IPC-A-610E CN2010年4月 - 第8页

特别鸣谢 对于以下提供本修订版中所用的照片和图片的成员表示特别的感谢。 Constantino Gonzalez, ACME Training & Consulting Darrin Dodson, Alcatel-Lucent Daniel Foster, Defense Acquisition Inc. Jack Zhao, Emerson Network Power Co. Ltd. He DaPeng, Huawei T…

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Steven Herrberg, Raytheon Systems Company
Paula Jackson, Raytheon Systems Ltd.
Marcin Sudomir, RENEX
Beverley Christian, Research In Motion Limited
David Adams, Rockwell Collins
David Hillman, Rockwell Collins
Beverly MacTaggart, Rockwell Collins
Douglas Pauls, Rockwell Collins
Gaston Hidalgo, Samsung Telecommunications America
Richard Henrick, Sanmina-SCI
Omar Karin Hernandez R., Sanmina-SCI
Brent Sayer, Schlumberger Well Services
Dan Kelsey, Scienscope International Corporation
Luis Francisco Sanchez, Scienscope International Corporation
Finn Skaanning, Skaanning Quality & Certification-SQC
Bob Willis, SMART Group
Terry Clitheroe, Solder Technologies
Roger Bell, Space Systems/Loral
Jennifer Day, Stanley Associates
Frank Hules, Stellar Microelectronics Inc.
Mel Parrish, STI Electronics
Patricia Scott, STI Electronics
Bee-Eng Sarafyn, Strataflex Corporation
Karl Sauter, Sun Microsystems, Inc.
Julio Martinez J., Symmetricom
Tracy Clancy, Technical Training Center
Cary Schmidt, Teknetix Inc.
Bruce Hughes, U.S. Army Aviation & Missile Command
Sharon Ventress, U.S. Army Aviation & Missile Command
Constantin Hudon, Varitron Technologies Inc.
Denis Barbini, Vitronics Soltec
David Zueck, Western Digital Corporation
Lionel Fullwood, WKK Distribution Ltd.
Steven Sauer Xetron Corp.
IPC-A-610技术组成员 (7-31bCN)
Jack Zhao, Emerson Network Power Co. Ltd.
Wang Renhua, Jabil Circuit (Shanghai)
Zhang Yuan, Huawei Technologies Co., Ltd.
He Yun, Manson Engineering Ind. Ltd.
Li Liyi, Jabil Circuit (Shanghai)
Zhou Huiling, Huawei Technologies Co., Ltd.
He Dapeng, Huawei Technologies Co., Ltd.
Jia Bianfen, ZTE CORPORATION
Tang Xuemei, ZTE CORPORATION
Luo Jinsong, Shenzhen KAIFA Technology Co., Ltd.
Charlie Zhao, Emerson Network Power Co. Ltd.
IPC-A-610技术组成员 (7-31bND)
Turi Bach Roslund, Bang & Olufsen A/S
Keld Maaløe, BB Electronics A/S
Benny N. Nilsson, Ericsson AB
Oluf Richard Cramer, Flextronics A/S
Mona Johannesen, Flextronics A/S
Jesper Konge, Gåsdal Bygningsindustri A/S
Michael Lassen, Grundfos A/S
Palle Lund Pedersen, Grundfos A/S
Svein Kolbu, Hadeland Produkter
Jens Andersen, HYTEK
Alex Christensen, HYTEK
Christian Houmann, HYTEK
Poul Juul, HYTEK
Anny Benthe Emmerud, Kongsberg Defence &
Aerospace AS
Gregers Dybdal, Linak A/S
Mari Pääkkönen, Nokia Siemens Networks Oy
Torgrim Nordhus, Norautron AS
Jens R. Gøttler, OJ Electronics A/S
Finn Skaanning, Skaanning Quality & Certification
Kai-Lykke Mathiasen, Styromatic A/S
Brian Jakobsen, Terma A/S
Michael Poulsen, Terma A/S
Torben Kruse, Vestas Control Systems A/S
Jan Vindvik, WesternGeco
鸣谢（续）
vIPC-A-610E-2010
2010年4月
SINGLE USER LICENSE - NOT FOR USE ON A NETWORK OR ONLINE
特别鸣谢
对于以下提供本修订版中所用的照片和图片的成员表示特别的感谢。
Constantino Gonzalez, ACME Training & Consulting
Darrin Dodson, Alcatel-Lucent
Daniel Foster, Defense Acquisition Inc.
