80S-2080F480F5 - 第11页
SIPLACE 80S-20/F4/F5 User M anual 0 Introduction 05/99 Issue from Software Vers ion SR.405.xx 0.1 General 0 - 7 0.1.2.6 Overvie w of the revi sions in the 0 5/99 edition 0.1.3 The SIPLACE 80S-20 Machine The SIPLA CE 80S-…
0 Introduction SIPLACE 80S-20/F4/F5 User Manual
0.1 General 05/99 Issue from Software Version SR.405.xx
0 - 6
0.1.2.4 Overview of the revisions in the 07/97 edition
0.1.2.5 Overview of the revisions in the 03/98 edition
New functions Affected Chapter / Section
6-nozzle revolver head (all functions) 0; 2; 3; 4; 5; 9; 17
Cover guard on input / output belt 1.2
Display PCB barcode 2; 3; 11
Starting SITEST from user interface
(operation and the range of functions are described
in a separate manual)
2.4.3
Omitting components 3
Approaching the set-up position 4.2.1; 4.3.1
Guidelines for describing case shapes 5.7
What needs to be done...? New chapter 6
Components > 12 mm 10.10
Twin conveyor, fixed left side 11.10
Revised functions Affected Chapter / Section
New breakdown into chapters Chapter 3 to 8 and 10
Overview and technical data, tape feeder modules 10.1
Manual nozzle change 9.5; 9.7
Maintenance of the camera systems 9.9
New nozzle type 8 with contour diagram 17
New functions Affected Chapter / Section
Component vision system for the
6-nozzle revolver head
0; 5
User Interface 2
Empty Tape Cutter on SIPLACE 80F
5
Automatic
Placement Machines
10.8
Surf tape feeder module 10.10
Revised functions Affected Chapter / Section
Introduction 0
Operational safety 1
SIPLACE 80S-20/F4/F5 User Manual 0 Introduction
05/99 Issue from Software Version SR.405.xx 0.1 General
0 - 7
0.1.2.6 Overview of the revisions in the 05/99 edition
0.1.3 The SIPLACE 80S-20 Machine
The SIPLACE 80S-20 placement machine is a modular high-performance placement system with double gan-
try axes and two 12-nozzle revolver heads on one station. While one placement head is taking components
from the feed modules, the other placement head is mounting the components it had just picked up.
The quality of placemdent is assured by means of PCB position recognition and component centering via the
vision system.
It is possible to link input and output units, screen printing units and solder ovens.
The SIPLACE 80S-20 is supplied with the necessary data by a line computer running under the UNIX operat-
ing system. It is also possible to connect up with a higher-level data processing system via this line computer.
0.1.4 The SIPLACE 80F
4
Machine
The SIPLACE 80F
4
placement machine is a modular high-performance placement system with one 12-nozzle
revolver head and one IC head on a single gantry. The revolver head components are mounted first and then
the IC head components.
The quality of placement is assured by PCB position recognition and component centering via the vision sys-
tem.
Optionally a coplanarity laser module or a flip-chip vision module can be installed.
A wafflepack changer may be used to supply the components.
On-line help 8
New coplanarity laser module 1; 5; 9
New nozzles, nozzle contour diagrams 17
Revised functions Affected Chapter / Section
Introduction 0
Operational safety 1
Vision system 5
Component table, mobile 6, 9, 10
New nozzles 17
Revised functions Affected Chapter / Section
0 Introduction SIPLACE 80S-20/F4/F5 User Manual
0.1 General 05/99 Issue from Software Version SR.405.xx
0 - 8
0.1.5 On the SIPLACE 80F
5
automatic placement systems
The SIPLACE 80F
5
automatic placement system is a modular, high performance placement system with a 6-
nozzle revolver head and an IC placement head on a gantry. The components on the revolver head are
inserted first, followed by the components on the IC head. The 6-nozzle revolver head can process the entire
range of components, from the 0603 chip through to the QFP 208, if type 7 or type 8 nozzles are used for this
purpose (see chapter 17). The new optional component vision system (DCA option) can be used to insert flip-
chip components and bare dies up to 13 x 13 mm in size, in addition to standard components.
The placement quality is ensured by the PCB position detection system and the components are centered
using the vision system. The placement system is also now equipped with a new, pneumatically-controlled
tape cutter.
A coplanarity laser module and a flip-chip vision module for the IC head can now be used as optional extras.
A wafflepack changer may be used to supply the components.