X-S Speicification - 第5页

5 Overview of Technical Data Maximum Values Placement pe rformance a IPC value Benchmark value Theoretical value a) Definition of performance values see page 12. 102,000 comp./h 120,000 comp./h 135,500 comp./h Component …

SIPLACE X-Serie

Content

Bad Board Recognition 41

01005 Placement 42

Machine Maintenance 43

SIPLACE Software Suite 44

General 44

Overview 45

SIPLACE Station Software 46

SIPLACE Random Setup 49

Maximum production quality 50

SIPLACE Service Options 51

Training Courses 52

Technical Data 53

SMEMA Interface 53

Siemens Signal Interface 55

Electrical Ratings and Energy Consumption 57

Compressed Air Supply 59

Electrical Connection and Compressed Air Supply 60

Dimensions and Setup Conditions 61

Placement Machine Dimensions 62

Placement Machine Center of Gravity 62

Maneuvering Radii for the X Component Trolleys 63

Maneuvering Radii for MTC 64

Spacing Distances for Single Conveyor 65

Spacing Distances for the Flexible Dual Conveyor 66

Spacing Distances Machine with MTC 67

Transportation and Delivery Configuration 68

Standard List 69

List of Options 70

Overview of Languages 72

Configuration Help 73

SIPLACE X3 S, SC 706.1 SP1 73

SIPLACE X4 S, SC 706.1 SP1 74

SIPLACE X4i S, SC 706.1 SP1 75

SIPLACE Smart Pin Support 76

Compare SIPLACE 77

SIPLACE Awards 78

Overview of Technical Data

Maximum Values

Placement performance

IPC value

Benchmark value

Theoretical value

a) Definition of performance values see page 12.

102,000 comp./h

120,000 comp./h

135,500 comp./h

Component range 01005 - 200 mm x 110 mm

Placement accuracy

angular accuracy

b) The accuracy value, measured using the vendor-neutral IPC standard.

± 22 µm, ± 0.05° / (3),

± 30 µm, ± 0.07° / (4

)

Feeder module types Tape feeder modules, linear vibratory feeders,

dip modules, application-specific OEM feeder

modules

Feeding capacity (component trolley X) 160 feeder modules 8 mm X

Board format (lengthx width) 650 mm x 560 mm

PCB thickness 0.3 - 6.5 mm

PCB weight up to 3.0 kg

Camera 6 illumination levels

Machine protection:

Light gray (RAL 7047)

Machine colors

Covers: Light gray

(RAL 7047)

Covers: Pearl dark gray

(RAL 9023 )

SIPLACE X-Series

Machine Description

The X series S placement

machines are available in 3

variants.

•SIPLACE X3 S

•SIPLACE X4 S

• SIPLACE X4i S

The numbers in the type

name indicate the number of

gantries used. Each gantry

has one placement head.

Intelligent placement solu-

tions for maximum stan-

dards

Maximum flexibility, top per-

formance or placement qual-

ity: the SIPLACE X-Series

has state-of-the-art technol-

ogy to master any challenge

arising in SMT production. It

offers all the innovations and

features to ensure efficient

electronics production today

and in the future, and pro-

vides previously unavailable

ways to increase both effi-

ciency and productivity.

Maximum modularity for

every need

The compact design of the

SIPLACE X-Series forms the

ideal basis for new, future-

oriented production concepts

which keep pace with

dynamically developing cus-

tomer requirements, without

the need for time-consuming

conversion as in traditional

SMT production lines.

The SIPLACE X-Series cov-

ers the entire range of com-

mon components with only

three placement heads. The

ideal addition to the proven

SIPLACE TwinStar and the

high speed SIPLACE

SpeedStar 20 segment C&P

placement head is the new

SIPLACE Multistar head.

Due to the patented CPP

technology (Col-

lect&Pick&Place), the

SIPLACE Multistar is the

first placement head world-

wide which can not only

switch between Pick&Place

and rapid Collect&Place

placement but can also com-

bine both modes in one

placement cycle (mixed

mode). Software-controlled

changeover of placement

modes in a flash enables you

to easily and perfectly bal-

ance out your production line

in the event of rapidly chang-

ing requirements. Compared

to conventional solutions,

head changes are no longer

needed and the overall pro-

ductivity of the line increases

significantly.

During placement, the place-

ment heads pick up the com-

ponents from the waiting

supply and place these on

the board waiting.

This established SIPLACE

principle ensures reliable

pickup of even the smallest

components, prevents com-

ponents sliding on the board

and enables minimized travel

paths.

The user also benefits from

different PCB conveyors:

The single conveyor and

the flexible dual conveyor.

SIPLACE MultiStar