Protecto_Serie_EN - 第8页

8 More than “just” coating Application possibilities with Protect oXP/XC Dam & Fill allows individual areas to be selectively coated on the circuit board, thereb y efciently pr otect - ing them. Two materials with d…

Greatest possible process reliability

with innovative options

When it comes to coating, one thing is essential: precision.

Protecto systems are designed to ensure that the required

volume of coating is always evenly applied, whether

through a pressure valve, a cartridge or a pump from the

original container. Automatic needle measurement checks

the target position of the applicators in freely denable

cycles and if necessary corrects the coating program au-

tomatically. The dispensing of the lacquer is controlled by

the software, which loads the appropriate coating program

with the suitable lacquer and nozzle type. An optional heat-

ed nozzle keeps the protective coating always at a constant

temperature and thus a consistent viscosity regardless of

environmental conditions. A specially developed lacquer

lance with a level indicator prevents bubble formation when

changing the lacquer.

For absolute process reliability Protecto systems are

optionally equipped with a ducial camera. This means the

coating program can be corrected and coated in the correct

positionby registering the marks even if a board is laid into

the flight bar inaccurately. A barcode checks whether the

set coating program is right for the assembly in place. If

there is a deviation the process is automatically blocked.

A high-precision weighing cell is optionally available for the

Protecto systems, which compares the weight of the paint

applied by any given applicator with a previously dened

setpoint value and provides the user with corresponding

feedback in the setup mode as well as cyclically during

series production. As a result, errors in the fluid circuit can

be easily and efciently detected, and eliminated without

delay. The acquisition of weight data, as well as congu-

ration and adjustment, are software controlled and can be

individually adapted.

1. Needle measuring cross with auto-correction, 2. Jetter-heating, 3. Fiducial camera (Screen overview), 4. Weighing cell

More than “just” coating

Application possibilities with ProtectoXP/XC

Dam & Fill allows individual areas to be selectively

coated on the circuit board, thereby efciently protect-

ing them. Two materials with different viscosities are

used for this purpose. First, a dam is placed around

the component to be protected with a highly viscous

material. If a UV-curing material is used, this can be

cured directly using a suitable UV spot (only XP). Sub-

sequently, the component can be cast in the same

operation with a low-viscosity material.

In this process, a 1K or 2K (only XP) material is ap-

plied to a component such that a continuous and uni-

form sealing loop is produced. Volumetric applicators

(only XP) are particularly suitable for this purpose.

A Globe Top is used to protect a selective area on

the circuit board. For this purpose, a material is used

which, on the one hand, is fluid enough to securely

encapsulate all the components involved, but on the

other hand, is not so low in viscosity that it flows

onto adjacent components.

Dam & Fill / 3D-Application

Sealing

Globe Top

With the Protecto systems, completely new application

elds are emerging – even outside of the conformal coating

sector. Thanks to the highly flexible system construction,

you can use ProtectoXC to combine for two and ProtectoXP

for four processes within one machine. In addition to

sealing the entire circuit board, partial areas or individual

components can also be coated on the support. From the

“Globe Top” to “Dam & Fill” to the “Flip Chip Underll”; diverse

applications arised. With innovative nozzle technology, the

user can apply a wide variety of materials to the module – so

each product will be optimally protected later according to

the requirements.

XP XC

Encapsulation is always used when a particularly

high level of protection is needed. Thanks to the

volumetric applicators, it is ensured that exactly the

same amount of material is always supplied in the

correct mixing ratio, independent of temperature and

pressure fluctuations.

Underlls increase the mechanical stability between

the chip and the circuit board and distribute locally

occurring voltages over a larger area, which signif-

icantly increases the service life. For this purpose,

a low-viscosity material is applied along the edge

region of the chip, which then independently lls the

gap between the chip and the circuit board using the

capillary effect.

Due to the constant miniaturisation in electronics, less

and less surface is available for heat dissipation. This

makes it all the more important to have an optimal

passage between the heat sink and the component.

Liquid heat-transfer media can be adapted to the

individual contours better than xed pads or foils and

ensure a safe heat dissipation, which signicantly

increases the service life of the components.

Are you looking for a partner who can offer you a

complete solution for your coating and dispens-

ing process? Then you‘ve come to the right place!

Thanks to versatile applicators and conveyor units,

we are standing ready to meet many requirements

with our standard applications. We are also prepared

to tackle new challenges and to implement them for

you in a series-production process.

2K Encapsulation

Flip Chip Underll

Heat dissipation

Individual requirements

XP XC