N7201A616E00_0317 - 第639页
NPM-W 2 EJM7DJ-MB-08O-00 8-1-1 -2 APC system Desired effect ● Reduction in lifting, displacement or miss ing co mponent defects of micro-c omponent electrodes, including 0402 and 0603 *1) , leads to enhanced joint streng…
NPM-W2 EJM7DJ-MB-08O-00
Over-
view
Operating procedure
8-1-1
8-1-1-1
● Each target machine is required for optional settings before use of APC system .
●Items indicated with are a standard feature in solder inspections. (No
APC license is required)
● When using each function, the production data setting is configured by DGS or LWS. (→[NPM-DGS 2D
inspection editor])
APC stands for Advanced Process Control system, a technology to control the processes using process data
obtained by constantly measuring each process for improvement of placement quality.
APC system in the NPM line performs the following controls so that it reduces placement defects caused by
printing position displacement from the land position.
Solder inspection
standard
Solder
printing
Solder
inspection
Component
placement
Component
inspection
Reflow
①②③
・Feed-forward control to the downstream process
①Component placement: Components are placed onto the optimum and high accuracy position
based on the solder measurement position
②Component inspection: Components are inspected based on the corrected placement position
・Feedback control to the upstream process
③Solder printing: Solder paste is printed onto the optimum position based on the solder
measurement position
Function Applicable machines
Solder printing SPD, SP70, SPG
Solder inspection NPM inspection head: Inspection head installed on NPM (Installation to
NPM-TT is not supported)
Solder inspection machine manufactured by other companies: Please
contact us.
Component placement NPM placement head
Component inspection NPM inspection head: Inspection head installed on NPM (Installation to
NPM-TT is not supported)
Features 1
NPM-W2 EJM7DJ-MB-08O-00
8-1-1-2
APC
system
Desired effect
●Reduction in lifting, displacement or missing component defects of micro-component electrodes,
including 0402 and 0603
*1)
, leads to enhanced joint strength.
*1)
03015 is not applicable.
●Reduction in placement defects resulting from the price reduction of PCBs or the low land position
accuracy of carrier attachment/flexible PCB/ceramic PCB.
●Joint reliability improvement in ball components such as BGA and CSP, and reduction in void defects.
In case of any defect, components do not have to be placed in the downstream process so that waste
can be minimized.
●Reduction in chipping/cracking defects since the impact of component placement can be decreased.
■Placement quality improvement
●Defect patterns are specified based on the inspection results of printing solder paste or the lands (for
components to be transferred and placed) during production, which can cut down on the cost
associated with component losses.
●Land inspection before placement increases inspection reliability, and reduction in the costs associated
with preliminary inspections of PCBs and the defective pattern marking process.
●Pattern recognition time is reduced so that productivity and placement quality can be improved.
(High accuracy placement can be achieved based on PCB recognition criteria since the placement
position is controlled on a per-component basis in consequence of measurement of all solder positions
where components are placed.)
■ Cost reduction
We cannot assure that the above effects apply to the placement features of all our products.
NOTE
Solder inspection
standard
Solder inspection
standard
NPM-W2 EJM7DJ-MB-08O-00
Over-
view
Operating procedure
8-1-1
8-1-1-3
Function
■Placement position correction function
■Component inspection position correction function
The cost associated with component losses can be reduced by using the pattern skip control for the
placement or inspection heads within the line based on inspection results.
■Solder/land defect skip function
Solder inspection
standard
Variation in PCB sizes, individual PCB positions, solder printing masks or machines causes misalignment
between a solder position and a component placement position, resulting in decreasing placement quality
after reflow.
APC system controls the production line using printed all solder positions / area measurement values
together with the inspection result so that it can reduce the effects on various variations and prevent
decreasing placement quality using the following functions.
By sending (in feed-forward) data about the correction amount calculated based on the misalignment
between the position of a component placed by the placement head and the printing position of the solder
corresponding to the component to the component placement process, the component can be placed at
an optimum position with relative to the corresponding solder position.
●The amount to be corrected in X-, Y-, and A- (angle) directions is sent in feed forward.
●Solder inspection function, if the condition of solder is not conforming, stops automatic operation to allow
you locate the nonconforming solder. In addition, for a component for which measurement of the position
of the corresponding solder has failed, the correction amount of the one close to the component will be
applied, instead.
●Feed-forward control in X-, Y-, and A- (angle) directions can be set to ON /OFF on a per-component basis.
By sending (in feed-forward) the correction amount of the component placement mentioned above to the
component inspection process, misalignment of a component can be inspected based on the corrected
placement position.
By sending (in feed-forward) the correction amount calculated from the misalignment between the
positions of solder paste printed onto all lands and the ones of the respective lands* to the solder printing
process, solder paste being printed on the lands can be optimally-positioned.
For details of settings and functions, see [NPM-DGS SP data editor].
Position assuming from the PCB recognition mark measurement result
■Correction function for solder printing positions
Features 2