SIPLACE DX4-Spec-设备性能参数-EN-DMS - 第11页
11 Machine Performance Placement head type SIPLACE SpeedStar (C&P20) Placement perfor mance The placement performan ce is influenced by the differ ent head combinations a nd head positions, plus the conveyor configur…
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Machine Concept
NC
NC
C&P20
C&P20
NC
NC
PA1
PA2
C&P20
DXT
C&P20
PA1 Placement area 1
PA2 Placement area 2
OP Operator panel
C&P20 SpeedStar
NC Nozzle Changer for C&P20 Head
BZ Buffer zone
DXT DX4 table
IN Input area - conveyor
OUT Output area - conveyor
OP
OP
BZ
DXT
DXT
DXT
OUT
BZ
IN
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Machine Performance
Placement head type SIPLACE SpeedStar (C&P20)
Placement performance
The placement performance is influenced by the different head combinations and head positions, plus
the conveyor configurations. Individual options and customized applications also influence the place-
ment performance. On request, SIPLACE can calculate the actual performance of your product on
your machine configuration.
IPC value [comp./h]
In line with the vendor-neutral conditions of the IPC 9850 standard published by the Association of
Connecting Electronics Industries.
SIPLACE Benchmark value [comp./h]
The SIPLACE benchmark value is measured during the machine acceptance tests. It corresponds to
the conditions specified in the SIPLACE scope of service and supply.
Theoretical maximum output value [comp./h]
The theoretical maximum output value is calculated from the most favorable conditions for each
machine type and setting, and corresponds to the theoretical conditions normally used in the industry.
SIPLACE DX4
Placement area 1 Placement area 2 IPC value Benchmark value Theoretical value
C&P20 / C&P20 C&P20 / C&P20 102,000 125,000 135,500
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SIPLACE Placement Head
Overview
Collect&Place principle
The SIPLACE SpeedStar
operates according to the
Collect&Place principle i.e.
one cycle includes pickup or
"collection" of 20 compo-
nents, their optical centering
on the board and their rota-
tion into the required place-
ment angle and position.
They are then placed gently
and accurately onto the PCB.
This principle is particularly
suitable for high-speed
placement of standard and
01005 components.
Control and self-learning
functions
The reliability of the
SIPLACE placement heads
can be enhanced even fur-
ther with various checking
and self-learning functions.
• Component sensor
Checks the presence of
the components on the
nozzle before the pickup
and placement process
• Digital camera
Checks the position of
each component on the
nozzle. This check is per-
formed in a single step,
with no extra time involved
but with optimum scan-
ning of each individual
component.
• Force measurement
Monitors the prescribed
component set-down
force.
The sensor stop proce-
dure enables compensa-
tion of height differences
during pickup and PCB
warpage during place-
ment.
• Vacuum sensor
Checks whether the com-
ponent was correctly
picked up or placed.