IPC-SM-782A-表面贴装焊盘图形设计标准.pdf.pdf - 第130页

4.0 COMPONENT DIMENSIONS Figure 2 provides the component dimensions for TSOP components. Component Identiﬁer (mm) Pin Count L (mm) S (mm) W (mm) T (mm) A (mm) B (mm) H (mm) P (mm) min max min max min max m in max min max…

1.0 SCOPE

This subsection provides the component and land pattern

dimensions for thin small outline packages (TSOP compo-

nents) with gullwing leads on two sides. Basic construction of

the TSOP device is also covered. At the end of this subsec-

tion is a listing of the tolerances and target solder joint dimen-

sions used to arrive at the land pattern dimensions.

2.0 APPLICABLE DOCUMENTS

See Section 9.0 and the following for documents applicable to

this subsection.

2.1 Electronic Industries Association of Japan (EIAJ)

EIAJ-ED-7402-3

General Rules for the Preparation of Outline

Drawings of Integrated Circuits Thin Small Outline Packages

3.0 COMPONENT DESCRIPTIONS

3.1 Basic Construction

The TSOP package is unique

among the component families of this section becaue its leads

protrude from the short side of the plastic body. The TSOP

components are available in four different pitches: 0.3, 0.4,

0.5, and 0.65 mm. They are typically specified by their two

largest dimensions—the plastic body size (in the short dimen-

sion), and the nominal toe-to-toe length (in the long dimen-

sion). Their use has grown because their height (less than

1.27 mm) allows them to be used in memory card technology.

EIAJ ED-7402-3 outlines sixteen different body sizes with pin

counts ranging from 16–76 pins. In general, as the long

dimension increases, the pitch decreases. See Figure 1.

3.1.1 Termination Materials Leads must be solder-

coated with a tin/lead alloy. The solder should contain

between 58 to 68% tin. Solder may be applied to the leads by

hot dipping or by plating from solution. Plated solder termina-

tions should be subjected to post-plating reflow operation to

fuse the solder. The tin/lead finish should be at least 0.0075

mm [0.0003 in] thick.

3.1.2 Marking Parts are available with or without part num-

ber markings. Usually an index mark indicates pin 1.

3.1.3 Carrier Packages Format Trays are usually used for

handling TSOP’s.

3.1.4 Resistance to Soldering Parts should be capable of

withstanding ten cycles through a standard reflow system

operating at 215°C. Each cycle shall consist of 60 seconds

exposure at 215°C. Parts must also be capable of withstand-

ing a minimum of 10 seconds immersion in molten solder at

260°C.

IPC-782-9-4-1

Figure 1 TSOP construction

IPC-SM-782

Surface Mount Design

and Land Pattern Standard

Date

5/96

Section

9.4

Revision

Subject

TSOP

Page1of4

4.0 COMPONENT DIMENSIONS

Figure 2 provides the component dimensions for TSOP components.

Component

Identiﬁer

(mm)

Count

L (mm) S (mm) W (mm) T (mm) A (mm) B (mm)

(mm)

min max min max min max m in max min max min max max basic

TSOP 6x14 16 13.80 14.20 12.40 12.98 0.20 0.40 0.40 0.70 5.80 6.20 12.20 12.60 1.27 0.65

TSOP 6x16 24 15.80 16.20 14.40 14.98 0.10 0.30 0.40 0.70 5.80 6.20 14.20 14.60 1.27 0.50

TSOP 6x18 28 17.80 18.20 16.40 16.78 0.05 0.22 0.40 0.70 5.80 6.20 16.20 16.60 1.27 0.40

TSOP 6x20 36 19.80 20.20 18.40 18.98 0.05 0.15 0.40 0.70 5.80 6.20 18.20 18.60 1.27 0.30

TSOP 8x14 24 13.80 14.20 12.40 12.98 0.20 0.40 0.40 0.70 7.80 8.20 12.20 12.60 1.27 0.65

TSOP 8x16 32 15.80 16.20 14.40 14.98 0.10 0.30 0.40 0.70 7.80 8.20 14.20 14.60 1.27 0.50

TSOP 8x18 40 17.80 18.20 16.40 16.98 0.05 0.22 0.40 0.70 7.80 8.20 16.20 16.60 1.27 0.40

TSOP 8x20 52 19.80 20.20 18.40 18.98 0.05 0.15 0.40 0.70 7.80 8.20 18.20 18.60 1.27 0.30