Jack Zhao, Emerson Network Power Co. Ltd.
He DaPeng, Huawei Technologies Co.,LTD.
Zhou HuiLing, Huawei Technologies Co.,LTD.
Zhang Yuan, Huawei Technologies Co.,LTD.
Alex Christensen, HYTEK
Donald McFarland, Inovar, Inc.
Luca Moliterni, Istituto Italiano della Saldatura
Wang Renhua, Jabil Circuit, Shanghai
Nancy Bullock-Ludwig, Kimball Electronics Group
Norma Moss, L-3 Communications
Blen Talbot, L-3 Communications
C. Don Dupriest, Lockheed Martin Missiles and Fire Control
Linda Woody, Lockheed Martin Missile & Fire Control
Hue Green, Lockheed Martin Space Systems Company
He Yun, Manson Engineering Industrial, Ltd.
Bill Kasprzak, Moog Inc.
Mari Päällönen, Nokia Siemens Networks Oy
Peggi Blakley, NSWC Crane
Ken Moore, Omni Training Corp.
1
Rob Walls, PIEK International Education Centre BV
Julie Pitsch, Plexus Corp.
Kathy Johnston, Raytheon Missile Systems
Marcin Sudomir, RENEX
David Hillman, Rockwell Collins
Douglas Pauls, Rockwell Collins
Bob Willis, SMART Group
2
Jennifer Day, Stanley Associates
Mel Parrish, STI Electronics
Patricia Scott, STI Electronics
Bee-Eng Sarafyn, Strataflex Corporation
Karl Sauter, Sun Microsystems, Inc.
Philipp Hechenberger, TridonicAtco GmbH & Co KG
IPC 7-31bCN亚州技术组参与IPC-A-610E英⽂版及中⽂版开发的主要成员
张源 华为技术有限公司
周慧玲 华为技术有限公司
何大鹏 华为技术有限公司
曹曦 华为技术有限公司
贺云 美迅工程实业有限公司
李礼义 捷普科技（上海）有限公司
罗劲松 深圳长城开发科技股份有限公司
赵文彬 刻意创键计算机配套设备（上海）有限公司
赵洪利 艾尼克斯电子(北京)有限公司
陈彦奇 宜特科技(昆山)电子有限公司
张晓燕 伟创力电子技术(苏州)有限公司
周冠军 BB电子（苏州）有限公司
高 云 捷普科技（上海）有限公司
方 意 捷普科技（上海）有限公司
孙全刚 捷普科技（上海）有限公司
涂运骅 华为技术有限公司
龚岳曦 华为技术有限公司
唐雪梅 中兴通讯股份有限公司
贾变芬 中兴通讯股份有限公司
曹艳玲 上海贝尔阿尔卡特有限公司
赵松涛 深圳市易思维科技有限公司
刘志杰 北京鼎汉技术股份有限公司
赵英军 艾默生网络能源有限公司
1. Figures 3-4, 3-5, 5-18, 5-40, 6-19, 6-22, 6-24, 6-46, 6-68, 6-72, 6-73, 6-86,
6-87, 6-96, 6-100, 6-101, 6-102, 6-103, 6-104, 6-107, 6-108, 6-109, 6-110,
6-111, 6-113, 6-114, 6-115, 6-117, 6-118, 6-119, 6-123, 6-124, 7-17, 7-28,
7-32, 7-84, 7-92, 7-95, 8-171, 8-172 are © Omni
Training, used by permission.
2. Figures 5-50, 8-59, 8-66, 8-95, 8-135, 8-164, 8-165, 8-166, 8-167, 8-168,
8-169, and 11-22 are © Bob Willis, used by permission.
