SIPLACE Station Software 7xx to 714 介绍 - 第124页
Station Software 7xx to 714.0 (R20-2) / Feature Description 11/2020 Edition 124 8 Feature Description – Station Software V707.x Features (V707.0) 8.1 SIPLACE CA Series Placement Machines As of this version the station so…
Station Software 7xx to 714.0 (R20-2) / Feature Description 11/2020 Edition
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Features (V706.1 SP1: Compatible Mode V705.05 SP1)
7.52 "Set full" Function Linked to Activity Level
Until now, the operator could set the table full with the button in the main view as of the
Basic Production activity level.
As of this station software version, this function is linked to the activity level.
Default activity level: Advanced Production.
If required, the activity level may be changed.
7.53 New Nozzle Types: 1008 and 1009
The new 1008 and 1009 nozzle types are supported by the station software.
Station Software 7xx to 714.0 (R20-2) / Feature Description 11/2020 Edition
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8 Feature Description – Station Software V707.x
Features (V707.0)
8.1 SIPLACE CA Series Placement Machines
As of this version the station software supports a new SIPLACE CA4 placement machine model of
the CA-series (Chip Assembly). Additionally, the new SIPLACE CA4 eWLP (embedded Wafer
Level Process) placement machine is supported by the station software. However, this machine
type will not be released for series production in this version.
NOTICE
The CA-machines available in the field do not meet with the required hardware
prerequisites and will not be migrated to station software 707. However, the CA-series
placement machines are still available with the 60x station software.
The new CA-series placement machines mainly differ from the previous CA-machines by the
following features:
– Placement heads with a high-resolution star axis are used to achieve high accuracy. For this,
the new C&P20 M placement head type has been introduced. In SIPLACE Pro this placement
head is referred to as C&P20 M 1xxx.
– Support of WLFO – Wafer Level Fan-Out on the SIPLACE CA4 eWLP placement machine as a
customer project (no release for series production).
The SIPLACE Wafer Systems 12 1&3 and 12 2&4 may be used for the placement of bare dies on
the CA-series placement machines. The communication between station software and the
SIPLACE Wafer Systems runs via the new Wafer Feeder feeder type.
Dip modules may also be used on the SIPLACE Wafer Systems.
Station Software 7xx to 714.0 (R20-2) / Feature Description 11/2020 Edition
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In the Production main view the Wafer Feeder is indicated by the icon.
Figure 8-1: Production main view
In the setup overview the Setup view of the Wafer Feeder may be selected via this icon.
Figure 8-2: Setup overview
The level numbers, component names and component shapes from the SIPLACE Pro definition
and, if applicable, the error status of the levels are displayed in table form in this view.