SIPLACE D4i 规格说明书英文版 - 第11页

11 Placement Head Standard Functions / Options 12-nozzle Collect & Pl ace head S tandard functions Camera, vacuum sensor , force measurement, PCB war- page, check, individual re cording for each component Options Hig…

Placement Head

Overview

With the SIPLACE D4i, we

can provide you with an

extremely powerful place-

ment machine with four gan-

tries and four 12-nozzle

Collect&Place heads. It is

thus a high-speed placement

machine that combines a

high placement rate with

placement accuracy and

flexibility.

Collect&Place principle

The SIPLACE 12-nozzle

Collect & Place head works

on the Collect & Place princi-

ple. This means that, within

each cycle, 12 components

are picked up and "collected"

by the placement head, are

optically centered on the way

to the board and are rotated

into the required placement

angle. They are then placed

gently and accurately on the

PCB. This principle is partic-

ularly suitable for the high-

speed placement of standard

components.

Checking and self-learning

functions

The SIPLACE placement

heads' reliability can be fur-

ther increased with various

checking and self-learning

functions.

• Component sensor

It checks for the presence

of a component at the

nozzle before and after the

pick-up and placement

process.

• Digital camera on the

placement head

Checks the position of

each component at the

nozzle.

Any deviations from the

required pick-up position

are corrected before

placement takes place.

• Force sensor

Monitors the specified

component set-down

forces. With the sensor

stop method, differences

in height during pick-up

and any unevenness of

the PCB surface are com-

pensated during place-

ment.

• Vacuum sensor

Checks whether the com-

ponent was picked up or

set down correctly.

Collect&Place principle

Placement Head

Standard Functions / Options

12-nozzle Collect&Place head

Standard functions Camera, vacuum sensor, force measurement, PCB war-

page, check, individual recording for each component

Options High-resolution camera, component sensor, short nozzle,

short sleeve, nozzle changers, special nozzles

Placement Head

Technical Data

12-nozzle

Collect&Place head

CO camera type 28

12-nozzle

Collect&Place head

CO camera type 30

Component range

a) Please note that the range of components that can be placed is also affected by the pad geometry,

customer-specific standards, component packaging tolerances and component tolerances

0402 to PLCC44, BGA, µBGA, flip-

chip, TSOP, QFP, SO to SO32,

DRAM

01005

to flip-chip, bare die,

PLCC44, BGA, µBGA, TSOP, QFP,

SO to SO32, DRAM

b) With 01005 package

Component specification

max. height

min. lead pitch

min. lead width

min. ball pitch

min. ball diameter

min. dimensions

max. dimensions

max. weight

6 mm

0.5 mm

0.2 mm

0.35 mm

0.2 mm

1.0 x 0.5 mm²

18.7 x 18.7 mm²

2 g

6 mm

0.3 mm

0.15 mm

0.25 mm

0.14 mm

0.4 x 0.2 mm²

18.7 x 18.7 mm²

2 g

Programmable set-down

force

2.4 N - 5.0 N 2.4 N - 5.0 N

Nozzle types 9xx 9xx

X/Y accuracy

c) The accuracy value was measured using the vendor-neutral IPC standard

± 50 µm/3σ

± 67 µm/4σ

± 50 µm/3σ

± 67 µm/4σ

Angular accuracy ± 0.53°/3σ

± 0.71°/4σ

± 0.53°/3σ

± 0.71°/4σ

Component range 98% 98.5%

Component camera type 28 30

Illumination levels 5 5

Possible illumination level

settings

256