N7201A616E00_0317 - 第664页

NPM-W 2 EJM7DE-MB-09O -00 Specifi- cation Mac hine specifica tions/ Basic perf or mance 4 Operating procedure 9-1-1 9-1-1 -7 Recognition unit configuration 2 Connector recognition condition (T ype 1 ) General con ditions…

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NPM-W2 EJM7DE-MB-09O-00
9-1-1-6
At
a glance
BGA / CSP recognition condition (Type 1 )
Conditions of BGA and CSP which can be placed are as follows:
*1)
8-nozzle head 3-nozzle head
Outer dimensions 2 x 2 to 32 x 32 mm
*2)
2 x 2 to 45 x 45 mm
*2)
Thickness 0.3 to 12 mm 0.3 to 30 mm
Ball pitch 0.4
*2)
to 1.5 mm 0.3
*2)
to 1.5 mm
Ball diameter φ0.15 to φ0.9 mm
Ball shape Ball or cylinder type
*3)
Ball material High temperature solder or eutectic solder
Maximum
number of balls
4096 balls
For positive-grid arrangement: (The number of rows x the number of columns) in the
outermost region is (64 x 64) balls
For staggered arrangement: (The number of rows x the number of columns) in the
outermost region is (32 x 32) balls
Minimum number
of balls
9 balls
(The number of rows x the number of columns) in the outermost region is (3 x 3) balls
Ball arraignment The balls should be uniform in pitch and size.
*4)
Supply type: Tape, tray
・The recognition of the outer shape of BGA / CSP and the simultaneous recognition of solder balls are
intended for those whose body is made of glass epoxy.
Recognition may be difficult depending on the condition of the solder ball placement surface (presence of
patterns / through holes, gloss, etc.).
・Those whose body is made of ceramic, or whose body color is gold, are placed by using the outer shape
recognition only.
・Keep the ball surfaces from becoming cloudy or turbid due to oxidation. You need to experimentally confirm
what degree of oxidation affects the availability of recognition.
*1) Basically, assess the availability of recognition by reviewing / conducting experimental placement using
samples.
*2) Consult us for large-sized fine-pitch components.
*3) Certain combinations of 2 ball pitches and ball diameters may make it impossible for you to perform
placement.
*4) The same Ball Miss and Plover pattern that are provided in the JEDEC and EIAJ with respect to BGA /
CSP are used.
●For components outside the above specifications, contact us.
NPM-W2 EJM7DE-MB-09O-00
Specifi-
cation
Machine specifications/
Basic performance 4
Operating procedure
9-1-1
9-1-1-7
Recognition unit configuration 2
Connector recognition condition (Type 1 )
General conditions of a connector which can be placed are as follows
*1)
.
8-nozzle head
3-nozzle head
Outer dimensions 32 x 32 mm or less L 100 x W 90 mm or less
*2)
Lead pitch 0.5 mm or more
Lead width 0.2 mm or more
Lead shape The amount of lead protrusion from the body should be 1 mm or more.
Other shape
There should be no through holes in a vertical direction around contact pins.
Contact pins should not be exposed on the under surface.
Supply type: Tape, tray, stick
*1) Basically, assess the availability of recognition by reviewing / conducting experimental placement using
samples.
*2) In the case of placement of a large connector, its size may be limited due to a relationship between the
pickup position and the camera view as well as this condition.
For details, contact us.
NPM-W2 EJM7DE-MB-09O-00
9-1-1-8
At
a glance
■3D measurement function (multi-recognition camera: [Type 3])
It is possible to detect the coplanarity and XY-directional position of all leads such as the ones of QFP / SOP
and the at a high speed.
Presence / absence or chipping of each ball on BGA / CSP can be detected.
Recognition
method
Recognition
speed
Example of
applicable
components
Minimum lead /
Minimum ball pitch
Minimum lead
width /
Minimum ball
diameter
Minimum ball
height
Batch
recognition
3D high speed
QFP, SOP 0.4 mm
*1)
0.12 mm ―
BGA, CSP 0.5 mm
*2)
0.3 mm 0.25 mm
*1) For QFP/ SOP whose lead pitch is 0.4 mm or less, consult us.
*2) For CSP whose ball pitch is 0.5 mm or less, consult us.
QFP recognition condition (Type 3)
Conditions of QFP which can be placed are as follows
*1)
.
8-nozzle head
3-nozzle head
Outer dimensions 2 x 2 to 32 x 32 mm 2 x 2 to 45 x 45 mm
Thickness 1.0 to12 mm 1.0 to 30 mm
Lead pitch 0.4 mm, 0.5 mm, 0.65 mm, 1.0 mm, 1.27 mm, 1.5 mm
Lead width 0.2 mm or longer
Lead shape The amount of lead protrusion from the mold should be 1 mm or more.
Supply type: Tape, tray
・The measurement range of lead coplanarity is ±0.5 mm.
・The planar portion of the lead under surface needs to be 0.2 mm or more in length.
・Depending on the recognition speed or the number of leads, it may take a certain amount of time to wait for
recognition processing at the time of placement.
*1) Basically, assess the availability of recognition by reviewing / conducting experimental placement using
samples.
●For details, contact us.
The planar portion of the under surface
0.2 mm or more