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A MILESTONE FOR ADV ANCED P ACKAGING AND HIGH-DENSITY APPLICA TIONS With the SIPLACE TX micron, you run advanced packaging and high-den- sity applications with the performance of state-of-the-art SMT technology (up to 96…

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ENABLING THE DIGITAL WORLD
SIPLACE TX micron
The new standard in advanced production
A MILESTONE FOR ADVANCED PACKAGING
AND HIGH-DENSITY APPLICATIONS
With the SIPLACE TX micron, you run advanced packaging and high-den-
sity applications with the performance of state-of-the-art SMT technology
(up to 96,000 cph) and unprecedented precision. Three precision classes
in a single machine: 25, 20 and 15 µm @ 3 σ with placement pitches of as
little as 50 µm. The performance and upgradeability of the SIPLACE TX
micron protect your investment.
Smart features such as die crack inspection and die chipping detection
ensure the highest yields and maximum productivity.
FASTER AND MORE ACCURATE
SIPLACE TX micron
SIPLACE SpeedStar
Component spectrum: 0201metric to
8.2 mm × 8.2 mm × 4 mm
For the most sensitive components:
Thin dies with heights up to 50 µm
(minimum height)
Extremely fast: Up to 48,000 cph
Extremely precise: Up to ±15 µm @ 3 σ
SIPLACE MultiStar
Switches from pick-and-place to
collect-and-place to mixed mode
based on software commands
Component spectrum: 0402 metric
to 27 × 27 mm x 6 mm
High speed: Up to 23,850 cph
Extremely precise: Up to ±20 µm @ 3 σ
TWO
PLACEMENT HEADS
HIGHLY PRECISE AND ULTRA-FLEXIBLE
The entire placement process can be programmed in detail for
each component and placement position – including touchless
pickup and zero-force placement.
NEW
For sensitive components
Individually programmable placement process with
touchless pickup and zero-force placement
Die crack/die chipping detection
For minimal dpm rates: The vision system recognizes
even the  nest component damage and hairline
cracks without slowdowns.
Vision system with blue light
High-contract images of even the smallest
components (01005, 0201m) and diff erentiation
of special characteristics (copper pillars)
Maximum performance
With its two gantries and innovative placement
modes, the SIPLACE TX micron reaches
speeds of up to 96,000 cph.
Flux detection/inspection
Optical control ensures high yields when
using dipping units.
Cleanroom certifi cation
Class 7 certi cation as per
DIN EN ISO 14644-1 and SEMI S2/S8.
FOR SENSITIVE COMPONENTS:
MAXIMUM PRECISION
PERFECT COMPONENT SUPPLY
NEW
SMART FEEDERS
PERFECT INTERACTION
With its many innovations, the SIPLACE TX micron overcomes traditional
placement accuracy limitations. Its perfect interaction of temperature-resis-
tant glass scales,  ducials, high-resolution optical sensors and innovative
vacuum toolings ensures extremely precise positioning while delivering
maximum performance. Your gain: Maximum quality and productivity even
for extremely small components and the tightest component pitches with
maximum accuracy.
MANY INNOVATIONS:
ACCURACY BY DESIGN
SIPLACE Smart Feeder Xi
New 4-mm, 8-mm and 2 × 8-mm
feeder modules
Microtape-ready
Ready for pickup: Vacuum ensures
level blister pocket bottoms for faster,
more accurate component pickups
PERFECT COMPONENT SUPPLY