鸣谢（续）
vi IPC-A-610E-2010
2010年4月
SINGLE USER LICENSE - NOT FOR USE ON A NETWORK OR ONLINE
1前⾔............................................................. 1-1
1.1 范围 ......................................................... 1-1
1.2 ⽬的 ......................................................... 1-3
1.3 分级 ......................................................... 1-3
1.4 对要求的说明 ......................................... 1-3
1.4.1 验收条件 .......................................... 1-3
1.4.1.1 目标条件 .......................................... 1-3
1.4.1.2 可接受条件 ...................................... 1-4
1.4.1.3 缺陷条件 .......................................... 1-4
1.4.1.3.1 处置 .................................................. 1-4
1.4.1.4 制程警示条件 .................................. 1-4
1.4.1.4.1 制程控制方法 .................................. 1-4
1.4.1.5 组合情况 .......................................... 1-4
1.4.1.6 未涉及情形 ...................................... 1-4
1.4.1.7 特殊设计 .......................................... 1-4
1.5 术语和定义 ............................................. 1-4
1.5.1 板面方向 .......................................... 1-4
1.5.1.1 *主面 .................................................. 1-5
1.5.1.2 *辅面 .................................................. 1-5
1.5.1.3 焊接起始面 ...................................... 1-5
1.5.1.4 焊接终止面 ...................................... 1-5
1.5.2 *冷焊接连接 ...................................... 1-5
1.5.3 电气间隙 .......................................... 1-5
1.5.4 高电压 .............................................. 1-5
1.5.5 通孔再流焊 ...................................... 1-5
1.5.6 *浸析 .................................................. 1-5
1.5.7 弯月
形涂层（元器件） ..................
1-5
1.5.8 *非功能盘 .......................................... 1-5
1.5.9 针插焊膏 .......................................... 1-5
1.5.10 线径 .................................................. 1-5
1.5.11 导线过缠绕 ...................................... 1-5
1.5.12 导线重叠 .......................................... 1-5
1.6 图例与图⽰ ............................................. 1-5
1.7 检查⽅法 ................................................. 1-5
1.8 尺⼨鉴定 ................................................. 1-6
1.9 放⼤装置 ................................................. 1-6
1.10 照明 ....................................................... 1-6
2 适⽤⽂件 ..................................................... 2-1
2.1 IPC标准 ................................................... 2-1
2.2 联合⼯业标准 ......................................... 2-1
2.3 EOS/ESD协会标准 ................................ 2-2
2.4 电⼦⼯业联合会标准 ............................. 2-2
2.5 国际电⼯委员会标准 ............................. 2-2
2.6 美国材料与测试协会 ............................. 2-2
2.7 技术出版物 ............................................. 2-2
3 电⼦组件的操作 ......................................... 3-1
3.1 EOS/ESD的预防 .................................... 3-2
3.1.1 电气过载（EOS） .............................. 3-3
3.1.2 静电释放（ESD） .............................. 3-4
3.1.3 警告标识 ............................................. 3-5
3.1.4 防护材料 ............................................. 3-6
3.2 EOS/ESD安全⼯作台/EPA ................... 3-7
3.3 操作注意事项 ......................................... 3-9
3.3.1 指南 ..................................................... 3-9
3.3.2 物理损伤 ........................................... 3-10
3.3.3 污染 ................................................... 3-10
3.3.4 电子组件 ........................................... 3-10
3.3.5 焊接后 ............................................... 3-11
3.3.6 手套与指套 .......................................
3-12
4 机械组装 ..................................................... 4-1
4.1 机械零部件的安装 ................................. 4-2
4.1.1 电气间隙 ............................................. 4-2
4.1.2 妨碍 ..................................................... 4-3
4.1.3 散热装置 ............................................. 4-3
4.1.3.1 绝缘垫和导热复合材料 ..................... 4-3
4.1.3.2 接触 ..................................................... 4-5
4.1.4 螺纹紧固件 ......................................... 4-6
4.1.4.1 扭矩 ..................................................... 4-8
4.1.4.2 导线 ..................................................... 4-9
⽬录
viiIPC-A-610E-2010
2010年4月
SINGLE USER LICENSE - NOT FOR USE ON A NETWORK OR ONLINE