PS288_PS388_PS588_981-0424-002D - 第64页
Setup ■ Setting Up Input and Output Media 2—22 Data I/O • 981-0424 -002 back 6b. Set the width of the cover tape guide assembly for your size tape. 6c. Use the Cover T ape Po sition Adjuster if needed. T urning it clock-…
■ Setting Up Input and Output Media ◘ Setting Up the Tape Output System
PS Series Owner’s Manual 2—21
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2a. The Tape Output System gets power and compressed air from
the PS System. Ensure the PS System air is connected and power
is On.
2b. Switch the Tape Output System ON by pulling out its
Power/E-stop button.
2c. Turn the take-up reel tension adjust knob counterclockwise to
zero. (Black knob on the controller.)
2d. Set the taping job parameters at the controller. For more infor-
mation see the TM-50 SMD Taping Module User’s Guide, chap-
ter 3, Controller.
3. Pull the nearest half of the track (table) out to the desired track
width. It stops at detents set to specific tape widths.
4. Mount the carrier tape reel—
4a. Remove the carrier tape quick lock from the carrier tape spindle.
Figure 2-21: Removing the spindle QuickLock.
4b. Mount the bulk carrier tape reel on the right spindle so the tape
unwinds from the top.
4c. Replace the quick lock.
4d. Trim the end of the carrier tape so it is clean and straight.
5. Route the carrier tape—
5a. Guide the carrier tape into the loading track. It should feed right
to left through the loading track easily.
Note: Lowering the feed reel support arm can reduce drag if the
angle at which the carrier enters the loading track is too steep.
5b. Bring the end of the carrier tape past the sealer and engage the
sprocket holes on the teeth of the drive sprocket.
If the carrier tape does not feed to the sprocket easily, see the
TM-50 SMD Taping Module User’s Guide, Chapter 4, Setup,
Route the Carrier Tape for items to check.
6. Mount the cover tape—
6a. Place a reel of cover tape of the correct width to match the carrier
tape on the cover tape spindle. The tape should unwind to the
right from the bottom of the reel.
For more information
about these steps, see the
TM-50 SMD Taping
Module User’s Guide.
Setup ■ Setting Up Input and Output Media
2—22 Data I/O • 981-0424-002
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6b. Set the width of the cover tape guide assembly for your size
tape.
6c. Use the Cover Tape Position Adjuster if needed. Turning it clock-
wise moves the cover tape position toward the sprocket side of
the tape.
6d. Using blue tabbing tape, attach the cover tape to the carrier tape.
Thread both through the cover tape Guide Sealer Assembly. Run
the machine to advance the carrier and cover tapes through the
sealer.
Prepare the Seal Method
For heat seal, complete Step 1 below.
For pressure seal (PSA), complete Step 2 below.
1. To prepare the heat seal—
1a. Turn the heat seal toggle switch ON.
Note: Disable the pressure seal by loosening the seal roller pressure
screws until the seal rollers are no longer in contact with the cover
tape.
1b. Set the temperature controls to the appropriate temperature. See
the table below.
Figure 2-22: Tape Output suggested temperature and pressure
settings. The temperature of each shoe can be increased or decreased
according the results of a peel force test.
1c. Adjust the heat shoe air pressure to the appropriate setting. This
setting controls the amount of force applied when the sealer
shoes drop.
Note: The recommended starting point for heat shoe air pressure is
50 PSI. Turning the heat shoe adjuster clockwise increases the pres-
sure.
1d. After the heat sealer reaches operating temperature, set the con-
troller parameters, if not already set.
Heat Seal only
Carrier Tape Type Cover Tape Type Temperature Air Pressure Dwell Time
3m Type 3000
Conductive Carrier
3m Type 2675 Static
Dissipative Cover
135-155°C 40-60 PSI 250-400 ms
3m Type 2701/2703
Non-conductive
Advantek Conductive Advantek Type AA
Advantek
Non-conductive
Advantek Type S
■ Setting Up Input and Output Media ◘ Setting Up the Tape Output System
PS Series Owner’s Manual 2—23
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Note: For additional information, refer to the TM-50 SMD Taping
Module User’s Guide, Chapter 3, Controller.
1e. Set the Controller to RUN mode.
1f. Advance the tape using the foot switch.
1g. Check the sealed tape for the desired sealed position.
1h. If necessary, adjust the inner seal position by turning the inner
seal adjuster (thumb wheel) clockwise (to move the seal away
from the operator) or counterclockwise. Tighten the position
lock to secure it.
1i. If necessary, adjust the outer seal position by turning the outer
seal adjuster (thumb wheel) clockwise to move the seal toward
the operator or counterclockwise (to move the seal away from
the operator). Lock the adjuster into place using the position
lock knob.
2. To prepare the pressure seal—
Note: If the heat sealer is On, turn it OFF.
2a. Set the controller for Pressure Sensitive Adhesive (PSA) opera-
tion. Refer to the Chapter 3, Controller of the TM-50 SMD Taping
Module User’s Guide. Then set the controller to RUN mode.
Note: When RUN is selected, the controller is ready to operate. The
parameters which have been entered are displayed on the screen
along with the running devices count. The controller will begin to
advance and seal tape when the foot switch is pressed.
2b. Advance the tape using the foot switch.
2c. Adjust the inner and outer seal roller position. Align the roller
position over the strip of adhesive on either side of the PSA
cover tape. Both thumb screws have locking devices.
2d. Adjust the pressure at both sealer wheels to free spinning and
then 1/8 revolution tighter. Use a 2 mm hex key.
2e. Advance the tape using the foot switch. Re-adjust the seal roller
pressure until the PSA adhesive is firmly adhered to the carrier
tape.
Note: Excessive roller pressure may cause carrier tape advance
problems or elongation of sprocket holes in the carrier tape.
Checks to Perform Prior to Running
1. Mount an empty take-up reel on the spindle.
2. Perform a Peel Force Test
Perform as many peel force tests as needed while adjusting the
sealer controls to obtain the required seal strength.
Pressure Seal
only