DEK INFINITY USER MANUAL - 第241页
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Software Version 7 User Manual 8.1
CHAPTER 8 2D INSPECTION
MODULE OVERVIEW
Introduction 2D Inspection (2Di) utilizes the machine vision system for accurate detection of
paste on the board and stencil after printing. When this option is enabled the
board and stencil can be inspected for various aspects of printing as listed in the
table below.
When certain function keys are selected the existing machine status page is
replaced by a Graphical User Interface (GUI). The GUI allows the user to setup
and navigate 2Di sites quickly and easily.
Purpose By monitoring the printing process, 2Di ensures the continual quality of board
printing. 2Di, if licensed, verifies the correct paste coverage, alignment, bridg-
ing, volume, blockage and smear, (figure overleaf details).
If there is insufficient paste on the board, paste dispense and reprinting the board
operations can be undertaken. If there is too much blockage or smear, the stencil
can be cleaned automatically.
2Di optimizes the cycle time by eliminating unnecessary stencil cleaning and
paste dispensing operations. To achieve this, the system inspects various areas
of the board and/or stencil to detect the following:
Inspection Type Description
Paste on Pad Basic Amount of the pad covered by solder paste, as a % of the
aperture size
Stencil Blockage Basic Solder paste remaining inside stencil apertures
Alignment Advanced Accuracy of paste positioning compared to the learnt pad
Bridging Advanced Distance between adjacent deposits of paste
Volume Advanced Volume of paste on the board
Stencil Smear Advanced Solder paste on the stencil
NOTE: Advanced Inspection Type option is not available on some machines.
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8.2 User Manual Software Version 7
Figure 8-1 Paste on Board and Stencil
Using blockage and paste present information, the system can calculate the
following:
• Paste Volume - volume of paste on the board.
Operation Board and stencil inspection is licensed as a separate feature for each, and
specifies the maximum level of inspection which may be selected. The levels
of inspection for either feature against inspection type is detailed in the follow-
ing table:
NOTE
Board Inspection when set to Advanced, checks for paste on and off the pad.
An item only appears in a window while it is appropriate to the current inspec-
tion type. In particular, Paste Volume is only calculated and displayed whilst the
level of inspection is set to Advanced for both the board and the stencil.
Pre-images Board inspection is achieved by image comparison. Therefore prior to printing,
the camera visits all programmed sites to capture images of the bare sites.
This captured image, called a Pre-image, is taken for every site setup. The two
available parameter settings for capturing Pre-images is:
• One - Pre-image captured on the first board in a batch only.
• Every - Pre-image captured on every board of a batch.
Paste on Stencil (Smear)Paste on Board (Bridging)
Paste on
Pad
Stencil
Aperture
Board Pad
Alignment
Volume
Top of Board
Stencil (Underside)
Paste in
Aperture
(Blockage)
Inspection Type Board Inspection Stencil Inspection
None No Inspection No Inspection
Basic Paste on Pad Blockage
Advanced Paste on Pad
Bridging
Alignment
Paste Volume Prediction
Blockage
Smear