Specification_SIPLACE_F5_eng - 第3页

2 SIPLACE F 5 with Waffle Pack Changer Technical Data 42 Signal In terfaces Connections Dimensions and Set-Up Condit ions Comp onent Form s 46 Nozzle Type s: 51 Standard Range of Nozzle Types for 6- Nozzle Revolver Head …

Subject to change

without notice

Edition 3

1199-F

-300-e

Machine Description 3

Line Design 4

Placement Heads 5

6-Nozzle Revolver Head for High-Speed IC Placement

Pick & Place Head for High End / High Accuracy IC Placement

Nozzle Changer

Flux Dispenser for Full Flip Chip Capability (Option)

PCB Conveyor 10

Single Conveyor

Dual Conveyor

Ceramic Substrate Centering (Option)

PCB Bar Code for Production-Controlled Manufacturing (Option)

Component Supply 14

Changeover Table

Tape Feeder

Bulk Case Feeders, Stick Magazine Feeders

Dummy Feeder

Manual Trays

Surf Tape Feeder for Bare Dies

Waffle Pack Changer (Option)

Component Bar Code Scanner for Set-Up and Refill Check (Option)

SIPLACE External Set-Up Station (Option)

Vision Sensor Technology 23

PCB Vision Module

PCB Position Recognition

Recognition of Faulty PCBs via Ink Spots

Position Recognition of Feeder

Component Vision Module for the 6-Nozzle Revolver Head

DCA-Vision Module for the 6-Nozzle Revolver Head (Option)

Algorithms to determine the X-/Y-Position and the Rotation Angle

Fine Pitch Component Vision Module for the Pick & Place Head

Flip Chip Component Vision Module for the Pick & Place Head (Option)

Coplanarity Module for the Pick & Place Head (Option)

Machine Criteria 32

Placement Accuracy

Placement Reliability and Placement Speed

Mapping (Option)

SIPLACE Software Architecture 35

System Architecture

Line Computer / Station Computer

Creation of Placement Programs

Machine Data Management System

Data Interface SECS II / GEM (Option)

Remote Support (Option)

Diagnostic Tools (Option)

High Speed Placement of Large ICs, Flip Chips and Bare Dies

SIPLACE F

with Waffle Pack Changer

Technical Data 42

Signal Interfaces

Connections

Dimensions and Set-Up Conditions

Component Forms 46

Nozzle Types: 51

Standard Range of Nozzle Types for 6-Nozzle Revolver Head

Standard Range of Nozzle Types for Pick & Place Head

Possible Machine Configuration 56

High Speed Placement of Large ICs, Flip Chips and Bare Dies

SIPLACE F

Description

SIPLACE F

combines the Fine

Pitch Pick & Place Head with the

6-nozzle-revolver head (Collect &

Place) to unite high precision with

high speed.

Equipped with the 6-nozzle-

revolver head SIPLACE F

place-

ment system optimally comple-

ments, SIPLACE S-23 HM. While

the PCB is still being moved, the

6-nozzle-revolver head is already

picking up the first components.

As soon as the PCB is clamped in

the conveyor, its exact position is

determined with the PCB vision

module. Afterwards the revolver

head picks up the remaining com-

ponents for the entire rotation

step and places its 6 components.

As soon as it is finished, the Pick

& Place Head begins picking up

and placing the components as-

signed to it.

For SIPLACE F

a DCA-package is

available, which contains an alter-

native DCA vision module

mounted in the 6-nozzle revolver

head instead of the standard vision

module. To optimize SIPLACE F

speed and accuracy for high speed

Flip Chip and bare die placement

the dynamic of the machine has

been changed.

The 6-nozzle-revolver-head greatly

increases the speed for products

with high percentages of ICs. The

ICs are placed on the PCB with the

speed of a Collect & Place Head

and with the required precision.

The principle of the stationary PCB

and the motionless component ta-

ble has decisive advantages:

Component tapes of all sizes

can be spliced, preventing ma-

chine stoppage due to empty

feeders.

The feeding of components

with no vibrating enables a reli-

able pick-up of even the small-

est components (e.g., 0402

chips).

Thanks to the flexible 12-nozzle

revolver heads - whose ideal

nozzle set-up is automatically

specified - the travel can be

minimized and the sequence of

placement optimally adjusted.

Holding the PCB stationary pre-

vents components from shifting

during placement.

Speed coupled with economic ef-

ficiency and set-up reliability is the

SIPLACE F

recipe for success.

The product range is rounded off

by optional additional products

such as component changeover

tables, tray changers, component

and PCB bar code scanners or

automatic nozzle changer.

Machine Description

Technical Data

Process Pick & Place / Collect & Place

Range of components

Standard Vision Module

DCA Vision Module

0603 to 55 x 55 mm

0.5 x 0.25 mm (0201*) to 55 x 55 mm

Benchmark placement rate

6-nozzle-revolver head

Pick & Place Head

8,000 cph

1,800 cph

6-nozzle-revolver head

Angle accuracy

Placement accuracy

± 0.225° / 3 σ, 0.30° / 4 σ, 0.45° / 6 σ

± 52.5 µm/ 3 σ, 70 µm/ 4 σ, 105 µm/ 6 σ

( ± 45 µm/ 3 σ, 60 µm/ 4 σ, 90 µm/ 6 σ )**

Pick & Place head

Angle accuracy

Placement accuracy

± 0.052° / 3 σ, 0.07° / 4 σ, 0.105° / 6 σ

± 37.5 µm/ 3 σ, 50 µm/ 4 σ, 75 µm/ 6 σ

( ± 30 µm/ 3 σ, 40 µm/ 4 σ, 60 µm/ 6 σ )***

PCB dimensions

50 x 50 mm to 460 x 460 mm

(optional 460 x 508 mm)

Feeder capacity 40 feeder locations

Component table

Types of Feeder modules

Changeover table, Waffle Pack Changer,

manual trays

Tapes, stick magazines, Bulk Cases

Operating system Microsoft Windows / RMOS

Connection In line or stand alone

Space required 4 m² / module

* SIPLACE F

is capable of handling 0201, if optional set up for it (Please contact Siemens).

** valid only with DCA-package

*** valid only with DCA-package and Flip Chip component vision module for Pick & Place head