MS-11e_11em_EN_20190529 - 第3页
F eed ba ck F ee df orwar d Th e Next Gen eration in Hig h Spee d Insp ec ti on Th e W o rl d' s First Hig h Res olut ion 25 Me gapix el Camer a W e are pr ou d to have app lie d th e nex t genera ti o n vi sion sys…
MS-11e/MS-11em Series is a inline 3D SPI
machine which inspects the solder amount
status after the solder is spread to clearly
grasp the process. With a 25 Megapixel
camera contributing to productivity
enhancements, 0201 (mm) size solder paste
inspection is possible.
Dual Projection Probe
To reduce the error caused by the shadows when imaging high
components with single projection, the Dual projection probe is
applied. With precise and accurate 3D measurement when imaging
high components distorted measurements possibility due to
shadowing effects are completely eliminated.
• Dual Projectio
n to completely solve diffused refelection
shadowing problem
• A combination of images from opposite direction for a complete
volume measurement
• Perfect and precise 3D measurement capability
Slim Design
MS-11em is a SPI with 900mm slim size design for better
user convenience by having high technology as well as
space utilization
3D SPI
3D SPI Series
/
BGA IC Other
Camera Camera
Projection 1 Projection 2
Single
Projection
Shadow effect with
Single Projection
Shadow free function with
Dual Projection
Feedback Feedforward
The Next Generation in High Speed Inspection
The World's First High Resolution
25 Megapixel Camera
We are proud to have applied the next generation vision system with
25 Megapixel high resolution camera for more precise and stable
inspection and the world's only high speed CoaXPress transmission
method to allow 4 times more data transmission and 40% increased
process speed.
• The world's only 25 Megapixel camera loaded
• CoaXPress high performance vision system applied
•
Large FOV to increase inspection speed
• Processing speed increased by 40% compared to Camera Link
Warpage-free Inspection System
Checks the height of 9 points on the PCB with a laser sensor to
detect the warpage in order to automatically compensate the
inspection of the bent PCB.
• By using Laser the base position is compensated as the base height.
• PCB warpage automatic correction.
• Auto Focusing function
• More accurate 3D results guaranteed
Good
Bad
After
Before
GUI, Parameter
Simultaneous Teaching
According to the user preferences
a choice between easy and convenient
graphic based on GUI teaching and
figure based precise parameter
value teaching can be made
Intellisys
®
System
When a defect occurs in the line,
understanding in advance as well
as remote control is possible while
reducing costs from defective
products
Closed-Loop System
When PCB surface and stencil
mask position are incorrect, this
information is fed back to the
screen printer inspection
Large FOV
With a large FOV, with just a single
imaging a larger and clearer image
can be obtained to reduce the
number of imaging to allow faster
and accurate inspection
RMS
Smart Debugger
Intelli-Tracker Remote Repair
Remote SPC
MIRTEC CO., LTD (Headquarter)
SK Ventium 103-803, 166, Gosan-ro, Gunpo-si, Gyeonggi-do, 15850, Rep. of Korea
• TEL : +82-31-202-5999 • FAX : +82-31-202-5990
• www.mirtec.com
• Sales / CS : +82-1544-1062
• Data subject to change without notice.
Specifications
Dimension
50 x 50 ~ 510 x 460mm 50 x 50 ~ 330 x 280mm
50 x 50 ~ 490 x 300 (D)
50 x 50 ~ 490 x 590 (S)
03015 (mm) Solder Paste
0201 (mm) Solder Paste
Model
Max PCB Size Range
Inspection Capability
CoaXPress25 Megapixel Camera
In-line SPI
7.7µm
6µm
15 Megapixel Camera CoaXPress
15µm
10µm
15µm
10µm
Standard
Option
6,600mm
2
/ Sec
3,000mm
2
/ Sec
4 Megapixel Camera
Camera Link
3,400mm
2
/ Sec
1,500mm
2
/ Sec
PCB Top Side Clearance 20mm
PCB Bottom Side Clearance 50mm
M
PCB Thickness
aximum PCB Weight 4kg
0.5 ~ 3mm
0.5 ~ 5mm
Software
Built-in SPC, Built-in Repair, ePM-SPI
RRS, IRS, OLTT, SPC Server System
Robot Positioning System X/Y Axis Servo Motor System
Power Requirements Single Phase(s) 200~240V 50~60Hz, 1.1 KW
Air Requirements 5 Kgf / Cm
2
(0.5 Mpa)
Dimension (mm) 1,080(W) x 1,470(D) x 1,560(H) 900(W) x 1,290(D) x 1,560(H) 1,080(W) x 1,610(D) x 1,560(H)
Weight Approx. 950 Kg Approx. 870 Kg Approx. 1,010 Kg
System Specification
Dimension and Weight
3D Inspection Technology Shadow Free - Moiré 3D Phase Step Image Processing
Height Resolution 0.1µm
Height Accuracy On a Calibration Jig
Height Repeatability On a Calibration Jig ±1%
±1%
Volume Repeatability On a Calibration Jig ±2%
Solder Height
Maximum (Option: 580
)450µm µm
Minimum 40µm
CoaXPress25 Megapixel Camera
7.7µm
6µm
3,000
0603 (mm) Solder Paste
0402 (mm) Solder Paste
0402 (mm) Solder Paste
0603 (mm) Solder Paste
1,800
mm
2
/ Sec
mm
2
/ Sec
3D Inspection Technology
Maximum Inspection Speed
15 Megapixel Camera CoaXPress
15µm
10µm
15µm
10µm
4 Megapixel Camera
Camera Link
MS-11e MS-11em
MS-11DL