SIPLACE TX V2 micron 设备性能参数_DMS - 第21页

21 Component feeding Alternative SIPLACE feeder modules JTF-ML2 The SIPLACE TX2 m can accommodate a SIPLACE JTF-ML2 at location 1. The JTF-ML2 is fitted at the side. Depending on th e magazine type, the SIPLA CE JTF-ML2 …

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Component feeding
Alternative SIPLACE modules
SIPLACE MeasuringFeeder X
Description
The SIPLACE
MeasuringFeeder X is used
to prevent placement of
incorrect components by ver-
ifying the electrical values of
configured components. This
supports identification of
setup errors, such as mixed
up component tapes, incor-
rectly labeled component
reels or reels with counter-
feit, non-functional compo-
nents.
The SIPLACE
MeasuringFeeder X does
not feed in components itself
but instead measures com-
ponents which are already
on the changeover table, in
conventional tape feeder
modules. All components for
which an electrical value has
been stored in SIPLACE Pro
are picked up by the place-
ment head and the relevant
values are determined via
two contacts in SIPLACE
MeasuringFeeder X.
The SIPLACE
MeasuringFeeder X can
measure capacitors, resis-
tors and inductors, plus
diodes.
It can measure two-pin com-
ponents, which have contact
surfaces on the underside of
the component and a size of
at least (L x W)
0.6mmx0.3mm to
6 mm x 3.2 mm. It deter-
mines the capacity of capac-
itors, the electrical resistance
of resistors and the inductiv-
ity of inductors. It also checks
the blocking direction of
diodes and thereby the polar-
ity.
Measurable value range of components:
Component type Measuring range Measuring tolerance
Capacitors 1 pF - 100µF (standard)
100 nF - 500µF (polarized)
± 5%
Resistors 100 mOhm- 1MOhm ± 5%
Diodes Forward voltage 0.2 - 4 V --
Inductors 1µH - 1mH ± 15%
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Component feeding
Alternative SIPLACE feeder modules
JTF-ML2
The SIPLACE TX2 m can
accommodate a SIPLACE
JTF-ML2 at location 1.
The JTF-ML2 is fitted at the
side.
Depending on the magazine
type, the SIPLACE JTF-ML2
stores up to 18 thin or, as an
option, 14 thick JEDEC
waffle pack trays in an
exchangeable cassette and
supplies them as required.
The placement machine can
therefore be supplied with
different component types at
variable waffle pack tray
changeover times.
An output conveyor
extension is required when
using the JTF-ML2. This
extends the conveyor by 600
mm.
Technical data
Width x length x height (tower)
374.5 mm x 322.7 mm x 707.0 mm
Width x length x height (conveyor)
356.2 mm x 346.0 mm x 68.2 mm
Weight
Tower (empty): 26.3 kg (58.0 lbs.)
Total: ~36 kg (79.4 lbs.) (depending on application)
Storage capacity
JEDEC waffle pack tray specification JEDEC Standard: 95-1 & IEC 60286-5
Waffle pack tray, thin 18 JEDEC waffle pack trays or
18 magazine trays (cookie trays)
(in two cassettes)
Thick waffle pack tray 14 JEDEC waffle pack trays or
14 magazine trays (cookie trays)
(in two cassettes)
Waffle pack tray changeover time 3.15 to 6.1 seconds (depending on application
a
)
a) 3.15 seconds to the next waffle pack tray with maximum acceleration, 6.1 seconds from the first to the
ninth waffle pack tray with minimum acceleration
Slot n to n+1 3.15 to 5.4 seconds (maximum/minimum accelera-
tion)
Cassette
Width x length x height 343.7 mm x 136 mm x 137 mm
Max. load weight (per cassette) 4.45 kg (incl. weight of cassette)
JTF-ML2
Output conveyor extension
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SIPLACE Vision
OnBoard Inspection and Pattern Matching
OnBoard Inspection
The OnBoard PCB Inspec-
tion (SW option) uses the
PCB camera to inspect criti-
cal areas of the PCB, speci-
fied by the user, e.g. under
BGA or shields just before or
after placement, to make
sure that all components
were placed or to make sure
that there are no objects in
the way of the placement
process.
It is also possible to inspect
the solder paste to make
sure that it is present. How-
ever, this must always be
performed at the first place-
ment machine, before any
placement begins.
A requirement for all inspec-
tion tasks is that a "good pat-
tern" has been saved before
starting.
Pattern Matching
Pattern matching can be
used for components with
very fine contact pads, which
can not be detected with the
existing component camera
resolution. Searching and
detection is performed over a
larger area, which contains
unique structures (patterns).
Once the specified area has
been detected, the compo-
nent is aligned and placed
according to the position of
this area and in relation to the
substrate.