IPC-SM-782A-表面贴装焊盘图形设计标准.pdf.pdf - 第59页

T able 6–1 Packaging and Interconnecting Structure Comparison T ype Major Advantages Major Disadvantages Comments Organic Base Substrate Epoxy Fiberglass Substrate size, weight, reworkable, dielectric properties, convent…

The acceptable number of cycles can be increased by

reducing the thermal expansion mismatch, reducing the

temperature gradient, increasing the solder joint height,

using the smallest physical size part where possible, and by

optimizing the thermal path between the part and P&I

structure. The overall systems operating requirements for

each class of hardware determines the acceptable number

of cycles.

6.2 Organic-Base Material P&IS Organic-base materials

work best with leaded chip carriers. With leadless chip car-

riers, however, the thermal expansion mismatch between

package and substrate can cause problems. Also, ﬂatness,

rigidity, and thermal conductivity requirements may limit

their use. Finally, you must pay attention to package size,

I/O count, thermal cycling stability, maximum operating

temperature and solder joint compliance.

6.3 Non-Organic Base Materials Non-organic base

materials typically used with thick-or thin-ﬁlm technology

are also ideally suited for leaded and leadless chip carrier

designs. They can incorporate thick- or thin-ﬁlm resistors

directly on the P&I structure and buried capacitor layers

that increase density and improve reliability. However,

repairability of the P&I structure is limited. Ceramic mate-

rials, usually alumina, appear ideal for P&I structure with

leadless ceramic chip carriers because of their relatively-

high thermal conductivity (see Table 6–3) and the coeffi-

cient of thermal expansion (CTE) match. Unfortunately, the

P&I structure is limited to approximately 22,600 sq. mm.

[35 square inches]. However, the evolving use of these

materials with non-noble metals, such as copper, has

attracted both military and commercial applications.

Ceramic P&I structures currently have three applications:

ceramic hybrid circuits, ceramic multichip modules

(MCM-L) and ceramic printed boards.

6.4 Supporting-Plane P&I Structures Supporting metal-

lic or non-metallic planes can be used with conventional

printed boards or with custom processing to enhance P&IS

properties. Depending on the results desired, the supporting

plane can be electrically-functional or not and can also

serve as a structure stiffener, heatsink and/or CTE con-

straint.

High-density, sequentially-processed, multilayer P&I struc-

tures are available with organic dielectrics of speciﬁc thick-

ness, ultraﬁne conductors, and solid plated vias for layer-

to-layer interconnections with thermal lands for heat trans-

fer, all connected to a low-CTE metal support heatsink.

Thus, this technology combines laminating materials,

chemical processing, photolithography, metallurgy, and

unique thermal transfer innovations, such that it is also

appropriate for mounting and interconnecting bare inte-

grated circuit chips.

The major advantage of this system is that the vias can be

as small as 0.20 mm [0.005 inches] square and conductor

widths can range from 0.12 to 0.20 mm [0.003 to 0.005

inches] for high interconnection density. Thus, most appli-

cations can be satisﬁed with two signal layers with addi-

tional layers for power and ground.

Discrete-wire P&I structures have been developed speciﬁ-

cally for use with surface mounted components, as shown

in Figure 5–3. These structures are usually built with a

low-expansion metal support plane that also offers good

heat dissipation.

The interconnections are made by discrete 0.06 mm

[0.0025 inch] diameter insulated copper wires precisely

placed on a 0.03 mm [inch] grid by numerically-controlled

IPC-782-5-3

Figure 5–3 Test probe feature distance from component

Component

Height

▼

Free

Area

6.5mm [0.255"] height

> 5.0mm

[0.20"] Min.