TSOP

10x14

28 13.80 14.20 12.40 12.98 0.20 0.40 0.40 0.70 9.80 10.20 12.20 12.60 1.27 0.65

TSOP

10x16

40 15.80 16.20 14.40 14.98 0.10 0.30 0.40 0.70 9.80 10.20 14.20 14.60 1.27 0.50

TSOP

10x18

48 17.80 18.20 16.40 16.98 0.05 0.22 0.40 0.70 9.80 10.20 16.20 16.60 1.27 0.40

TSOP

10x20

64 19.80 20.20 18.40 18.98 0.05 0.15 0.40 0.70 9.80 10.20 18.20 18.60 1.27 0.30

TSOP

12x14

36 13.80 14.20 12.40 12.98 0.20 0.40 0.40 0.70 11.80 12.20 12.20 12.60 1.27 0.65

TSOP

12x16

48 15.80 16.20 14.40 14.98 0.10 0.30 0.40 0.70 11.80 12.20 14.20 14.60 1.27 0.50

TSOP

12x18

60 17.80 18.20 16.40 16.98 0.05 0.22 0.40 0.70 11.80 12.20 16.20 16.60 1.27 0.40

TSOP

12x20

76 19.80 20.20 18.40 18.98 0.05 0.15 0.40 0.70 11.80 12.20 18.20 18.60 1.27 0.30

Figure 2 TSOP component dimensions

IPC-782-9-4-2

IPC-SM-782

Subject

TSOP

Date

5/96

Section

9.4

Revision

Page2of4

5.0 LAND PATTERN DIMENSIONS

Figure 3 provides the land pattern dimensions for TSOP com-

ponents. These numbers represent industry consensus on the

best dimensions based on empirical knowledge of fabricated

land patterns.

In the table, the dimensions shown are at maximum material

condition (MMC). The least material condition (LMC) should

not exceed the fabrication (F) allowance shown on page 4.

The LMC and the MMC provide the limits for each dimension.

The dotted line in Figure 3 shows the grid placement court-

yard which is the area required to place land patterns and

their respective components in adjacent proximity without

interference or shorting. Numbers in the table represent the

number of grid elements (each element is 0.5 by 0.5 mm) in

accordance with the international grid detailed in IEC publica-

tion 97.

RLP No.

Component

Identiﬁer (mm) Z (mm) G (mm) X (mm)

Y (mm) C (mm) D (mm) E (mm)

Count

Placement Grid

(No. of Grid

Elements)ref ref ref basic

390A 6x14 14.80 11.60 0.40 1.60 13.20 4.55 0.65 16 14x32

391A 6x16 16.80 13.60 0.30 1.60 15.20 5.50 0.50 24 14x36

392A 6x18 18.80 15.60 0.25 1.60 17.20 5.20 0.40 28 14x40

393A 6x20 20.80 17.60 0.17 1.60 19.20 5.10 0.30 36 14x44

394A 8x14 14.80 11.60 0.40 1.60 13.20 7.15 0.65 24 18x32

395A 8x16 16.80 13.60 0.30 1.60 15.20 7.50 0.50 32 18x36

396A 8x18 18.80 15.60 0.25 1.60 17.20 7.60 0.40 40 18x40

397A 8x20 20.80 17.60 0.17 1.60 19.20 7.50 0.30 52 18x44

398A 10x14 14.80 11.60 0.40 1.60 13.20 8.45 0.65 28 22x32

399A 10x16 16.80 13.60 0.30 1.60 15.20 9.50 0.50 40 22x36

400A 10x18 18.80 15.60 0.25 1.60 17.20 9.20 0.40 48 22x40

401A 10x20 20.80 17.60 0.17 1.60 19.20 9.30 0.30 64 22x44

402A 12x14 14.80 11.60 0.40 1.60 13.20 11.05 0.65 36 26x32

403A 12x16 16.80 13.60 0.30 1.60 15.20 11.50 0.50 48 26x36

404A 12x18 18.80 15.60 0.25 1.60 17.20 11.60 0.40 60 26x40

405A 12x20 20.80 17.60 0.17 1.60 19.20 11.10 0.30 76 26x44

Figure 3 TSOP land pattern dimensions

Grid placement courtyard

Full radius preferred

IPC-782-9-4-3

IPC-SM-782

Subject

TSOP

Date

5/96

Section

9.4

Revision

Page3of4