SIPLACE Station Software 7xx to 714 介绍 - 第9页

9 11 Feature Description – Statio n Software V710.x 213 11.1 SIPLACE TX micron – New Placement Mac hine ............................................. 213 11.1.1 Vacuum Tooling ............................................…

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10.1.1 Machine Configurations and Placement Head Combinations .......................... 175
10.1.2 SIPLACE TX Conveyor System ....................................................................... 176
10.1.3 Feeder Types, Tables and Other Devices ....................................................... 178
10.1.4 Rejection of Large Components ...................................................................... 179
10.1.5 Calibration of Twin Head with Stationary Flip Chip Camera and Calibration
Nozzle .............................................................................................................. 180
10.1.6 Calibration Steps to Support Machine Dynamics ............................................. 180
10.1.7 Fast Head Exchange ....................................................................................... 181
10.1.8 Fault-Tolerant Operation .................................................................................. 181
10.1.9 Checking the Fans ........................................................................................... 181
10.1.10 Locking / Unlocking the Cover ......................................................................... 182
10.1.11 Creating Bug Report with Virtual Keyboard ..................................................... 182
10.1.12 Other Features ................................................................................................. 182
10.2 Self-healing Fiducial Recognition..................................................................... 183
10.3 E Logbook – Enhancements ............................................................................ 183
10.4 Repeated Reading of the Fiducials before Placement ..................................... 183
10.5 Calibration of C&P20 P Placement Head ........................................................ 184
10.6 Automatic Orientation Check for Components before Pickup .......................... 184
10.7 Heavy Board Option per Board Side................................................................ 185
10.8 Time Synchronization between Line Computer and Station Computer ........... 185
10.9 Improved Handling of Maintenance Steps ....................................................... 186
10.9.1 Preventive Maintenance View.......................................................................... 186
10.9.2 Predictive Maintenance View ........................................................................... 187
10.9.3 Head Verification View ..................................................................................... 188
10.10 Station Software GUI – Improvements ............................................................ 189
10.11 SIPLACE TX-Series – Enhancements ............................................................. 191
10.11.1 Reject Plate Supported on GUI........................................................................ 191
10.11.2 Increased Component Range for Twin Head ................................................... 192
10.12 Independent Placement – 2-in-1 Mode ............................................................ 193
10.13 Maintenance GUI – Enhancements ................................................................. 198
10.13.1 Verification View .............................................................................................. 198
10.13.2 Machine Verification – New Term .................................................................... 198
10.13.3 Machine Verification – Keeping Programs Stored on the Station .................... 199
10.13.4 Placement Head Verification ........................................................................... 199
10.13.5 Camera Verification – New Term ..................................................................... 199
10.13.6 Camera Connections – Checking Gig E Interface ........................................... 200
10.13.7 Conveyor Rail Verification................................................................................ 200
10.13.8 Conveyor Motor Verification............................................................................. 202
10.13.9 Power Supplies ................................................................................................ 203
10.13.10 Feeder Verification ........................................................................................... 204
10.13.11 Verification Reports ......................................................................................... 205
10.13.12 Preventive Maintenance – Tape Cutter ........................................................... 205
10.13.13 Preventive Maintenance – Nozzles.................................................................. 205
10.13.14 Preventive Maintenance – Improved Usability ................................................. 205
10.13.15 Predictive Maintenance – Time-Based Maintenance Cycle ............................. 206
10.14 Returning Dirty Nozzle to Nozzle Changer Magazine ...................................... 206
10.15 Enhanced Automatic Feeder Pitch Detection .................................................. 208
10.16 Improved Face Down Recognition for Diodes ................................................. 209
10.17 Changing Lower Activity Level to SIPLACE Service ........................................ 210
10.18 Different Activity Levels for Handling Segment States ..................................... 210
10.19 Improved Board Identification .......................................................................... 210
10.20 Reading Individual Barcode Fiducials with Board Camera – Enhancements .. 211
10.21 Nozzle Magazine with 20 Garages for CPP Placement Head ......................... 211
10.22 Long Board Option up to 1500 mm .................................................................. 211
10.23 Miscellaneous Improvements and Adaptions .................................................. 212
