80S-2080F480F5 - 第255页
SIPLACE 80S-20/F4/F5 User M anual 5 Vision Func tions 05/99 Issue from Software Version SR .405.xx 5.3 Component Vision System Line en gineer 5 - 23 5.3 Com ponent Vision Syst em The comp onent vis ion syste m records th…
5 Vision Functions SIPLACE 80S-20/F4/F5 User Manual
5.2 PCB Vision System 05/99 Issue from Software Version SR.405.xx
5 - 22 Line engineer
– Correction with two fiducials x-position
y-position
PCB skew
– Correction with three fiducials: ideally the straight lines which each pass through the centers of two
fiducial will be parallel with the x and y axes
x-position
y-position
PCB skew
Shear
Warpage of PCB in the x direction
Warpage of PCB in the y direction
NOTE
You should never position 3 fiducials so that they are located on a straight line.
Spacing between the fiducials
You may locate the fiducials at any point on the board. However, it is a good idea to space the fiducials as
far apart as possible on the two axes. The further apart the fiducials are from one another, the more accu-
rate optical position and angle recognition will be.
SIPLACE 80S-20/F4/F5 User Manual 5 Vision Functions
05/99 Issue from Software Version SR.405.xx 5.3 Component Vision System
Line engineer 5 - 23
5.3 Component Vision System
The component vision system records the precise location of a component by determining on the one hand
the displacement of the center of the component relative to the nozzle’s axis of symmetry and on the other
hand by determining the board’s skew with respect to the relative rotational position of the nozzle. It is also
possible to carry out an analysis of the state of the lead configuration in both the x and y directions.
5.3.1 Component Vision System of the SIPLACE 80S-20 Placement
Machine
5.3.1.1 Description of the System
The component vision system consists of:
l the optical system for component position recognition
Each 12x revolver placement head is equipped with its own component position recognition system in star
station 7 (5 - 6).
l the vision evaluation unit
Each machine is equipped with an evaluation unit for PCB and component position recognition which is
accommodated in the control unit (5 - 7 and Fig. 5.1.7, Page 5 - 10).
A CCD camera with deflection mirror, imaging lens and LED lighting system constitutes the optical component
position recognition system. The effective field of view of the CCD camera (a SONY XC75) amounts to 24 x
24 mm². For position recognition or for leads testing the component is evenly illuminated by the rows of LEDs
in the reflected light process and its sharp image formed by the lens on the CCD chip. Using digital image pro-
cessing methods, the HALE process (H
igh Accuracy Lead Extraction) the parameters are determined for
position, skew and leads condition.
The vision evaluation unit (MVS) has already been described in Section 5.2.1 since it performs the two func-
tions of PCB and component evaluation.
5.3.1.2 Technical Data
Camera type: SONY XC75
Number of pixels: 484 x 484
Field of view: 24 mm x 24 mm
Method of illumination: Reflected light process (red light), 3 LED levels
Image processing: HALE gray scale process (H
igh Accuracy Lead Extraction)
Screen: RGB monitor (VGA mode) 640 x 484 pixels
Component sizes: 0.5 mm x 0.5 mm to 18.7 mm x 18.7 mm
Range of recognizable components : TSOP, LCC, PLCC, QFP, SO series through SO28
basically all components with J and
gull-wing leads, µBGAs
Minimum lead pitch: 0.3 mm for the camera
0.5 mm for the machine
Minimum ball diameter with µBGAs: 250 µm
5 Vision Functions SIPLACE 80S-20/F4/F5 User Manual
5.3 Component Vision System 05/99 Issue from Software Version SR.405.xx
5 - 24 Line engineer
5.3.1.3 Description of Function
One segment of the 12x placement head picks up a component at the star station 1. As the star advances and
further components are picked up. Star station 7 accommodates the optical unit of the component vision sys-
tem. Once it has arrived three staggered rows of LEDs evenly illuminate the component with red light. The
lens forms a sharp image of components up to a height of 5 mm on the camera’s CCD chip.
The digital component imaging generated by the component camera is transmitted to the vision evaluation
unit. Using digital image processing (HALE process) the evaluation unit compares the image of the compo-
nent with a synthetic model previously generated in the GF editor (the package form editor). The parameters
obtained from this yield information on positional deviations, leads condition and component re-identification.
The HALE process has proved to be highly resistant to interference factors such as unwanted reflections, dif-
fused light influences and so on. It is faster and more accurate than the matching method. Once measure-
ment has been completed the segment rotates the component in star station 9 into the correct orientation for
placement. In star station 1 the component is then inserted in its correct position on the board.
5.3.2 Component Vision System in the SIPLACE 80 F
4
Placement
Machine
5.3.2.1 System Description
The component vision system consists of
the optical system for component position recognition.
The
12x revolver placement head
is equipped with a component position recognition system in star station
7 (5 - 6).
For the
IC placement head
, up to two component vision systems can be used. These are fixed onto the
base of the machine (5 - 9). One is used for optical centering of conventional components with pin connec-
tions. The other - with an FC sensor, optically centers flip-chips (see 'Measure Component Option', Page
5 - 92).
the vision evaluation unit
The evaluation unit for PCB and component position recognition is accommodated in the control unit (5 -
10).