Specification_SIPLACE_F5_eng - 第7页

6 Description SIPLACE F 5 combines the hig h- precision Pic k & Place head with the 6-nozzle revolver head . With the sta ndard visio n module SIPLACE F 5 places IC s up to a si ze of 32 mm accurately and rapidly. It…

Description

The main X-/Y-gantry features two

placement heads, the 6 -nozzle

high-speed revolver placement

head and the high-precision Pick &

Place Head.

With certain overlapping, each

placement head is specialized for a

specific range of components.

Therefore it is possible to option-

ally distribute the components to

be placed between the two heads.

Placement Heads

Technical Data

Placement principle

Pick & Place Head

Collect & Place (Revolver ) Head

Components Entire SMD range

Component table:

Pick & Place head

6-nozzle revolver head

Feeder on changeover table;

Waffle Pack Changer or manual trays

Feeder on changeover table;

Waffle Pack Changer or manual trays

Placement Heads SIPLACE F

Pick & Place Head

Collect & Place Head

( Revolver )

PCB Transport

Direction

Description

SIPLACE F

combines the high-

precision Pick & Place head with

the 6-nozzle revolver head.

With the standard vision module

SIPLACE F

places ICs up to a size

of 32 mm accurately and rapidly. It

is therefore recommended for use

when there are large percentages

of ICs in the products to be manu-

factured. It greatly enhances per-

formance in the main application

range from PLCC 44 to QFP 208.

Equipped with the alternative DCA

vision module the 6-nozzle revolver

head handles components from

0.5 mm x 0.25 mm up to 13 mm x

13 mm. This vision module is part

of the DCA-package.

Equipped with the DCA-package

SIPLACE F

is optimized in speed

and accuracy for high speed Flip

Chip and bare die placement. Thus

the accuracy for the 6-nozzle re-

volver head with the alternative

DCA vision module achieves an

accuracy of ± 60 µm at 4 sigma

shown on a defined SIPLACE

demo board.

The cycle time of the 6-nozzle re-

volver head - and thus the real

achievable performance - depends

on the dimensions and the number

of leads / bumps of the compo-

nent.

Mechanically and electrically, the

6-nozzle revolver head is structur-

ally very similar to the 12-nozzle

revolver head. Nevertheless, the

two types of revolver heads can-

not be interchanged at will.

Placement Heads:

6-Nozzle Revolver Head for High-Speed IC Placement

6-Nozzle Revolver Head for High Speed Placement of large ICs, Flip

Chips and Bare Dies

Optical

Centering

Component

Turning

Component

Rejection

Segment-

Removal Point

Technical Data

Max. height*

max. weight*

8.5 mm

5 g

Stroke of Z-axis max. 16 mm

Programmable placement force 2.4 to 5.0 N

Benchmark placement rate 8,000 cph

Angle accuracy

± 0.225° / 3 σ

± 0.30° / 4 σ

± 0.45° / 6 σ

Placement accuracy

Standard vision module

DCA vision module

± 52.5 µm/ 3 σ

± 70 µm/ 4 σ

± 105 µm/ 6 σ

± 45 µm/ 3 σ**

± 60 µm/ 4 σ**

± 90 µm/ 6 σ **

* A uniformly reliable, speedy and accurate placement is guaranteed over the entire component

range up to this limit value. Beyond this, components can be placed if they satisfy specific basic

conditions (For other components please contact Siemens).

** Valid only with DCA-package

Description

The highly developed Pick & Place

Head operates on the Pick & Place

principle. It is suitable for picking

up particularly sophisticated or

large components as well as non-

standard models. High-resolution,

intelligent vision modules (Fine

Pitch and Flip Chip component vi-

sion modules) ensure that the

components are in satisfactory

condition that the placement posi-

tion is correct.

The sleeve with nozzle is the heart

of the Pick & Place Head. The

sleeve is mounted such that it is

movable in the longitudinal (Z-axis)

and rotational direction (D-axis).

Each of the two axis are driven by

a DC motor; positioning is done by

incremental encoder. Thanks to a

high-resolution glass incremental

panel on the sleeve, the Pick &

Place Head has an outstanding

high rotational position accuracy.

The rotating movement is trans-

mitted directly from D-axis motor

to the driving plate on the sleeve

via frictional wheel.

To the standard Fine Pitch com-

ponent vision module the op-

tional Flip Chip component vi-

sion module can be added to

allow the Pick & Place Head to

place Flip Chips.

Equipped with the DCA-package

SIPLACE F

is optimized in

speed and accuracy for high

speed Flip Chip and bare die

placement. Thus the accuracy

for the Pick & Place head in

combination with the Flip Chip

vision module reaches an accu-

racy of ± 40 µm at 4 sigma.

Placement Heads:

Pick & Place Head for High End / High Accuracy IC Placement

Technical Data

Component range

max. height

min. lead pitch

max. dimensions

max. weight

PCB-height ≤ 13.5 mm (20 mm* op-

tion) – thickness (PCB) – arching (PCB)

0.4 mm (standard), 0.25 mm (option)

32 x 32 mm (single measurement)

55 x 55 mm (multiple measurement)

25 g

Programmable placement force 1 to 10 N

Nozzles types

5 standard nozzles including

Flip Chip nozzle with nozzle changer

Component centering

Fine Pitch component vision module

(standard)

Flip Chip component vision module

(option)

Benchmark placement rate 1,800 cph

Resolution of the D-axis 0.005°

Angle accuracy

± 0.052° / 3 σ

± 0.07° / 4 σ

± 0.105° / 6 σ

Placement accuracy

± 37.5 µm/ 3 σ ( ± 30 µm/ 3 σ )**

± 50 µm/ 4 σ ( ± 40 µm/ 4 σ )**

± 75 µm/ 6 σ ( ± 60 µm/ 6 σ )**

* valid only with DCA-package and Flip Chip component vision module for Pick & Place Head

** max. PCB-height is depending on the feeder (Please contact Siemens)

Pick & Place Head