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36 Component Feeding Matrix Tray Changer (MTC) Technical Data Electrical ratings To w e r 1 ( X L ) To w e r 2 Dimensions Length x width Height 1305 mm x 600 mm 1560 mm for 900 mm PCB conveyor height 1590 mm for 930 mm P…

Component Feeding

Matrix Tray Changer (MTC)

If you need to provide com-

ponents in multiple waffle

pack tray for the placement

process, we recommend

using an automatic maga-

zine changeover with the

help of an Matrix Tray

Changer (MTC).

In SIPLACE X3 S/X4 S

machines, an MTC can be

docked onto location 2 in

place of the component

trolley. The service flap in

the machine protection of

the SIPLACE X3 S/X4 S

placement machine provides

access to the front section of

the feed axis.

The MTC setup is coordi-

nated to the exact placement

sequence to achieve a path-

optimized and time-opti-

mized working process. Two

towers with waffle pack trays

move independently of one

another, in a vertical direc-

tion, until the required maga-

zine reaches the access area

of the feed axis. The horizon-

tal feed axis transports the

waffle pack tray from the

tower to the access area of

the placement head. The first

magazine is made available

as soon as a board is moved

into the PCB conveyor and

valid panel and setup data

has been provided.

All other magazine changes

are executed during the

placement process without

influencing the processing

time. JEDEC magazines can

be refilled without stopping

the machine. Faulty compo-

nents are placed back in the

original magazine.

Tower 2

Tower 1

MTC

Component Feeding

Matrix Tray Changer (MTC)

Technical Data

Electrical ratings

Tower 1 (XL) Tower 2

Dimensions

Length x width

Height

1305 mm x 600 mm

1560 mm for 900 mm PCB conveyor height

1590 mm for 930 mm PCB conveyor height

1640 mm for 950 mm PCB conveyor height

Weight (basic package)

approx. 500 kg (with cassettes and waffle pack tray carriers)

Weight (fully configured)

approx. 534 kg (with components)

Weight (moving loads)

approx. 80 kg approx. 43.5 kg

Cassette size (L x W x H)

391.2 x 305.6 x 93.3 mm³ 352.7 x 154.8 x 133.8 mm³

Cassette weight

(fully configured)

(without waffle pack tray carrier)

approx. 11 kg

approx. 1.7 kg

approx. 7.5 kg

approx. 1.35 kg

Weight of the waffle pack tray

carrier

850 g 150 g

Dimensions of waffle pack tray

carrier (L x W x H)

386.5 mm x 295.8 mm x 11.1 mm 371 mm x 146 mm x 10.1 mm

Distance from cassette to cas-

sette

96 mm 135 mm

Distance from level to level

12 mm 11.8 mm

Storage capacity

30 waffle pack tray carrier XL with

60 JEDEC or

30 special magazines

of maximum size

40 waffle pack tray carriers

with 40 JEDEC waffle pack

trays

Changeover time (over 5 levels)

approx. 2 s approx. 1.5 s

Max. height of component and

waffle pack tray incl. tolerances

All levels occupied

One level free

Two levels free

8.5 mm

19.5 mm

31.5 mm

8.5 mm

19.5 mm

–

Supply voltage 3 x 400 V~, 50 Hz (Europe)

3 x 208 V~, 60 Hz (USA)

Overall power 1.5 kW

Apparent power 3.85 kVA

Rated current 2.7 A at 3 x 400 V~

4.2 A at 3 x 208 V~

Fuse 3 x 16 A

Rated current consumption of largest con-

sumer

2 A

Digital SIPLACE Vision System

The digital Vision system

ensures fast and reliable

component recognition, cou-

pled with user-friendly han-

dling. The system identifies

each individual component

by its geometry and color.

Even complex component

shapes, such as flip chip or

CCGA are detected with high

reliability.

This component recognition

check is performed in a sin-

gle step, with no extra time

involved but with optimum

scanning of each individual

component.

This digital Vision system is

not only used in the compo-

nent cameras but also in the

PCB camera. In addition to

the precise recognition of

components, this also guar-

antees reliable detection of

ínkspots and PCB fiducials.

The benefits at a glance:

• Extremely fast and reliable

component recognition

• Shortest cycle times

• Robust measurement

based on the geometry

and color

• Straightforward program-

ming

• Offline programming of

component shapes

• Rapid introduction of new

products (NPI)

• Open architecture allows

you to quickly adapt to

new requirements

• Optimum placement

results based on individ-

ual measurement of each

component

The SIPLACE Vision sys-

tem offers inspection rou-

tines and functions to

enhance the quality of com-

ponent recognition.

The benefits at a glance:

• Maximum placement

quality

• High first pass yield

• Reduction of operating

costs

Examples of digital vision system analysis times

Evaluation times only play a role in the P&P process.

01005 9 ms

PLC44 17 ms

BGA 225 balls 18 ms

Digital vision cameras

SIPLACE SpeedStar camera, type 23

SIPLACE SpeedStar camera, type 41

SIPLACE MultiStar camera, type 30

SIPLACE TwinStar standard camera, type 33

SIPLACE TwinStar high resolution camera, type 25

SIPLACE PCB camera, type 34