10.23.1 AutoLogOff functionality ................................................................................... 212
10.23.2 Message Bar .................................................................................................... 212
10.23.3 Table Symbol in Production View .................................................................... 212
10.23.4 Faster Calibration and Head Mapping ............................................................. 212
10.23.5 Enabling Pin1 Detection................................................................................... 212
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11 Feature Description – Station Software V710.x 213
11.1 SIPLACE TX micron – New Placement Machine ............................................. 213
11.1.1 Vacuum Tooling ............................................................................................... 213
11.1.2 ACT – Dependent on Precision ....................................................................... 213
11.2 Shuttle Extension for SIPLACE TX-Series ....................................................... 214
11.3 Precision Value ................................................................................................ 215
11.4 Alternative Component Shapes ....................................................................... 215
11.5 Odd Shape Components – OSC Package Option ........................................... 216
11.5.1 Vision OSC Measuring Options ....................................................................... 216
11.5.2 Increased Placement Force of Twin VHF ........................................................ 218
11.5.3 Improved Placement of Snap-In Components ................................................. 219
11.5.4 Support to Find Best Acceleration ................................................................... 221
11.6 New Fiducial Type – Notch .............................................................................. 224
11.7 Special Fiducial Evaluation for LED Centering ................................................ 224
11.8 Simplified Tray Teaching for Standard Trays ................................................... 225
11.9 Improved Foil Torn Handling............................................................................ 225
11.10 Teaching Pickup Location – Nozzle Tip Displayed .......................................... 225
11.11 SIPLACE CPP M – New Placement Head ....................................................... 226
11.12 SIPLACE JTF-ML2 – New Feeder ................................................................... 226
11.13 Vacuum Tooling ............................................................................................... 227
11.13.1 Verifying the Vacuum Tooling .......................................................................... 227
11.13.2 Checking the Vacuum Tooling Fiducials .......................................................... 227
11.14 Providing Process and Board Data via ASM OIB ............................................ 227
11.15 Shuttle Extension for SIPLACE TX-Series – Enhancements ........................... 227
11.16 Board Inspections – New Types ...................................................................... 228
11.17 Alternative Components – Enhancements ....................................................... 228
11.18 Temperature-Based Head Recalibration ......................................................... 228
11.19 Touchless Placement – New Placement Process ........................................... 228
11.20 Twin Head – Placing Two Long but Narrow Components in One Cycle .......... 229
11.21 Nozzles – New Concave Nozzles .................................................................... 229
11.22 Long Board Option up to 1525 mm .................................................................. 229
11.23 Automatic Calibration – System Identification for SX-series ............................ 229
11.24 Miscellaneous Improvements and Adaptions .................................................. 230
11.24.1 Audible Signal for Indicator Lamps – New Pulse State .................................... 230
11.24.2 Station Software GUI – Adaptions ................................................................... 230
12 Feature Description – Station Software V711.x 231
12.1 "The Hermes Standard" – New Communication Protocol ................................ 231
12.2 New Placement Force – Very Low Force in Placement, Pickup and Dipping
Processes ........................................................................................................ 232
12.3 SEMO CRF80 – New Tape Feeder ................................................................. 232
12.4 SIPLACE TX micron-Series – Teaching .......................................................... 232
12.5 Unique Machine Data for Quality Check .......................................................... 233
12.6 Enhanced Machine Endurance Run ................................................................ 233
12.7 Component Position Check ............................................................................. 234
12.8 Using Two Dip Modules for Dipping ................................................................. 235
12.9 Enhanced FCCS Tool ...................................................................................... 235
12.10 Enhanced SIPLACE Vision Functionality ......................................................... 235
12.11 SIPLACE TX V2 – New Placement Machine ................................................... 236
12.11.1 Switching Off Cover Fan and Vacuum Pump Fan ........................................... 236
12.12 SIPLACE C&P20 P2 – New Placement Head ................................................. 236
12.13 SST48 and SST49 – New Camera Types ....................................................... 236
12.14 SIPLACE SmartFeeder Xi – New X-Feeders ................................................... 237
12.15 Linear Dipping Unit 2 X – New Dipping Module ............................................... 237
12.16 Adjusting Z-Height of Vacuum Tooling ............................................................ 239
12.17 SIPLACE JTF-ML2 – Enhanced Functionality ................................................. 240
