SIPLACE TX V2 micron 设备性能参数_DMS - 第22页

22 SIPLACE Vision OnBoard Inspection and Pattern Matching OnBoard Inspection The OnBoard PCB Inspec- tion (SW option) uses the PCB camera to inspect criti- cal areas of the PCB, speci- fied by the user, e.g. under BGA or…

Component feeding

Alternative SIPLACE feeder modules

JTF-ML2

The SIPLACE TX2 m can

accommodate a SIPLACE

JTF-ML2 at location 1.

The JTF-ML2 is fitted at the

side.

Depending on the magazine

type, the SIPLACE JTF-ML2

stores up to 18 thin or, as an

option, 14 thick JEDEC

waffle pack trays in an

exchangeable cassette and

supplies them as required.

The placement machine can

therefore be supplied with

different component types at

variable waffle pack tray

changeover times.

An output conveyor

extension is required when

using the JTF-ML2. This

extends the conveyor by 600

mm.

Technical data

Width x length x height (tower)

374.5 mm x 322.7 mm x 707.0 mm

Width x length x height (conveyor)

356.2 mm x 346.0 mm x 68.2 mm

Weight

Tower (empty): 26.3 kg (58.0 lbs.)

Total: ~36 kg (79.4 lbs.) (depending on application)

Storage capacity

JEDEC waffle pack tray specification JEDEC Standard: 95-1 & IEC 60286-5

Waffle pack tray, thin 18 JEDEC waffle pack trays or

18 magazine trays (cookie trays)

(in two cassettes)

Thick waffle pack tray 14 JEDEC waffle pack trays or

14 magazine trays (cookie trays)

(in two cassettes)

Waffle pack tray changeover time 3.15 to 6.1 seconds (depending on application

)

a) 3.15 seconds to the next waffle pack tray with maximum acceleration, 6.1 seconds from the first to the

ninth waffle pack tray with minimum acceleration

Slot n to n+1 3.15 to 5.4 seconds (maximum/minimum accelera-

tion)

Cassette

Width x length x height 343.7 mm x 136 mm x 137 mm

Max. load weight (per cassette) 4.45 kg (incl. weight of cassette)

JTF-ML2

Output conveyor extension

SIPLACE Vision

OnBoard Inspection and Pattern Matching

OnBoard Inspection

The OnBoard PCB Inspec-

tion (SW option) uses the

PCB camera to inspect criti-

cal areas of the PCB, speci-

fied by the user, e.g. under

BGA or shields just before or

after placement, to make

sure that all components

were placed or to make sure

that there are no objects in

the way of the placement

process.

It is also possible to inspect

the solder paste to make

sure that it is present. How-

ever, this must always be

performed at the first place-

ment machine, before any

placement begins.

A requirement for all inspec-

tion tasks is that a "good pat-

tern" has been saved before

starting.

Pattern Matching

Pattern matching can be

used for components with

very fine contact pads, which

can not be detected with the

existing component camera

resolution. Searching and

detection is performed over a

larger area, which contains

unique structures (patterns).

Once the specified area has

been detected, the compo-

nent is aligned and placed

according to the position of

this area and in relation to the

substrate.

SIPLACE Vision

Cracked Die Detection

Crack Die Detection

The Cracked Die Detec-

tion can detect breaks

before removal from the

tape, if the crack runs

between two outer edges of

the die. Inspection is per-

formed with the PCB cam-

era. A prerequisite for

detection is that the two

parts of the die are slightly

inclined towards one

another. Detection is possi-

ble via the differing reflec-

tion angles of the two

surfaces which are inclined

towards one another.

Good

Bad