Oxford-100-Manual.pdf - 第141页

System Manual Oxford Instruments Plasma Technology Plasma lab System 100 7. Process guide & glossary Printed: 25 May 200510:16 Process Guide and Glossary Page 7-1 of 2 Issue 1: December 03

100%1 / 362
PlasmalabSystem100
Oxford
Instruments Plasma Technology
WARNING
System
Manual
BEFORE
PROCEEDING WITH
ANY
MAINTENANCE WORK, READ SECTION 1 - HEALTH
AND
SAFETY.
6.14
Automatic
load
lock
end
effector
adjustments
for
different
wafer
sizes
The
automatic
load
lock end
effector
can accommodate
wafer
diameters
of
3"
to
8".
This
is
achieved using a series
of
pairs
of
holes
appropriately
spaced
for
the
different
wafer
sizes
into
which
concentric cams are secured.
See
Fig 6.3.
Cam
Rotating
the
cam
about
the
securing
screw
provides
a
small
forwardsl
backwards
adjustment
of
the
wafer
position.
Concentric
cam
detail
Concentric
cam
locations
for
8"
wafers
Concentric
cam
locations
for
6"
wafers
Location
for
5"
wafers
Concentric
cam
locations
for
4"
wafers (cams
shown
in
this
position)
Location
for
3"
wafers
Fig 6.3:
End
effector wafer size adjustments
To set
up
the
end
effector
for
a
wafer
size
different
to
that
previously processed, use
the
following
procedure:
1)
If
necessary,
vent
the
automatic
load lock.
2)
Open
the
automatic
load lock's lid.
3)
Wearing
powder-free
gloves, remove
both
concentric cams/securing screws
from
the
end
effector,
then
fit
them
into
the
appropriate
holes
for
the
wafer
size
to
be
processed.
See
Fig 6.3.
4)
Close
the
automatic
load lock's lid,
then
carry
out
a test
wafer
load
into
a process
chamber. Ensure
that
the
wafer
is
located centrally
on
the
lower
electrode.
If
necessary,
rotate
the
concentric cams
until
the
wafer
is
located centrally.
UC
Davis 94-721001
Issue
1:
March 06
Maintenance
Page 6-22
of
22
Printed: 22-Mar-06.
7:41
System
Manual
Oxford
Instruments
Plasma Technology
Plasma
lab
System
100
7. Process
guide
& glossary
Printed:
25
May
200510:16
Process Guide and Glossary
Page
7-1
of
2
Issue
1:
December 03
Plasma
lab
System
100
Oxford
Instruments
Plasma
Technology
System
Manual
7.1
About
this
Section
This Section contains
the
GIPT
'Process Guide' document.
Note
that
this
document
includes a
Glossary
of
Terms.
Issue
1:
December
03
Process
Guide and Glossary
Page 7-2
of
2
Printed:
25
May
200510:16