12.18 Multiple Road Runner Feeders – Improved Handling ...................................... 241
12.19 "The Hermes Standard" – Board Locking Process .......................................... 241
12.20 Front-Back-Offset Measurement...................................................................... 242
12.21 Checking GigE Camera Connections – Enhanced Functionality ..................... 242
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13 Feature Description – Station Software V712.x 243
13.1 Customer-specific Nozzles – Improvements .................................................... 243
13.2 "IPC-HERMES-9852" – Enhancements ........................................................... 243
13.3 OSC Package Option – Enhancements........................................................... 244
13.4 CPP Placement Head – Increased Placement Force and Component Weight245
13.5 Smart Pin Support – Enhancements................................................................ 245
13.5.1 Smart Pin Support for SIPLACE TX V2-Series ................................................ 245
13.5.2 Prompt To Fill Or Empty Magazines / Garages ............................................... 246
13.6 Linear Dipping Unit 2 X / Linear Dipping Unit E – Enhancements ................... 246
13.7 Shuttle Extension for SIPLACE SX V2-Series ................................................. 246
13.8 SIPLACE MeasuringFeeder X ......................................................................... 246
13.9 Station Behavior When Using Alternative Tracks ............................................ 248
13.10 "Cracked Die Inspection" ................................................................................. 248
13.11 Measuring Barcode on Bottom Side of Component......................................... 251
13.12 Pass-Through Mode for Boards without Recipe .............................................. 251
13.13 Redesigned Calibration View ........................................................................... 252
13.14 Displaying Customer Messages ...................................................................... 255
13.15 SIPLACE Vision Functionality – Additional Enhancements ............................. 256
13.15.1 Contamination Scan ........................................................................................ 256
13.15.2 Detection of Tilted Chips .................................................................................. 257
13.15.3 Face Down Recognition with Gullwing Leads – Enhancement ........................ 257
13.15.4 Flux Inspection ................................................................................................. 258
13.16 Miscellaneous Improvements and Enhancements .......................................... 258
13.17 OSC Package Option – Enhancements........................................................... 260
13.18 Robustness Package – Enhancements ........................................................... 260
13.19 "IPC-HERMES-9852" – Enhancements ........................................................... 261
13.20 Smart Pin Support – Enhancements................................................................ 262
13.21 Saving of Data – Enhancements ..................................................................... 262
13.22 Pickup Position Teaching – Enhancements..................................................... 262
14 Feature Description – Station Software V713.x 263
14.1 Smart Pin Support for TX V2 – Enhancements ............................................... 263
14.2 Automatic Cavity Calibration for Linear Dipping Unit 2 X (LDU 2 X) ................ 264
14.3 Easy Software Deployment.............................................................................. 264
14.4 Maintenance Data Interface (MDI) Supported ................................................. 264
14.5 Five Color Signal Tower Supported for SIPLACE SX V3 Machine .................. 264
14.6 New Nozzle Types ........................................................................................... 265
14.7 Conveyor Direction in Station GUI ................................................................... 265
14.8 Placement Improvements – Freely Programmable Custom Reject Bins ......... 266
14.9 Placement Improvements – Automatic Pin1 Recognition ................................ 266
14.10 Reject Rate View - Enhancements .................................................................. 266
14.11 Changes for Stop Thresholds for Reject Rate Monitoring ............................... 266
14.12 Changes With HERMES-IPC-9852 Version 1.2 .............................................. 267
14.13 New Fiducial Type “Edge” Supported .............................................................. 267
14.14 Inspecting Components After Placement at Too High Speed .......................... 267
14.15 “SIPLACE Service” Button Permanently Visible in Station GUI ....................... 267
14.16 Adjusting Sigma Level for Accuracy Check Tool (ACT) Results ...................... 268
14.17 Support of SIPLACE TX2 V2 HD / SIPLACE TX2i V2 HD ............................... 269
14.18 Configuring Tolerance Values for Resetting the Conveyor Width .................... 269
14.19 Scan Request Dialog – Enhancements ........................................................... 270
14.20 Monitoring and Logging of Maintenance Status ............................................... 271
14.21 Synchronizing Recalibrations of All SIPLACE Stations Along the Line ........... 272
14.22 Verifying Vacuum Tooling by Barcode Fiducial ............................................... 274
14.23 Selecting Flexible Filling Level for Matrix Trays ............................................... 276
15 Feature Description – Station Software V714.x 277
15.1 SIPLACE Tray Unit Supported......................................................................... 277
15.2 SIPLACE TX2 V2 – Placement at Forward Stopper and Reverse Stopper
Supported in Convoy Mode ............................................................................. 277
15.3 New Hardware Supported on SIPLACE TX2 V2 ............................................. 278
15.4 Smart Pin Support – Changed Behavior for Product Changeover Sequence . 278