Test

Pad

5.0mm [0.20"]

Tall Component

Free area

▼

Diagram Showing Free Area around Test Pad

for Components Greater than 6.5mm in Height

▼

Test Pad

IPC-SM-782A December 1999

Table 6–1 Packaging and Interconnecting Structure Comparison

Type Major Advantages Major Disadvantages Comments

Organic Base Substrate

Epoxy Fiberglass Substrate size, weight,

reworkable, dielectric

properties, conventional board

processing

Thermal conductivity, X, Y and

Z axis CTE

Because of its high X–Y plane

CTE, it should be limited to

environments and applications

with small changes in

temperature and/or small

packages.

Polyimide Fiberglass Same as Epoxy Fiberglass plus

high temperature X–Y axis

CTE, substrate size, weight,

reworkable, dielectric

properties, high Tg.

Thermal conductivity, Z-axis

CTE, moisture absorption

Same as Epoxy Fiberglass

Epoxy Aramid Fiber Same as Epoxy Fiberglass,

X–Y axis CTE, substrate size,

lightest weight, reworkable,

dielectric properties

Thermal conductivity, Z-axis

CTE, resin microcracking, Z

axis CTE, water absorption

Volume fraction of ﬁber can be

controlled to tailor X–Y CTE.

Resin selection critical to

reducing resin micro-cracks

Polyimide Aramid Fiber Same as Epoxy Aramid Fiber,

X–axis CTE, substrate size,

weight, reworkable, dielectric

properties

Thermal conductivity, Z–axis

CTE, resin microcracking,

water absorption

Same as Epoxy Aramid Fiber

Polyimide Quartz (Fused Silica) Same as Polyimide Aramid

Fiber, X–Y axis CTE, substrate

size, weight, reworkable,

dielectric properties

Thermal conductivity, Z axis

CTE, drilling, availability, cost,

low resin content required

Volume fraction of ﬁber can be

controlled to tailor X–Y CTE.

Drill wearout higher than with

ﬁberglass.

Fiberglass/Aramid Composite

Fiber

Same as Polyimide Aramid

Fiber, no surface microcracks,

Z axis CTE, substrate size,

weight, reworkable, dielectric

properties

Thermal conductivity, X and Y

axis CTE, water absorption,

process solution entrapment

Resin microcracks are conﬁned

to internal layers and cannot

damage external circuitry.

Fiberglass/Teﬂon® Laminates Dielectric constant, high

temperature

Same as Epoxy Fiberglass, low

temperature stability, thermal

conductivity, X and Y axis CTE

Suitable for high speed logic

applications.

Same as Epoxy Fiberglass.

Flexible Dielectric Light weight, minimal concern

to CTE, conﬁguration ﬂexibility

Size, cost, Z-axis expansion Rigid-ﬂexible boards offer

trade-off compromises.

Thermoplastic 3–D conﬁgurations, low

high-volume cost

High injection-molding setup

costs

Relatively new for these

applications

Non-Organic Base

Alumina (Ceramic) CTE, thermal conductivity,

conventional thick ﬁlm or thin

ﬁlm processing, integrated

resistors

Substrate size, rework

limitations, weight, cost, brittle,

dielectric constant

Most widely used for hybrid

circuit technology

Supporting Plane

Printed Board Bonded to Plane

Support (Metal or Non-Metal)

Substrate size, reworkability,

dielectric properties,

conventional board processing,

X–Y axis CTE, stiffness,

shielding, cooling

Weight The thickness/CTE of the metal

core can be varied along with

the board thickness, to tailor

the overall CTE of the

composite.

Sequential Processed Board

with Supporting Plane Core

Same as board bonded to

supporting plane

Weight Same as board bonded to

supporting plane.

Discrete Wire High-speed interconnections.

Good thermal and electrical

features.

Licensed process.

Requires special equipment.

Same as board bonded to

low-expansion metal support

plane.

Constraining Core

Porcelainized Copper Clad

Invar

Same as Alumina. Reworkability, compatible thick

ﬁlm materials.

Thick ﬁlm materials are still

under development.

