detected with high reliability. This component recognition check is performed in a

single step, with no extra time involved but with optimum scanning of each individual component. The

camera types are adjusted to the various head types and present a range of different resolutions, field

of vision sizes, illumination types and focal areas. See also the technical data for the relevant place-

ment heads from page 11 onwards. With the help of different illumination levels and brightness

stages, almost every component shape can be easily recognized. The system also saves images of

the components, so-called "Vision dumps". These enable you to analyze rejected components and to

further improve component shape descriptions. This supports the early recognition of faults in new

products and increases process reliability. These vision dumps also serve as evidence in the event of

defective component supplies.

Component recognition is used for:

• Tolerance checks for component dimensions, L x W, (shape)

• Tolerance checks for component features e.g.:

• Lead/ball grids

• Lead/ball length/diameter

• Deformed leads/missing balls

• Damage/discoloration

• Flipped/face down

• Vision dumps in the event of malfunctions

• Pin 1 / polarity recognition

• Pattern matching

• Glue dot inspection

• Reading component barcodes/data matrix codes

• Pickup reliability

• Pocket measurement

• Tray measurement

• Offset of component to nozzle center and dynamic correction of pickup position