Protecto_Serie_EN - 第9页

9 Encapsulation is always used when a particularly high level of protection is needed. Thanks t o the volumetric applicators, it is ensured that exactly the same amount of material is always supplied in the correct mixin…

More than “just” coating

Application possibilities with ProtectoXP/XC

Dam & Fill allows individual areas to be selectively

coated on the circuit board, thereby efciently protect-

ing them. Two materials with different viscosities are

used for this purpose. First, a dam is placed around

the component to be protected with a highly viscous

material. If a UV-curing material is used, this can be

cured directly using a suitable UV spot (only XP). Sub-

sequently, the component can be cast in the same

operation with a low-viscosity material.

In this process, a 1K or 2K (only XP) material is ap-

plied to a component such that a continuous and uni-

form sealing loop is produced. Volumetric applicators

(only XP) are particularly suitable for this purpose.

A Globe Top is used to protect a selective area on

the circuit board. For this purpose, a material is used

which, on the one hand, is fluid enough to securely

encapsulate all the components involved, but on the

other hand, is not so low in viscosity that it flows

onto adjacent components.

Dam & Fill / 3D-Application

Sealing

Globe Top

With the Protecto systems, completely new application

elds are emerging – even outside of the conformal coating

sector. Thanks to the highly flexible system construction,

you can use ProtectoXC to combine for two and ProtectoXP

for four processes within one machine. In addition to

sealing the entire circuit board, partial areas or individual

components can also be coated on the support. From the

“Globe Top” to “Dam & Fill” to the “Flip Chip Underll”; diverse

applications arised. With innovative nozzle technology, the

user can apply a wide variety of materials to the module – so

each product will be optimally protected later according to

the requirements.

XP XC

Encapsulation is always used when a particularly

high level of protection is needed. Thanks to the

volumetric applicators, it is ensured that exactly the

same amount of material is always supplied in the

correct mixing ratio, independent of temperature and

pressure fluctuations.

Underlls increase the mechanical stability between

the chip and the circuit board and distribute locally

occurring voltages over a larger area, which signif-

icantly increases the service life. For this purpose,

a low-viscosity material is applied along the edge

region of the chip, which then independently lls the

gap between the chip and the circuit board using the

capillary effect.

Due to the constant miniaturisation in electronics, less

and less surface is available for heat dissipation. This

makes it all the more important to have an optimal

passage between the heat sink and the component.

Liquid heat-transfer media can be adapted to the

individual contours better than xed pads or foils and

ensure a safe heat dissipation, which signicantly

increases the service life of the components.

Are you looking for a partner who can offer you a

complete solution for your coating and dispens-

ing process? Then you‘ve come to the right place!

Thanks to versatile applicators and conveyor units,

we are standing ready to meet many requirements

with our standard applications. We are also prepared

to tackle new challenges and to implement them for

you in a series-production process.

2K Encapsulation

Flip Chip Underll

Heat dissipation

Individual requirements

XP XC

Intuitive and easy-to-use controls make the VICON Protecto the ideal software solution.

Smart software for

efcient processes

With ViCON, Rehm offers the optimal software solution for its systems – ECAD data import

possible with ProtectoXP and ProtectoXC

A variety of analysis tools, more productivity, efciency, flexible working and the highest

quality: With ViCON, Rehm Thermal Systems has designed and created software that

meets all the requirements of modern, networked, and above all, future-orientated elec-

tronics manufacturing. Alongside the use of touch operating elements and gestures, the

new organisation of menu options and control panels, the core feature of ViCON software’s

development lies in the option of accessing the software from a variety of devices. The

ProtectoXP and ProtectoXC dispensing systems are equipped with the ViCON Protecto

system software and have numerous features for easy program creation for reproducible

coating results.