SIPLACE Vision Customer_en - 第12页

Introduction Component Centering Nozzle Scan S tudent Guide SIPLACE V ision (Customer) Introduction Edition 12/2008 EN 12 3.2 Component Centering Optical component centering targets  Determination of the exact componen …

Introduction

Board Centering and Inkspot Recognition

Student Guide SIPLACE Vision (Customer)

Edition 12/2008 EN Introduction

3Introduction

SIPLACE Vision is the new image processing system for analyzing optical centering (CO and board

centering, feeder position) and other test (inkspots, nozzle scanning). Machines using the older ICOS

system can also be operated with the same SIPLACE Pro CS database.

3.1 Board Centering and Inkspot Recognition

SIPLACE Vision provides a board centering system with nine synthetic fiducial types. Users will normally

find a suitable fiducial type among these. Simply specify the required fiducial type, contrast and

dimensions (size and tolerances) to begin the teaching procedure at the station. There is then no need

for further fiducial teaching in this case.

A fiducial wizard for simple, guided fiducial teaching has been available since SW version 604.

However, if the fiducial to be used for the board does not correspond with any of the predefined synthetic

fiducial types, users will need to teach the system an additional fiducial template (e.g. triangle or PCB

track structure).

Optical board centering targets

 Determination of exact board position and board distortion.

 Recognition of boards with bad fiducial quality - these are then sorted out and ignored by the

placement process.

Background: Bad fiducial quality usually results in a poor pad image, since these are produced in the

same production step. The corresponding boards may then show electrical faults.

Inkspot recognition

Inkspot recognition enables users to differentiate between two cases:

 Good: Board or panel placement will be performed.

 Bad: Board or panel placement will not be performed.

For rapid inkspot recognition, users need to define a synthetic good inkspot.

Alternatively, users could teach one good inkspot and one bad inkspot.

Introduction

Component Centering Nozzle Scan

Student Guide SIPLACE Vision (Customer)

Introduction Edition 12/2008 EN

3.2 Component Centering

Optical component centering targets

 Determination of the exact component position.

 Optical inspection of the components, in order to sort out and reject poor quality components from

the placement process. This applies to components which are outside the tolerance range or which

have bent leads. For the component shape (CS) teaching or test procedure, this means that

the error situation needs to be simulated and reliably recognized by the Vision system.

 Placement of the components recognized as good in the best possible placement position (best X/

Y position and optimum placement angle).

When you assign the component to one of the basic component shapes in SIPLACE Vision, the system

sets the optimum analyzing algorithm and type-specific illumination for that component. To achieve

reliable component recognition, enter the geometric description of the component shape in SIPLACE

Pro, as specified in the data sheet or teach the component shape with the camera at the station (since

SR/MC 603.01 this is also possible with a CS wizard tool).

Should a problem arise, the setter will be asked to check the component shape geometry, in order to

reestablish the reliability of the component recognition function.

Should a real problem arise, you can generate an analysis/results log for the fiducials and component

shapes. This log contains the relevant fiducial or component shape data, including the camera images

recorded.

Send this log to the SIEMENS Service team for advice and to improve your data results.

3.3 Machine Tests with Cameras

SIPLACE Vision can also be used to check the machine state. The following functions are currently

enabled here:

3.3.1 Nozzle Scan

 Nozzles for small components are optically

scanned for contaminants during the

reference run for the C&P head, after

placement of the first board and after 350 head

cycles (at the end of the board), respectively.

– If a defect is detected after evaluation of

the camera image, the system will report

Nozzle dirty here.

– If the vacuum duct is contaminated inside,

at the nozzle tip, the vacuum

measurement test will recognize this and

report Vacuum channel polluted.

The adjacent diagram shows outline recognition of

a normal nozzle tip.

Introduction

Feeder Position Recognition Camera Overview

Student Guide SIPLACE Vision (Customer)

Edition 12/2008 EN Introduction

3.3.2 Feeder Position Recognition

SIPLACE Vision performs feeder position recognition directly before placement begins. The procedure

measures various feeder-specific system fiducials or geometric data for tape pockets, to determine the

actual component pickup position for the respective feeder track.

 Before placement begins for a new job, the new X-series component tables are measured with the

PCB camera, by optically centering two fiducials per location.

 The two table fiducials are also measured for these tables. These values are used to calculate the

pickup position of each feeder.

 When using components which are smaller than 1.0x0.5 mm (0402), the system measures the

empty tape pockets for the respective track, directly before the pickup position.

3.4 Camera Overview

Overview of component cameras in placement head

Parameters C&P20

Camera

C&P12

Camera

Standard

C&P12

camera

0603 mm

(0201) ‚HR’

C&P12

camera

0402 mm

(01005)

C&P6

Camera

For placement head C&P20 DLM2 12 DLM2 12 HR DLM2 12

01005 option

(D series)

DLM2

C&P6

SST 23 28 29 38 29

Resolution [µm] 17 50 26 18 26

Field of [mm²] 8 x 8 24.5 x 24.5 24.5 x 24.5 20 x 20 32 x 32

Min. CO size [mm²] 0.2 x 0.2 0.5 x 0.5 0.3 x 0.3 0.2 x 0.2 0.5 x 0.5

Suitable for min. CHIP size 01005 0402 0201 01005 0402

Max. CO size [mm²] 6 x 6 18.7 x 18.7 18.7 x 18.7 16 x 16 27 x 27

Min. lead pitch [µm] 300 400 300 100 300

Min lead width [µm] 100 200 150 100 150

Min. ball pitch [µm] 400 450 250 250 300 (350 if

component >

18 mm)

Min. ball [µm] 200 250 140 140 150 (200 if

component >

18 mm)

Illumination levels

(programmable)

(5)

(6)

Teaching /centering the

component presentation

angle

In 0° / 90°

steps

/ placement

angle

In 0° / 90°

steps

/ pickup angle

In 0° / 90°

steps

/ pickup angle

In 0° / 90°

steps

/ pickup angle

In 0° / 90°

steps

/ pickup angle