SIPLACE TX V2 micron 设备性能参数_DMS - 第7页

7 Machine performance Placement head types SIPLACE S peedS tar (C&P20 M3) SIPLACE MultiS t ar (CPP M) Placement performanc e The placement performan ce is inf l uenced by the different head c ombinations and hea d po…

SIPLACE TX m

Machine description

The latest generation of

SIPLACE placement mod-

ules set placement perfor-

mance, floorspace

performance and placement

accuracy records.

The innovative high-end

placement platform

SIPLACE TX m achieves

new benchmarks in place-

ment performance and pro-

ductivity per area. The

compact design of the

SIPLACE TX m supports

precise scaling of line perfor-

mance in small steps.

The SIPLACE TX m Edition

V2 placement machines are

available in three variants:

• TX2 m (588520)

• TX2i m (588525)

• TX2i m 4 mm (588526)

The SIPLACE TX2 m sup-

ports the accuracy class for

enhanced placement accu-

racy of 15 µm

(3) and

20 µm

(3). The

SIPLACE TX2i m also offers

the entire benchmark place-

ment performance range of

96,000

[components/h] at an

accuracy of 25 µm

(3) and

85,500

[components/h] with

the SIPLACE TX2 m.

Maximum accuracy

To achieve maximum accu-

racy, the SIPLACE TX m

placement machines are

equipped with high resolution

glass ceramic scales on the

main axes and the C&P20

M3 or CPP M heads. A highly

rigid PCB conveyor and an

additional fiducial rail are

also used.

The SIPLACE TX2i m 4 mm

facilitates placement of 4 mm

high components with the

C&P20 M3 placement head.

The user enjoys a PCB con-

veyor with flexible

SIPLACE dual conveyor.

Vacuum Tooling

Fiducial rail

Machine performance

Placement head types SIPLACE SpeedStar (C&P20 M3)

SIPLACE MultiStar (CPP M)

Placement performance

The placement performance is influenced by the different head combinations and head positions, plus the conveyor

configurations. Individual options and customized applications also influence the placement performance. On request,

ASM can calculate the actual performance of your product on your machine configuration.

IPC value [components/h]

Conducted with 0402 components, in accordance with the layout of the IPC 9850 standard of Association Connecting

Electronics Industries.

SIPLACE benchmark value [components/h]

The SIPLACE benchmark value is measured during the machine acceptance tests. It corresponds to the conditions set

out in the ASM scope of service and supply.

SIPLACE TX2 m placement

machine

Placement area IPC value Benchmark

value

Standard C&P20 M3 / C&P20 M3 72,300 85,500

C&P20 M3 / CPP M_L 57,800 66,600

CPP M_L / CPP M_L 43,300 47,700

Placement accuracy 20 µm (3) C&P20 M3 / C&P20 M3 64,000 76,000

C&P20 M3 / CPP M_L 54,000 62,500

CPP M_L / CPP M_L 38,000 46,000

Placement accuracy 15 µm (3) C&P20 M3 / C&P20 M3 ---

a) IPC value is not possible, as the IPC PCB is larger than 250 mm x 100 mm,

70,000

SIPLACE TX2i m placement

machine

Placement area IPC value Benchmark

value

Standard C&P20 M3 / C&P20 M3 78,000 96,000

Placement accuracy 20 µm (3) C&P20 M3 / C&P20 M3 70,000 83,000

Placement accuracy 15 µm (3) C&P20 M3 / C&P20 M3 ---

75,000

SIPLACE TX2i m 4 mm placement

machine

Placement area IPC value Benchmark

value

Standard C&P20 M3 / C&P20 M3 76,000 93,000

Placement accuracy 20 µm (3) C&P20 M3 / C&P20 M3 68,000 81,000

Placement accuracy 15 µm (3) C&P20 M3 / C&P20 M3 ---

73,000

Placement heads

SIPLACE SpeedStar (C&P20 M3)

With component camera

type 48 (Standard)

With component

camera type 49

(Optional)

Component range

a) Please note that the placeable component range is also affected by the pad geometry, the customer-

specific standards, the component packaging tolerances and the component tolerances.

0.12 mm x 0.12 (0201 metric) to 2220, Melf, SOT, SOD, Bare-

Die, Flip-Chip

Component spec.

Max. height

Min. lead pitch

Min. lead width

Min. ball pitch

Min. ball diameter

Min. dimensions

Max. dimensions

Max. weight

b) The maximum component height of 4 mm is only possible with the machine type

SIPLACE TX2i m 4 mm.

2 mm

4 mm

70 µm

30 µm

100 µm

50 µm

120 µm x 120 µm

8.2 mm x 8.2 mm

1 g

2 mm

4 mm

50 µm

25 µm

50 µm

25 µm

80 µm x 80 µm

8.2 mm x 8.2 mm

1 g

c) Due to the small focus area of ±0.3 mm, this camera is only recommended if its specific camera resolu-

tion is required for the components. The requirements for component camera type 49 are achieved in

the ±0.3mm range. The component camera type 49 achieves the performance rating of component cam-

era type 48 in the ±0.6mm range. The nozzle length must be adjusted in accordance with the focus area

and component thickness.

Set-down force 1.3 N ± 0.5 N (default value)

0.5 N to 4.5 N

Touchless Placement

Nozzle types 60xx 60xx

X/Y accuracy

Standard

With "accuracy class"

d) The benchmark and accuracy values are measured during the machine acceptance tests and corre-

spond to the conditions set out in the ASM scope of service and supply.

e) Setting the accuracy class in the SIPLACE Pro Component Shape Editor or Placement Position Editor.

15 µm only possible with PCBs up to a size of 250 mm x 100 mm.

± 25 µm/3

± 20 µm/3

± 15 µm/3

± 25 µm/3

± 20 µm/3

± 15 µm/3

Angular accuracy ± 0.25° / 3 ± 0.25° / 3

Illumination levels 5 5