N7201A616E00_0317 - 第660页

NPM-W 2 EJM7DE-MB-09O -00 Specifi- cation Mac hine specifica tions/ Basic perf or mance 2 Operating procedure 9-1-1 9-1-1 -3 ■ Component recognition camera specifications Basic performance Item Multi-recognition camera *…

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NPM-W2 EJM7DE-MB-09O-00
9-1-1-2
At
a glance
Basic performance
Item
Specification
Light weight
16-nozzle head
12-nozzle head 8-nozzle head 3-nozzle head
Placement angle 0 to 359 °(It can be set in increments of 0.01°)
Placement range
(→P.9-1-4 ‘Applicable PCB specifications’)
PCB flow direction (→P.9-1-2 ‘PCB flow direction’)
Placement tact
time
*1)
(under optimum
conditions)
0.047 s per chip
(High production
mode :ON)
0.051 s per chip
(High production
mode :OFF)
0.056 s per chip
(High production
mode :ON)
0.058 s per chip
(High production
mode :OFF)
0.090 s per chip
0.225 per chip
(for QFP, 0.288 s)
Placement tact
time
*1) *2)
(under optimum
conditions)
■High production
mode :ON
±0.04 mm: Cpk ≧1
(0402, 0603, 1005
chip)
■High production
mode :ON
±0.04 mm: Cpk ≧1
(0402, 0603, 1005
chip)
±0.03 mm: Cpk ≧1
(0402, 0603, 1005
chip)
±0.05 mm: Cpk ≧1
(QFP:12 × 12 mm
or less)
±0.03 mm: Cpk ≧1
(QFP:12 × 12
to 32 × 32 mm or
less)
±0.03 mm: Cpk ≧1
(QFP)
■High production
mode :OFF
±0.03 mm: Cpk ≧1
(03015*
5）
, 0402,
0603, 1005 chip)
±0.025 mm: Cpk ≧1
(1005 chip) *
6）
■High production
mode :OFF
±0.03 mm: Cpk ≧1
(0402, 0603, 1005
chip)
Target component
Component
dimensions
( 03015 chip)
*5）
to 6 6 mm
Component
thickness: Max. 3
mm
Component
dimensions
( 0402 chip)
to 12 12 mm
Component thickness:
Max. 6.5 mm
Component dimensions
( 0402 chip)
to 32 32 mm
Component thickness:
Max. 12 mm
Component dimensions
( 0603 chip)
to 150 25 mm
(opposite side152.1 mm
or less)
Component thickness:
Max. 30 mm
Mass: Max. 30 g
PCB change time
Single conveyor
2.3 s (L 350 mm or less)
4.4 s (L 350 mm or over to 450 mm or less)
5.2 s (L 450 mm or over to 750 mm or less)
*3)
Dual conveyor
・Dual lane mode: 0 s
*3)
(If the cycle time is less than PCB changeover time, the time shall not
be 0 s).
・Single lane mode
*4)
2.3 s (L 350 mm or less)
4.4 s (L 350 mm or over to 450 mm or less)
5.2 s (L 450 mm or over to 750 mm or less)
*3)
*1) The values may vary with the type of component.
*2)
This is the case where the placement angle is 0°, 90°, 180°, or 270°. They may be affected by
rapid changes in ambient temperature.
*3) When the PCB is transported without placing the parts while the extension conveyor is installed
between machines.
*4) When PCBs are produced in single lane mode, the PCB support block (option) for single lane mode is
required.
*5) To support 03015 components, see (→P.9-1-11 ‘03015 placement support’)
*6)
To support ±0.025 mm, see (→P.9-1-12 ‘Placement accuracy ±0.025 mm support’)
NPM-W2 EJM7DE-MB-09O-00
Specifi-
cation
Machine specifications/
Basic performance 2
Operating procedure
9-1-1
9-1-1-3
■Component recognition camera specifications
Basic performance
Item
Multi-recognition camera
*1)
Type 1 (2D measurement)
/ Type 2 (thickness
measurement)
*2)
Type 3 (3D measurement)
Chip Outside dimension
0402,03015
*3)
to
QFP
SOP
Outside dimension
5 5 to 45 45 mm
Minimum lead pitch
0.4 mm
Minimum lead width
0.2 mm
BGA
CSP
Outside dimension
5 5 to 45 45 mm
Minimum ball pitch
0.3 mm 0.5 mm
Minimum ball diameter
0.15 mm 0.25 mm
Minimum ball height
--- 0.25 mm
Connector
Outside dimension
to 100 (L) 90 mm (W)
Opposite side134.5mm
Minimum lead pitch
0.5 mm
Minimum lead width
0.2 mm
*1 ) The values may vary depending on head specifications.
*2 ) Thickness can be measured by 03015 to Min Tr/Di.
*3 ) For supporting a 03015 component. (→P.9-1-11 ‘Supporting 03015 placement’)
NPM-W2 EJM7DE-MB-09O-00
9-1-1-4
At
a glance