SIPLACE DX4-Spec-设备性能参数-EN-DMS - 第12页

12 SIPLACE Placement Head Overview Collect & Place principle The SIPLACE SpeedStar operates acco rding to the Collect & Place principle i.e. one cycle includes pickup or "collection" of 20 com po- nents…

Machine Performance

Placement head type SIPLACE SpeedStar (C&P20)

Placement performance

The placement performance is influenced by the different head combinations and head positions, plus

the conveyor configurations. Individual options and customized applications also influence the place-

ment performance. On request, SIPLACE can calculate the actual performance of your product on

your machine configuration.

IPC value [comp./h]

In line with the vendor-neutral conditions of the IPC 9850 standard published by the Association of

Connecting Electronics Industries.

SIPLACE Benchmark value [comp./h]

The SIPLACE benchmark value is measured during the machine acceptance tests. It corresponds to

the conditions specified in the SIPLACE scope of service and supply.

Theoretical maximum output value [comp./h]

The theoretical maximum output value is calculated from the most favorable conditions for each

machine type and setting, and corresponds to the theoretical conditions normally used in the industry.

SIPLACE DX4

Placement area 1 Placement area 2 IPC value Benchmark value Theoretical value

C&P20 / C&P20 C&P20 / C&P20 102,000 125,000 135,500

SIPLACE Placement Head

Overview

Collect&Place principle

The SIPLACE SpeedStar

operates according to the

Collect&Place principle i.e.

one cycle includes pickup or

"collection" of 20 compo-

nents, their optical centering

on the board and their rota-

tion into the required place-

ment angle and position.

They are then placed gently

and accurately onto the PCB.

This principle is particularly

suitable for high-speed

placement of standard and

01005 components.

Control and self-learning

functions

The reliability of the

SIPLACE placement heads

can be enhanced even fur-

ther with various checking

and self-learning functions.

• Component sensor

Checks the presence of

the components on the

nozzle before the pickup

and placement process

• Digital camera

Checks the position of

each component on the

nozzle. This check is per-

formed in a single step,

with no extra time involved

but with optimum scan-

ning of each individual

component.

• Force measurement

Monitors the prescribed

component set-down

force.

The sensor stop proce-

dure enables compensa-

tion of height differences

during pickup and PCB

warpage during place-

ment.

• Vacuum sensor

Checks whether the com-

ponent was correctly

picked up or placed.

SIPLACE Placement Head

SIPLACE SpeedStar (C&P20)

SIPLACE SpeedStar

component camera type 23

(C&P20)

Standard-

functions

High-resolution camera, vacuum sensor, force measurement, component sen-

sor, integrated turning station per segment, PCB warpage check, individual

image of each component

Options Nozzle changer, special nozzles

Component range

a) Please note that the placeable component range is also affected by the pad geometry, the customer-specific

standards, the component packaging tolerances and the component tolerances.

01005 to 2220, Melf,

SOT, SOD

Component spec.

max. height

min. lead pitch

min. lead width

min. ball pitch

min. ball diameter

min. dimensions

max. dimensions

max. weight

4 mm

0.25 mm

0.1 mm

0.4 mm

0.2 mm

0.4 mm x 0.2 mm

6mm x 6 mm

1 g

Programmable set-down

force

1.5 N - 4.5 N

Nozzle types 10xx, 11xx, 12xx

X/Y accuracy

b) Accuracy values measured in accordance with vendor-neutral IPC standard.

± 41 µm/3

± 55 µm/4

Angular accuracy ± 0.5° / 3

± 0.7° / 4

Illumination levels 5

Possible illumination level

settings-

256