Printed Board Bonded with

Constraining Metal Core

Same as board bonded to low

expansion metal cores,

stiffness, thermal conductivity,

low weight.

Cost, microcracking. The thickness of the graphite

and board can be varied to

tailor the overall CTE of the

composite.

Compliant Layer Structures Substrate size, dielectric

properties, X–Y axis, CTE.

Z axis CTE, thermal

conductivity.

Compliant layer absorbs

difference in CTE between

ceramic package and

substrate.

December 1999 IPC-SM-782A

machines. This geometry results in a low-proﬁle intercon-

nection pattern with excellent high-speed electrical charac-

teristics and a density normally associated with thick-ﬁlm

technology.

6.5 Constraining Core P&I Structures As with

supporting- plane P&IS, one or more supporting metallic

or non-metallic planes can serve as a stiffener, heatsink,

and/or CTE constraint in constraining core P&IS struc-

tures.

6.5.1 Porcelainized-Metal (Metal Core) Structures An

integral core of low-expansion metal (e.g., copper-clad

Invar), can reduce the CTE of porcelainized-metal P&I

structures so that it closely matches the CTE of the ceramic

chip carrier. Also, the P&I structure size is virtually unlim-

ited. However, the low melting point of the porcelain

requires low-ﬁring-temperature conductor, dielectric and

resistor inks.

A number of composite P&I structures use leadless compo-

nents. An integral material with a lower CTE than that of

the printed boards controls the CTE of these structures.

Table 6–2 P & I Structure Selection Considerations

Design Parameters

Material Properties

Transition

Temperature

Coefficient

of Thermal

Expansion

Thermal

Conductivity

Tensile

Modulus

Flexural

Modulus

Dielectric

Constant

Volume

Resistivity

Surface

Resistivity

Moisture

Absorption

Temperature & Power Cycling XXXX

Vibration X X

Mechanical Shock X X

Temperature & Humidity X X XXXX

Power Density X X

Chip Carrier Size X X

Circuit Density XXX

Circuit Speed XXX

Table 6–3 P & I Structure Material Properties

Material

Material Properties

Glass

Transition

Temperature

Coefficient

of Thermal

Expansion

Thermal

Conductivity

XY Tensile

Modulus

Dielectric

Constant

Volume

Resistivity

Surface

Resistivity

Moisture

Absorption

Unit of measure (°C) (PPM/°C)

(note 4)

(W/M°C) (PSI x

–6

)

(At 1 MHz) (Ohms/cm) (Ohms) (Percent)

Epoxy Fiberglass 125 13–18 0.16 2.5 4.8 10

0.10

Polyimide Fiberglass 250 12–16 0.35 2.8 4.8 10

0.35

Epoxy Aramid Fiber 125 6–8 0.12 4.4 3.9 10

0.85

Polyimide Aramid

Fiber

250 3–7 0.15 4.0 3.6 10

1.50

Polyimide Quartz 250 6–8 0.30 4.0 10

0.50

Fiberglass/Teﬂon 75 20 0.26 0.2 2.3 10

1.10

Thermoplastic Resin 190 25–30 3–4 10

Alumina–Beryllia NA 5–7 21.0 44.0 8.0 10

Aluminum (6061 T–6) NA 23.6 200 10 NA 10

Copper (CDA101) NA 17.3 400 17 NA 10

Copper-Clad Invar NA 3–6 150XY/20Z 17–22 NA 10

Notes:

1. These materials can be tailored to provide a wide variety of material properties based on resins, core materials, core thickness,

and processing methods.

2. The X and Y expansion is controlled by the core material and only the Z axis is free to expand unrestrained. Where the Tg will be

the same as the reinforced resin system used.

3. When used, a compliant layer will conform to the CTE of the base material and to the ceramic component, therefore reducing the

strain between the component and P&I structure.

4. Figures are below glass transition temperature, are dependent on method of measurement and percentage of resin content.

NA = Not Applicable

IPC-SM-782A December 1999