ASM-X-Spec-SX12V2-EN-DMS - 第34页

34 Digital SIPLACE Vision System The digital Vision system ensures fast and reliable component recognitio n, cou- pled with user-friendly ha n- dling. The s ystem identif ies each individu al component by its geometry an…

Component Provision SIPLACE SX1/SX2

Waffle Pack Changer (WPC5/WPC6)

Technical Data

Electrical ratings

WPC5/WPC6 dimensions

Length x width

Height

For 900 mm PCB conveyor height

For 930 mm PCB conveyor height

For 950 mm PCB conveyor height

1520 mm x 360 mm

1430 mm

1460 mm

1480 mm

WPC5 weight

Basic configuration (with cassettes and waffle pack tray carriers)

Fully configured (with WPTC and cassette with components)

approx. 270 kg

approx. 320 kg

WPC6 weight

Basic configuration (with cassettes and waffle pack tray carriers)

Fully configured (with WPTC and cassette with components)

approx. 280 kg

approx. 330 kg

WPC5/WPC6 surface load  25 N/cm²

Weight of the waffle pack tray carrier 0.8 kg

Dimensions of waffle pack tray carrier (LxWxH) 360 mm x 260 mm x 6 mm

Dimensions of waffle pack tray (LxWxH) 347 mm x 235 mm x 15 mm

Height of waffle-pack tray, including component

Standard (all levels occupied)

WPC5

WPC6

High components (levels omitted)

WPC5

WPC6

High components

(on request with Very High Force Pick&Place (VHF)- 30mm/70N)

WPC5

WPC6

a) From serial number B1485 (WPC5) / C1486 (WPC6)

b) Level 1-3 and use of nonstop module (load axis) up to 29mm max. 35mm is for use with the feed axis.

15 mm

29 mm

35 mm

Distance from level to level 17 mm (± 2 mm)

Storage capacity 28 waffle pack tray carrier

Changeover time for waffle pack tray carrier

over 1 level

over 10 levels

over 27 levels

1.9 s

2.3 s

2.8 s

Supply voltage 3 x 200 V~ ± 10 %; 50/60 Hz (Japan)

3 x 208 V~ ± 10 %; 50/60 Hz (U.S.A)

3 x 230 V~ ± 10 %; 50/60 Hz

3 x 380 V~ ± 10 %; 50/60 Hz

3 x 400 V~ ± 10 %; 50/60 Hz (Europe)

3 x 415 V~ ± 10 %; 50/60 Hz

Nominal apparent power 1.5 kVA

Nominal active power 1.0 kW

Fuses 3 x 10 or 3 x 16 A

Digital SIPLACE Vision System

The digital Vision system

ensures fast and reliable

component recognition, cou-

pled with user-friendly han-

dling. The system identifies

each individual component

by its geometry and color.

Even complex component

shapes, such as flip chip or

CCGA are detected with high

reliability.

This component recognition

check is performed in a sin-

gle step, with no extra time

involved but with optimum

scanning of each individual

component.

This digital Vision system is

not only used in the compo-

nent cameras but also in the

PCB camera. In addition to

the precise recognition of

components, this also guar-

antees reliable detection of

ínkspots and PCB fiducials.

The benefits at a glance:

• Extremely fast and reliable

component recognition

• Shortest cycle times

• Robust measurement

based on the geometry

and color

• Straightforward program-

ming

• Offline programming of

component shapes

• Rapid introduction of new

products (NPI)

• Open architecture allows

you to quickly adapt to

new requirements

• Optimum placement

results based on individ-

ual measurement of each

component

The SIPLACE Vision sys-

tem offers inspection rou-

tines and functions to

enhance the quality of com-

ponent recognition.

The benefits at a glance:

• Maximum placement

quality

• High first pass yield

• Reduction of operating

costs

Digital vision cameras

SIPLACE SpeedStar camera, type 23

SIPLACE SpeedStar camera, type 41

SIPLACE MultiStar camera, type 30

SIPLACE TwinStar standard camera, type 33

SIPLACE TwinStar high resolution camera, type 25

SIPLACE PCB camera, type 34

Examples of digital vision system analysis times

Evaluation times only play a role in the P&P process.

01005 9 ms

PLC44 17 ms

BGA 225 balls 18 ms

Digital SIPLACE Vision System

Checking the Component Quality

Overview of Key Functions

Recognizing the collinearity of components

Damaged or bent leads are recognized. This helps avoid solder-free connections during the subsequent solder-

ing process.

Damaged leads Damaged leads

Recognizing flipped (face down) or upright components

Both chip and IC component shapes (e.g. SOT) recognized in flipped (turned face down) or upright state.

SOT OK SOT “face down”

Flipped chip Chip upright

Checking the lead width

The optical checking of the lead width recognizes tilted or damaged leads. This helps to recognize e.g. diodes

with tilted leads.

Lead width OK Tilted lead