Specification_SIPLACE_F5_eng - 第30页

29 Description The Fine Pitch component v ision module ope rates according to a sophisticated lightin g technology and uti lizes dive rse anal ysis alg o- rithms. Despite the great diversity of components it boasts a ver…

Description

The component vision module in-

tegrated into the placement head

performs a critical contribution to

placement accuracy and reliability.

It dependably recognizes all pack-

age forms (= geometric dimen-

sions of the component) illumi-

nated at various angles from a

number of planes (two with the

standard vision module and four

with the DCA vision module). To

illuminate each component opti-

mally, the luminosity of the indi-

vidual planes can be adjusted indi-

vidually in 256 levels.

Aside from the dimension of the

SMD component, the vision sys-

tem determines the lead number

and pitch (lateral IC lead bend) as

well as the rotation angle and X-/Y-

offset. Components which are not

suitable are rejected and automati-

cally corrected in a repair cycle.

Rotational and X-/Y-offsets are cor-

rected at the turning station of the

revolver head or via the gantry

axes. A relevant X-/Y-pick-up offset

is calculated from the positions of

a number of components from one

track. This is factored in accor-

dance with the self-learning princi-

ple during the subsequent pick-up

of components.

Prior to placement the required

geometrical dimensions of one

component type are entered into

the package form (GF) editor, cre-

ating a synthetic model of the

SMD module. This task is simpli-

fied by the comprehensive on-line

information and Help system.

Later the central SIPLACE vision

system, to which all other vision

modules are connected, analyzes

the gray-scale picture of the com-

ponent vision module. To this end,

suitable algorithms are used for

the pertinent package type. Due to

the combination of algorithms, the

vision system also functions relia-

bly under the most difficult condi-

tions, e.g., in the case of different

reflection behavior by the leads or

disruptive influences from the out-

side.

Vision Sensor Technology:

Algorithms to determine the X-/Y-Position and the

Rotation Angle

Algorithm Component Determined on the basis of

Size Driven Chip

the component’s out line

(profile/gradients)

Row Driven IC

several component leads

(correlation method)

Corner Driven IC

all component leads

(correlation method)

Lead Driven Complex IC

each component connection

(High-Accuracy-Lead-Extraction method)

Grid/Ball/Bump

BGA, µBGA,

Flip Chip

all defined balls and bumps

(gradients/ball or bump centering)

Description

The Fine Pitch component vision

module operates according to a

sophisticated lighting technology

and utilizes diverse analysis algo-

rithms. Despite the great diversity

of components it boasts a very

high recognition reliability with all

SMD modules. Like all other vision

modules, this one is also con-

nected to the station’s central vi-

sion system.

The components are illuminated

from three lighting planes whose

intensity can be adjusted in 256

increments. This enables an opti-

mal illumination of each compo-

nent. The gray-scale picture re-

corded is analyzed on the basis of

the algorithm best suited for the

package form.

ICs, Flip Chips and IC-sockets are

centered on the basis over the

leads or bumps. In the case of

chips, bare chips for subsequent

wire bonding and odd-shaped

components, centering is based

on the outside contour (outline

measurement). For these compo-

nents the optional Flip Chip com-

ponent vision module can be

added, which is capable to center

these components by their bumps.

A special inspection mode for the

critical IC lead ends (HALE) pre-

cisely determines the lateral lead

bend as well as pitch error and

lead offset. This greatly reduces

the risk of short circuits.

Beyond this, the rotational angle

deviation and the X-/Y-offset of the

component relative to the nozzle

center is ascertained and factored

in during placement. The X-/Y-

offset also results in the correction

of the pick-up position.

In order to have the vision module

center a component which it does

not yet know, it must first be de-

scribed geometrically in the pack-

age form (GF) file. The component

test makes it possible to check at

the station to determine whether

adjustments, in lighting for exam-

ple, are necessary. These adjust-

ments are automatically assigned

as a file to the pertinent package

form which represents a compo-

nent type. Hence they are valid for

all of the stations in a line. As the

final step, the GF number of the

component type is entered in the

component file.

Vision Sensor Technology:

Fine Pitch Component Vision Module for the Pick & Place Head

Technical Data

Max. component size

32 x 32 mm (single measurement)

55 x 55 mm* (multiple measurement)

Min. lead pitch 0.4 mm (standard), 0.25 (option)

Component range

PLCC, LCCC, QFP, SO, BGA, Flip Chip

components with connections up to

55 x 55 mm (J-leads and gull-wings,

balls, bumps)

Camera’s field of view 38 x 38 mm

Illumination

Front light

(3 freely programmable planes)

Analysis algorithms Compare page 27

* Larger components available on request

Description

The Flip Chip component vision

module extends the capability of

processing Fine Pitch and Flip Chip

components with extreme fine

lead pitches. This add-on module

for the Fine Pitch component vi-

sion module offers a far higher

resolution. The lighting layout is

fundamentally changed in the pro-

cess. At optimal illumination, the

imaging of the bumps is as large

as possible and the orthogonal dis-

ruptive structures (e.g., chip

printed conductor tracks) are sup-

pressed. In the event of less pro-

nounced disruptive structures, the

intensity can be increased by

combined lighting. This results in a

high recognition reliability even

with usually square surfaces of

bumped Flip Chips in the conduc-

tive adhesive technology.

Special search algorithms are used

to recognize the bumps (balls) in

surroundings where fault condi-

tions usually prevail.

Vision Sensor Technology:

Flip Chip Component Vision Module for the Pick & Place Head

(Option)

Technical Data

Flip Chip size

with single measurement

with multiple measurement

1 x 1 mm

up to max. 7 x 9 mm

max. 20 x 20 mm

Dimensions < 3 x 6 mm

Special nozzle,

feeding tolerance < 0.2 mm edge length

Min. bump diameter 80 µm

Placement cycle

min. 2 s

(depending on number of bumps)

IC-pitch:

Lead pitch

Bump pitch

0.25 mm

0.14 mm

Camera’s field of view 9 x 11.5 mm

Illumination

Front light

(3 freely programmable planes)