SIPLACE TX V2 micron 设备性能参数_DMS - 第15页
15 Board warpage Board warpage across th e direction of trave l max. 1% of the PCB diagonal, but not exceeding 2 mm. Board warpage on t he conveyor Fixed clamped edge Movable clamping device Boar Fixed clamped edge Conve…

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Board conveyor
I-Placement
Alternating placement mode
Alternating placement or
I-Placement mode
Distance of outer conveyor
edges: 562 mm, 2 lanes, outer
conveyor edges fixed
Alternating placement mode
Distance of outer conveyor
edges: 562 mm, 2 lanes, right
conveyor edges fixed
a
Alternating placement mode
Distance of outer conveyor
edges: 460 mm, dual conveyor
in single conveyor mode, right
conveyor edge fixed
a
Max. 260
Movable conveyor side
Stationary conveyor side
a) The diagram only shows settings with a fixed righthand conveyor edge. A setting with the stationary conveyor
edge on the left is also possible. All dimensions in millimeters.
Max. 260
281
562
Min. 35
281
179
Max. 260
281
Min. 35
Max. 260
562
Max. 460
Adjustable conveyor side position and max. PCB width
Conveyor side position Max. PCB width Distance of fixed sides to one another, for various fixed
side position settings
Outside Right or left
234.2 mm 216 mm 468.4 mm 251.7 mm
268 mm SMEMA 250 mm 536 mm 285.5 mm
281 mm SMEMA 260 mm 562 mm 298.5 mm
Machine center
Machine center
Machine center

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Board warpage
Board warpage across the direction of travel
max. 1% of the PCB diagonal, but not
exceeding 2 mm.
Board warpage on the conveyor
Fixed clamped edge
Movable clamping device
Boar
Fixed clamped edge
Conveyor belt
Board transport direction
Front PCB edge
Front PCB edge
Board warpage in direction of travel + PCB thickness < 5.5 mm
Bending up of front PCB edge max. 2.5 mm
Left conveyor belt
Right conveyor belt
Board transport direction

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Board warpage
Board warpage during placement
To avoid impairing the placement quality and
speed, we recommend using a PCB support, so
that the PCB warpage downwards does not
exceed 0.5 mm.
Board warpage up, max. 2 mm
Board support
Board warpage down, max. 2 mm
Changes in the surface position are automatically applied by the functions for learning the height.