IPC-A-610E CN2010年4月 - 第22页
ANSI/ESD S8.1 ESD Awareness Symbols ANSI/ESD-S-20.20 Protection of Electrical and Elec- tronic Parts, Assemblies and Equipment EIA-471 Symbol and Label for Electrostatic Sensitive Devices IEC/TS 61340-5-1 Protection of E…
The following documents of the issue currently in effect form a part of this document to the extent specified herein.
关于以下文件是否有其他语言的翻译版本，请咨询IPC。
IPC-HDBK-001 Handbook & Guide to Supplement J-STD-
001
IPC-T-50 Terms and Definitions for Interconnecting and
Packaging Electronic Circuits
IPC-CH-65 Guidelines for Cleaning of Printed Boards and
Assemblies
IPC-D-279 Design Guidelines for Reliable Surface Mount
Technology Printed Board Assemblies
IPC-D-325 Documentation Requirements for Printed Boards
IPC-A-600 Acceptability of Printed Boards
IPC/WHMA-A-620 Requirements & Acceptance for Cable
& Wire Harness Assemblies
IPC-AI-641 User’s Guidelines for Automated Solder Joint
Inspection Systems
IPC-AI-642 User’s Guidelines for Automated Inspection of
Artwork, Inner-layers, and Unpopulated PWBs
IPC-TM-650 Test Methods Manual
IPC-CM-770 Component Mounting Guidelines for Printed
Boards
IPC-SM-782 Surface Mount Design Land Pattern Standard
IPC-SM-785 Guidelines for Accelerated Reliability Testing
of Surface Mount Attachments
IPC-AJ-820 Assembly & Joining Handbook
IPC-CC-830 Qualification and Performance of Electrical
Insulating Compound for Printed Board Assemblies
IPC-HDBK-830 Guidelines for Design, Selection and
Application of Conformal Coatings
IPC-SM-840 Qualification and Performance of Permanent
Solder Mask
IPC-2220 Family of Design Documents
IPC-7095 Design and Assembly Process Implementation for
BGAs
IPC-7351 Generic Requirements for Surface Mount Design
and Land Pattern Standard
IPC-6010-Series Family of Board Performance Docu-
ments
IPC-7711/7721 Rework, Repair and Modification of Elec-
tronic Assemblies
IPC-9691 User Guide for the IPC-TM-650, Method 2.6.25,
Conductive Anodic Filament (CAF) Resistance Test (Electro-
chemical Migration Testing)
IPC-9701 Performance Test Methods and Qualification
Requirements for Surface Mount Solder Attachments
IPC J-STD-001 Requirements for Soldered Electrical and
Electronic Assemblies
IPC/EIA J-STD-002 Solderability Tests for Component
Leads, Terminations, Lugs, Terminals and Wires
IPC/EIA J-STD-003 Solderability Tests for Printed
Boards
J-STD-004 Requirements for Soldering Fluxes
IPC/JEDEC J-STD-020 Moisture/Reflow Sensitivity
Classification for Plastic Integrated Circuit Surface Mount Devices
IPC/JEDEC J-STD-033 Standard for Handling, Pack-
ing, Shipping and Use of Moisture Sensitive Surface Mount
Devices
ECA/IPC/JEDEC J-STD-075 Classification of Non-IC
Electronic Components for Assembly Processes
1. www.ipc.org
2. www.ipc.org
2 适⽤⽂件
2 适⽤⽂件
2.1 IPC标准
1
2-1IPC-A-610E-2010
2010年4月
2.2 联合⼯业标准
2
SINGLE USER LICENSE - NOT FOR USE ON A NETWORK OR ONLINE
ANSI/ESD S8.1 ESD Awareness Symbols ANSI/ESD-S-20.20 Protection of Electrical and Elec-
tronic Parts, Assemblies and Equipment
EIA-471 Symbol and Label for Electrostatic Sensitive
Devices
IEC/TS 61340-5-1 Protection of Electronic Devices from
Electrostatic Phenomena - General Requirements
ASTM E29 Standard Practice for Using Significant Digits in
Test Data to Determine Conformance with Specifications
Bob Willis Package on Package (PoP) STACK Pack-
age Assembly
3. www.esda.org
4. www.iec.ch
5. www.eia.org
6. www.astm.org
7. www.ASKbobwillis.com
2 适⽤⽂件
2.3 EOS/ESD协会标准
3
2-2 IPC-A-610E-2010
2010年4月
2.4 电⼦⼯业联合会标准
4
2.6 美国材料与测试协会
6
2.7 技术出版物
7
2.5 国际电⼯委员会标
5
SINGLE USER LICENSE - NOT FOR USE ON A NETWORK OR ONLINE
本文包括以下内容：
3.1 EOS／ESD的预防
3.1.1 电气过载（EOS）
3.1.2 静电释放（ESD）
3.1.3 警告标识
3.1.4 防护材料
3.2 EOS／ESD安全⼯作台／EPA
3.3 操作注意事项
3.3.1 指南
3.3.2 物理损伤
3.3.3 污染
3.3.4 电子组件
3.3.5 焊接后
3.3.6 手套与指套
3 电⼦组件的操作
电⼦组件的防护 – EOS／ESD和其它操作注意事项
3-1IPC-A-610E-2010
2010年4月
SINGLE USER LICENSE - NOT FOR USE ON A NETWORK OR ONLINE