SIPLACE Station Software 7xx to 714 介绍 - 第126页
Station Software 7xx to 714.0 (R20-2) / Feature Description 11/2020 Edition 126 Figure 8-3: Setup view – W afer Feeder 8.1.1 Individual Pick-Up Positions for Flip-Chip Nozzles On the SIPLACE Wafer Sy stems there is an in…
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In the Production main view the Wafer Feeder is indicated by the icon.
Figure 8-1: Production main view
In the setup overview the Setup view of the Wafer Feeder may be selected via this icon.
Figure 8-2: Setup overview
The level numbers, component names and component shapes from the SIPLACE Pro definition
and, if applicable, the error status of the levels are displayed in table form in this view.
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Figure 8-3: Setup view – Wafer Feeder
8.1.1 Individual Pick-Up Positions for Flip-Chip Nozzles
On the SIPLACE Wafer Systems there is an individual pick-up position for each of the two Flip-
Chip nozzles that must be taught manually. For this, the Machine Service activity level is required.
After the appropriate gantry has been selected three handover positions of the Wafer Feeder
nozzles are displayed under Service – Teaching machine positions on the station software GUI:
2x FlipChip and 1x DieAttach. Dependent on the hardware configuration, either both FlipChip
positions or the single DieAttach position must be taught. Mixed FlipChip and DieAttach operation
is not possible.
The nozzle handover positions may be selected and corrected individually in the Change selected
position tab.
The pick-up position is stored persistently at the station, i.e. it remains after a machine reboot or a
new job download.
8.2 SIPLACE X2 S Placement Machine
The station software supports the new SIPLACE X2 S placement machine of SIPLACE X-series S.
The SIPLACE X2 S has two gantries and supports essentially the same configuration variants and
options as the SIPLACE X3 S with the following exception:
– Smart Pin Support is not supported.
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8.3 SIPLACE X4 S micron Placement Machine
The station software supports the new SIPLACE X4 S micron placement machine that is based on
the SIPLACE X4 S machine type. SIPLACE X4 S micron achieves high accuracy through high-
resolution measurements at the main axes and optimized accuracy of the travel parameters.
The SIPLACE X4 S micron supports essentially the same configuration variants and options as the
SIPLACE X4 S except for the head configuration:
– The SIPLACE X4 S micron is exclusively equipped with the high-precision C&P20 M placement
heads (4x) and the SST 41 component camera type.
8.4 SIPLACE X4i S micron Placement Machine
The station software supports the new SIPLACE X4i S micron placement machine that is based
on the SIPLACE X4i S machine type. This new machine type achieves high accuracy through high-
resolution measurements at the main axes and by being equipped with the C&P20 M placement
head. The performance of the machine still complies with that of the SIPLACE X4i S.
The SIPLACE X4i S micron supports essentially the same configuration variants and options as the
SIPLACE X4i S except for the head configuration:
– The SIPLACE X4i S micron is exclusively equipped with the high-precision C&P20 M
placement heads (4x) and the SST 41 component camera type.
8.5 SIPLACE SX1/SX2 V2 Placement Machine with Twin VHF –
Placement of Tall Components
The station software supports a new model of the SIPLACE SX1/SX2 V2 placement machine. This
placement machine differs from the previous model by the fact that one gantry is positioned 12mm
higher as the other one. At this gantry, only the new Twin VHF placement head (Very High Force
Twin Head) can be used. In SIPLACE Pro this placement head is referred to as Twin VHF 5xx.
Components up to a height of 38 mm can be placed with a force of 70 N with the Twin VHF
placement head. Such components may be transported by the WPC5 and WPC6. The maximum
height of component + magazine is 45 mm.
The Twin VHF placement head supports the same nozzle types as the Twin Head.
The Non Stop module may be used for the tall components.
Restrictions arise due to interfering edges, limitations of the turning circle and the component
weight.