N7201A616E00_0317 - 第323页
NPM-W 2 EJM7DE-MB-05O-0 0 5-1-1 -2 Solder inspection
NPM-W2 EJM7DE-MB-05O-00
Over-
view
By installing the 2D inspection head, solder inspection printed on a production PCB can be performed.
●Component inspection and solder inspection (→P.4-1-2) can be performed based on the production data.
Features
Operating procedure
5-1-1
Main features
●The previous process machine of NPM-W2 installed the inspection head can inspect such as fill,
pervasion, positioning and bridge for printed solders so that you can avoid production of defect
components.
●When detecting any defect, you can visually check the location of the defect on the over judgment input
screen, make changes in inspection results, confirm the location within a PCB and skip placement to the
defect position.
●By using the APC function (optional), you can perform component placement to the most appropriate
position based on the measured solder position, resulting in improving the placement quality.
Constraints
●The 2D inspection head (hereafter, it is describes as the inspection head) can be installed only to the front
side of the first machine of NPM-W2.
●After the machine with inspection head installed, the ejection conveyor must be placed. (Please prepare
on your own).
At that time, conveyors must be placed on both sides.
●As far as the machine that carries out inspection and placement operation goes, only [Alternative
placement] is available for [Placement mode] during the DGS optimization. [Independent] is not available
for use.
5-1-1-1
1)Defective PCB: A PCB that the inspection head or an operator judges as defect.
NPM-W2 EJM7DE-MB-05O-00
5-1-1-2
Solder
inspection
NPM-W2 EJM7DE-MB-05O-00
Over-
view
System configuration
Operating procedure
5-1-2
This section describes standard configuration of NPM-W2 system equipped with the inspection head
(solder inspection).
■Type 1
An ejection conveyor will be placed just downstream from the machine with the inspection head (solder
inspection) and, a conveyor, right between NPM-W2 and the ejection conveyor.
●Ejection conveyor: when a solder defect is found during inspection, it is used for locating the
defect/removing a defective PCB/repairing the PCB.
■Explanation of major peripheral devices (Phrases/words in this table will be used
in an abbreviated form in the rest of the manual)
No.
Name Explanation
1 DGS (Data Generation System) This creates and edits the production data.
2 LNB (Line Network Box)
The production information retrieved from NPM-W2 is saved.
(Inspection result information, etc.)
3 LWS (Line Work Station)
This edits and adjusts (tunes) the inspection data during
production.
1) For more information on the ejection conveyor specifications, please contact us.
5-1-2-1
NPM-W2
Screen
printer
NPM-W2
Inspection ejection
conveyor
コンベヤー
(Removal of PCB)
LWS LNB
(PCB flow)
DGS
Placement
head
Inspection head
(solder inspection)
NPM-W2 NPM-W2
1)