141-400-57-probestationaccessoriescatalog - 第25页

PN 141-400 www.formfactor.com Cryogenic and Vacuum • 9 Revision 57, February, 2023 Probe Station A ccessories 136 39 7 — U ni ve r sa l Carri er , PMC 200 Feat ur es • For mounting, fixing and hand ling of substrates of …

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PN 141-400 www.formfactor.com Cryogenic and Vacuum • 8
Revision 57, February, 2023 Probe Station Accessories
PMC200 Wafer Carriers
128027 — Wafer Carrier, 200 mm, PMC200
Features
• For mounting, fixing and handling of
SEMI s tand ard 200 mm (8 in) wafers
with FormFactor cryogenic probe
stations
• Mounting outside vacuum chamber
recommended
• Patented mechanical wafer clamping: mechanical clamping from
top by a ring shaped leaf spr ing (top-side wafer contact only at the
edge)
• Contact plate made of nickel/gold coated OFHC copper for best
heat contact between wafer and chuck
• Includes holder for 2 RF calibration substrates
Compatibility
• PMC200
130474 — Wafer Carrier, 150 mm, PMC200
Features
• For mounting, fixing and handling of
SEMI s tand ard 150 mm (6 in) wafers
with FormFactor cryogenic probe
stations
• Mounting outside vacuum chamber
recommended
• Patented mechanical wafer clamping: mechanical clamping from
top by a ring shaped leaf spr ing (top-side wafer contact only at the
edge)
• Contact plate made of nickel/gold coated OFHC copper for best
heat contact between wafer and chuck
• Includes holder for 2 RF calibration substrates
Compatibility
• PMC200
130476 — Wafer Carrier, 100 mm, PMC200
Features
• For mounting, fixing and handling of
SEMI s tandard 100 mm (4 in) wafers
with FormFactor cryogenic probe
stations
• Mounting outside vacuum chamber
recommended
• Patented mechanical wafer clamping: mechanical clamping from
top by a ring s haped leaf spring (top-side wafer contact only at the
edge)
• Contact plate made of nickel/gold coated OFHC copper for be st
heat contact between wafer and chuck
• Includes holder for 2 RF calibration substrates
Compatibility
• PMC200
133758 — Substrate Holder, 4K, PMC200
Features
• For mounting, fixing and handling of
small substrates, maximum size 25 x 25
mm (1 x 1 in), with F ormFactor
cryogenic probe stations. Size and
shape of the substrate needs to be
specified with the order.
• Includes additional cold shield for achieving lowest sample
temperature
• Mounting outside vacuum chamber recommended
• Patented mechanical wafer clamping: mechanical clamping from
top by a clamping mask (top-side substrate contact only at the edge)
• Contact plate made of nickel/gold coated OFHC copper for be st
heat contact between wafer and chuck
Compatibility
• PMC200
PN 141-400 www.formfactor.com Cryogenic and Vacuum • 9
Revision 57, February, 2023 Probe Station Accessories
136397 — Universal Carrier, PMC200
Features
• For mounting, fixing and handling of
substrates of different shapes or
wafers up to 75 mm (3 in) wi th
FormFactor cryogenic probe stations
• Mounting outside vacuum chamber
recommended
• Patented mechanical substrate/wafer clamping: mechanical
clamping from top by a universal cla mping mask (top-side
substrate/wafer contact only at the edge)
• Contact plate made of nickel/gold coated OFHC copper for best
heat contact between wafer and chuck
Specifications
• Maximum substrate dimensions:
– 76.2 mm (3 in) (full wafer)
– 150 mm (6 in) (quartered wafer)
– 76.2 x 76.2 mm (3 x 3 in) or 50 x 110 mm (2 x 4.3 in)
Compatibility
• PMC200
PN 141-400 www.formfactor.com Cryogenic and Vacuum • 10
Revision 57, February, 2023 Probe Station Accessories
PMV200 Wafer Carriers
142361 — Wafer Carrier, 200 mm, HF-Ready, PMV200
Features
• For fixing and handling of wafer, wafer
fragments and single chips
• Mounting outside vacuum chamber
recommended
• Patented mechanical clamping
system: mechanical clamping from top by leaf springs (top-side
substrate/wafer contact only at the edge)
• Contact plate made of nickel/gold coated OFHC copper for good
thermal contact between wafer and chuck
• Includes holder for 2 RF calibration substrates
Specifications
• Maximum substrate dimensions:
– 76.2 mm (3 in) (full wafer)
– 150 mm (6 in) (quartered wafer)
– 76.2 x 76.2 mm (3 x 3 in) or 50 x 110 mm (2 x 4.3 in)
• Temperature range: -60° to +200°C (-76° to +392°F)
Compatibility
• PMV200
142365 — Wafer Carrier, 150 mm, HF-Ready, PMV200
Features
• For mounting, fixing and handling of
SEMI s tand ard 150 mm wafers
• Mounting outside vacuum chamber
recommended
• Patented mechanical clamping
system: mechanical clamping from top by a ring shaped leaf spring
(top-side wafer contact only at the edge)
• Contact plate made of nickel/gold coated OFHC copper for good
thermal contact between wafer and chuck
• Includes holder for 2 HF calibration substrates
Specifications
• Temperature range: -60° to +200°C (-76° to +392°F)
Compatibility
• PMV200
144072 — Universal Carrier, PMV200
Features
• For fixing and handling of wafer, wafer
fragments, and single chips
• Mounting outside vacuum chamber
recommended
• Patented mechanical clamping system:
mechanical clamping from top by leaf s prings (top-side substrate/
wafer contact only at the edge)
• Contact plate made of nickel/gold coated OFHC copper for go od
thermal contact between wafer and chuck
• Includes holder for 2 RF calibration substrates
Specifications
• Maximum substrate dimensions:
– 76.2 mm (3 in) (full wafer)
– 150 mm (6 in) ( quartered wafer)
– 76.2 x 76.2 mm (3 x 3 in) or 50 x 110 mm (2 x 4.3 in)
• Temperature range: -60° to +200°C (-76° to +392°F)
Compatibility
• PMV200
144078 — Wafer Carrier, 100 mm, HF-Ready, PMV200
Features
• For mounting, fixing and handling of
SEMI s tandard 100 mm wafers
• Mounting outside vacuum chamber
recommended
• Patented mechanical clamping system:
mechanical clamping from top by a ring shaped leaf spring (top-
side wafer contact only at the edge)
• Contact plate made of nickel/gold coated OFHC copper for go od
thermal contact between wafer and chuck
• Includes holder for 2 HF calibration substrates
Specifications
• Temperature range: -60° to +200°C (-76° to +392°F)
Compatibility
• PMV200