PS288_PS388_PS588_981-0424-002D - 第63页

■ Setting Up Input and Output Media ◘ Setting Up the Tape Output Sys tem PS Series Owner’s Manual 2—21 back 2a. The T ape Output System gets power and compressed air from the PS System. Ensure the PS Syst em air is conne…

Setup ■ Setting Up Input and Output Media

2—20 Data I/O • 981-0424-002

back

The tape output system receives programmed devices from the

PS System via a second PNP head on the output frame. With this

head, the Tape Output System places devices into empty carrier tape

pockets, advances the carrier tape through a mechanism that seals the

tape (using heat or pressure), and rolls the filled tape onto a reel for

delivery to the next stage in the manufacturing process.

Figure 2-20: Tape Output System.

Note: For additional information, refer to the TM-50 SMD Taping

Module User’s Guide that came with your Tape Output System.

CAUTION: Excessive Heat. Improper routing of the device tape

may cause enough heat to melt the tape. Ensure the correct rout-

ing path is followed. See the TM-50 SMD Taping Module User’s

Guide.

Note: The Tape Out System includes the Option Bay, the shuttle

transfer, and the Tape-Out-PNP head. These must already be

installed on the PS Machine before following the setup instructions

below. If it is not, contact Data I/O Customer Support or a local

Data I/O approved service representative.

To set up the Tape Output System:

1. Edit the winAH400.ini file for Tape Output—

1a. Using Windows Explorer, locate

C:\AH500\winAH400.ini

and m

ake a backup copy, for example,

WinAH400backup.ini

1b. Open the original file with Microsoft Notepad.

1c. Locate the line:

TapeOutPutInstalled=FALSE

and change it to True:

TapeOutputInstalled=TRUE

1d. Save the

winAH400.ini

file and exit Windows Explorer.

2. Preparation—

The information that

follows is adapted from

the TM-50 SMD Tap-

ing Module User’s

Guide that came with

your Tape Output Sys-

tem.

If you have previously

used Tape Output, you

may already have saved

a winAH400.ini file spe-

cifically for a Tape Out-

put setup.

For more ini file infor-

mation, see the

on-screen Help.

■ Setting Up Input and Output Media ◘ Setting Up the Tape Output System

PS Series Owner’s Manual 2—21

back

2a. The Tape Output System gets power and compressed air from

the PS System. Ensure the PS System air is connected and power

is On.

2b. Switch the Tape Output System ON by pulling out its

Power/E-stop button.

2c. Turn the take-up reel tension adjust knob counterclockwise to

zero. (Black knob on the controller.)

2d. Set the taping job parameters at the controller. For more infor-

mation see the TM-50 SMD Taping Module User’s Guide, chap-

ter 3, Controller.

3. Pull the nearest half of the track (table) out to the desired track

width. It stops at detents set to specific tape widths.

4. Mount the carrier tape reel—

4a. Remove the carrier tape quick lock from the carrier tape spindle.

Figure 2-21: Removing the spindle QuickLock.

4b. Mount the bulk carrier tape reel on the right spindle so the tape

unwinds from the top.

4c. Replace the quick lock.

4d. Trim the end of the carrier tape so it is clean and straight.

5. Route the carrier tape—

5a. Guide the carrier tape into the loading track. It should feed right

to left through the loading track easily.

Note: Lowering the feed reel support arm can reduce drag if the

angle at which the carrier enters the loading track is too steep.

5b. Bring the end of the carrier tape past the sealer and engage the

sprocket holes on the teeth of the drive sprocket.

If the carrier tape does not feed to the sprocket easily, see the

TM-50 SMD Taping Module User’s Guide, Chapter 4, Setup,

Route the Carrier Tape for items to check.

6. Mount the cover tape—

6a. Place a reel of cover tape of the correct width to match the carrier

tape on the cover tape spindle. The tape should unwind to the

right from the bottom of the reel.

For more information

about these steps, see the

TM-50 SMD Taping

Module User’s Guide.

Setup ■ Setting Up Input and Output Media

2—22 Data I/O • 981-0424-002

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6b. Set the width of the cover tape guide assembly for your size

tape.

6c. Use the Cover Tape Position Adjuster if needed. Turning it clock-

wise moves the cover tape position toward the sprocket side of

the tape.

6d. Using blue tabbing tape, attach the cover tape to the carrier tape.

Thread both through the cover tape Guide Sealer Assembly. Run

the machine to advance the carrier and cover tapes through the

sealer.

Prepare the Seal Method

For heat seal, complete Step 1 below.

For pressure seal (PSA), complete Step 2 below.

1. To prepare the heat seal—

1a. Turn the heat seal toggle switch ON.

Note: Disable the pressure seal by loosening the seal roller pressure

screws until the seal rollers are no longer in contact with the cover

tape.

1b. Set the temperature controls to the appropriate temperature. See

the table below.

Figure 2-22: Tape Output suggested temperature and pressure

settings. The temperature of each shoe can be increased or decreased

according the results of a peel force test.

1c. Adjust the heat shoe air pressure to the appropriate setting. This

setting controls the amount of force applied when the sealer

shoes drop.

Note: The recommended starting point for heat shoe air pressure is

50 PSI. Turning the heat shoe adjuster clockwise increases the pres-

sure.

1d. After the heat sealer reaches operating temperature, set the con-

troller parameters, if not already set.

Heat Seal only

Carrier Tape Type Cover Tape Type Temperature Air Pressure Dwell Time

3m Type 3000

Conductive Carrier

3m Type 2675 Static

Dissipative Cover

135-155°C 40-60 PSI 250-400 ms

3m Type 2701/2703

Non-conductive

Advantek Conductive Advantek Type AA

Advantek

Non-conductive

Advantek Type S