N7201A616E00_0317 - 第648页
NPM-W 2 EJM7DJ-MB-08O-00 8-2-1 -3 System function details V arious functions 2 Operating procedure 8-2-1 The placement position accuracy, not onl y on the surface of solder but also of flip chips placed onto the land by …
NPM-W2 EJM7DJ-MB-08O-00
8-2-1-2
APC
system
Based on coordinate origin and angle obtained from PCB positioning mark recognition, a position
misalignment amount and area difference from a logical value (mask gerber data of solder printing) is
calculated per mask aperture.
Dx, dy:
The difference between logical coordinates and measurement coordinates of the solder center of the
gravity is a solder position misalignment amount.
Area ratio:
Ratio [%] against the mask aperture area calculated from the gerber data is a solder area ratio.
A printing position to be corrected to the optimum solder printing position shall be the minimum
misalignment amount of solder position.
For details, see the operating instruction [NPM-DGS SP data editor] or the operating instruction of the
printer.
■Calculation of printing position correction amount
2. Solder printing feedback
① PCB positioning mark A
② PCB positioning mark B
③ Logical coordinates of the solder center of the gravity based
on the positioning mark recognition result
④ X logical coordinate of solder
⑤ Y logical coordinate of solder
⑥ Solder position misalignment amount dx in X-direction
⑦ Solder position misalignment amount dy in Y-direction
③
④
⑦
⑤
①
②
⑥
■Calculating a misalignment amount of soldering positions
NPM-W2 EJM7DJ-MB-08O-00
8-2-1-3
System
function
details
Various functions 2
Operating procedure
8-2-1
The placement position accuracy, not only on the surface of solder but also of flip chips placed onto the land
by fluxes or solder transfer, is intended to be improved through the feed-forward communication of the
measurement result of land positions.
Also, by inspecting the land areas and positions and then skipping the placement of all components to bad
patterns, if any, it seeks to cut down on the cost associated with component losses.
The placement standard needs to be set to “Land” in the DGS setup of detailed data on components.
By recognizing directly the land position itself where components are placed, the components can be
placed with a high degree of accuracy, providing also an appropriate response to the component
deformation as an example.
■Land position measurement function
The exclusive recognition mode, which supports the
position measurement of land with wire patterns, is
installed.
Land for flip chip
The land position is
accurately measured by the
special processing that
calculates the center from
the set shape and shape.
Land defect
Skips placement of components into the
pattern where land defects are found.
In the case where solder inspection (land) defects are found in a pattern on a multi-surface pattern board,
such as a module component, it is equipped with the function that skips the placement of any components
into the pattern.
■Solder/land inspection and defect pattern placement skip function
Land defect
Land chip
Foreign
material
Example)
Solder inspection
standard
Feed-forward function
NPM-W2 EJM7DJ-MB-08O-00
8-2-1-4
APC
system