80S-2080F480F5 - 第394页

5 Vision Functions SIP LACE 80S-20/F4/F5 Us er Manual 5.9 Teach Fiducial: Additions with the 80F4 or 80F5 Machines 05/99 Issue from Software Version SR.405.xx 5 - 162 Line en gineer

SIPLACE 80S-20/F4/F5 User Manual 5 Vision Functions

05/99 Issue from Software Version SR.405.xx 5.9 Teach Fiducial: Additions with the 80F4 or 80F5 Machines

Line engineer 5 - 161

5.9

Teach Fiducial

: Additions with the 80F

or 80F

Machines

In contrast to the 80S-20 placement machine the 80F

or 80F

machine is a single-gantry machine. For this

reason in the

Teach fiducial

menu the

Select gantry

option is permanently set to

Gantry 1

. The

Gantry 2

option cannot be clicked on.

The IC placement head is mounted on the gantry, together with the 12x revolver placement head on the 80F

and the 6x revolver placement head on the 80F

automatic placement machines. The camera system for

board centering is accommodated on the gantry underside.

All menus with the exception of this option are identical to those of the 80S-20 machine.

A description of the menus and their options will be found in Section 5.5 from Page 5 - 37.

Fig. 5.9.1

Select fiducial

menu,

Select gantry

option

5 Vision Functions SIPLACE 80S-20/F4/F5 User Manual

5.9 Teach Fiducial: Additions with the 80F4 or 80F5 Machines 05/99 Issue from Software Version SR.405.xx

5 - 162 Line engineer

SIPLACE 80S-20/F4/F5 User Manual 5 Vision Functions

05/99 Issue from Software Version SR.405.xx 5.10 Test Component: Supplements to the 80F4 or 80F5 Machines

Line engineer 5 - 163

5.10

Test Component

: Supplements to the 80F

or 80F

Machines

On the 80F

or 80F

automatic placement machines, you can optically center fine-pitch components with a

maximum edge length of up to 55 mm with the IC camera. Components with an edge length exceeding

32 mm, multiple measurement is employed. In addition, you can also optically center BGAs using the IC sen-

sor.

Multiple measurement will be launched each time you access the

Measure component

Test component

options.

The following conditions apply to multiple measurement:

1. The number of measurements to be carried out will be determined by the MVS system using a particular

algorithm. The component size and tolerance values will, for example, be input into this algorithm.

2. In the MVS system the combination of different measurement methods will be specified. You will not be

able to change the combination of methods nor the hex parameters.

With the FC camera you can optically center fine-pitch components and flip-chips.

As regards information on and definitions of BGAs, flip-chips and their measurement methods see Section

5.6.4.4, Page 5 - 92.

For information on the ball model description see Section 5.6.4.11 from Page 5 - 108.

In the

Measuring mode

menu (see Section 5.6.4.13, Page 5 - 114), you can select and activate different

measuring methods and modify the associated measuring parameter values.

Safety information on the component vision systems of the 80F

or 80F

machines

DANGER

You must not make any modifications whatsoever to or tamper with the safety features of the 80F

or 80F

machines or the IC or flip-chip modules.

The optical range of the IC and flip-chip camera conforms to laser class 1, provided that the camera is perma-

nently fixed in the automatic placement system and that the protective covers are closed (EN 60825-1 and

IEC 825).

Fig. 5.10.1 Identification label for Laser class 1

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