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System Manual NOTES: Oxford Instruments Plasma Technology Plasmalab Process Information (Information contained in this document is confidential) Printed: 08 January 2006 09:37 Page 29 of 30 Issue 1: December 03

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Plasma
lab
Oxford
Instruments
Plasma
Technology
System
Manual
Roughing
pump
Roughing valve
Sample
Shower head
Silane
Slit valve
SMC
valve
Specimen
Substrate
I
wafer
I
specimen I sample
TEOS
Throttling
valve
Torr
Turbo
pump
Wafer
Vent
A secondary
pump,
which
reduces
the
chamber pressure
from
atmospheric
to
a
point
at
which
the
high
vacuum (or main)
pump
takes over
for
a
further
reduction
of
pressure.
(See
also
rotary
pump)
The valve which,
when
open, allows
the
roughing
pump
to
pump
gas
from
the
chamber.
See
Substrate
A
form
of
top
electrode having
perforations
through
which
the
process gas
is
introduced
into
the
chamber.
A process gas, SiH4,
which
is
commonly
used in
deposition
processes.
It
is
extremely
toxic, pyrophoric, and,
under
certain conditions, explosive.
A
two-position
gate
valve used
to
seal
the
apertures
between
chambers.
SMC
is
the
manufacturer
of
commonly
used solenoid
operated
pneumatic
valves. The valves are
normally
closed, and
on
receipt
of
an electrical signal,
the
pneumatic
valve opens. In some
cases,
the
opposite
action
is
used,
for
example
to
vent
a
turbo
pump
if
system
power
is
lost.
See
substrate.
The
item
to
be processed in
the
vacuum chamber.
Abbreviation
for
Tetra Ethoxy Silane.
TEOS
is
a
liquid
at
normal
temperature
and pressure. In gaseous
form
it
is
used in
PECVD
processes.
It
is
a replacement
for
silane
in
silicon
oxide
deposition.
An
adjustable valve.
Unit
of
pressure;
11760
of
one
atmosphere
or
bar.
Short
for
turbomolecular
pump,
this being a
multistage
axial
flow
fan
rotating
at
very
high
speed.
Base
pressure
approximately
10-
9
Torr.
See
SUbstrate.
Introduce
high
purity
nitrogen
into
a chamber
or
pump
to
raise
it
to
atmospheric pressure.
Process
Information
(Information
contained
in
this
document
is
confidential)
Issue
1:
December 03 Page 28
of
30 Printed: 08 January 2006 09:37
System
Manual
NOTES:
Oxford
Instruments
Plasma
Technology
Plasmalab
Process
Information
(Information
contained
in
this
document
is
confidential)
Printed:
08
January
2006 09:37 Page 29
of
30
Issue
1: December 03
Plasma
lab
Oxford
Instruments
Plasma
Technology
System Manual
5 OIPT locations
worldwide
UK
Oxford Instruments Plasma Technolgy
North End, Yalton,
Bristol,
BS494AP
Tel: +44(0)1934 837000
Fax: +44(0)1934837001
Email: plasma.technology@oxinsl.co.uk
Web: www.oxford-
instruments.com/plmchp5.htm
USA
Oxford Instruments Inc.
130A Baker Avenue Extension
Concord, MA 01742
Tel:
+1
9783699933
Toll Free
+1
800-447-4717
Fax:
+1
978 369 8287
Email: info@ma.oxinsl.com
Germany
Oxford Instruments GmbH
Olto-von-Guericke Ring 10,
0-65205 Wiesbaden
Tel: +49(0)6122 937161
Fax: +49(0)6122937175
Email: plasma@oxford.de
Japan
Oxford Instruments K.K.
2-11-6 Tomioka
Koto-ku, Tokyo 135-0047
Tel: +81-3-5245-3261
Fax: +81-3-5245-4466
Email: oikkpt@oxinst.co.jp
Web: www.oxford-instruments.jp
People's
Republic
of
China
(Beijing)
Oxford Instruments China
Room 714, Office Tower
3,
Henderson Center,
No. 18 Jianguomennei Ave,
Dongcheng District,
Beijing 100005
Tel: +86
1065188160/1/2
Fax: +86 1065188155
Email: ptsales@oichina.cn
Web: www.oxford-instruments.com.cn
People's
Republic
of
China
(Shanghai)
Oxford Instruments China
Room 14-F,
NO.1
Plaza
800 Nanjing East Road
Shanghai 200001
Tel:
+862163608530
Fax:
+862163608535
Email: ptsales@oichina.cn
Web: www.oxford-instruments.com.cn
Singapore
Oxford Instruments Pte.
Ltd
371
Beach Road,
#02-07 Keypoint
Singapore 199597
Tel: +65 6337 6848
Fax: +65 6337 6286
Email: oipl.sales@oxford-
instruments.com.s9
Taiwan
Oxford Instruments Overseas
Marketing Ltd.
1
F,
No
23
Jing-Shang 19
1h
Street,
Hsinchu, Taiwan
Tel:
+6563376848
Fax: +65 6337 6286
Email: oipl.sales@oxford-
instruments.com.sg
Process
Information
(Information
contained
in
this
document
is
confidential)
Issue
1: December 03 Page 30
of
30 Printed: 08 January 2006 09:37