N7201A616E00_0317 - 第668页
NPM-W 2 EJM7DE-MB-09O -00 Specifi- cation Mac hine specifica tions/ Basic perf or mance 6 Operating procedure 9-1-1 9-1-1 -11 Recognition unit configuration 4 ■ Part thickness measurement function (Multi-recogn ition cam…
NPM-W2 EJM7DE-MB-09O-00
9-1-1-10
At
a glance
Connector recognition condition (Type 3 )
General conditions of a connector which can be placed are as follows
*1)
.
8-nozzle head
3-nozzle head
Outer dimensions 32 x 32 mm or less
L 100 x W 90 mm or less
*2)
Lead pitch 0.5 mm or more
Lead width 0.2 mm or more
Lead shape The amount of lead protrusion from the body should be 1 mm or more.
Other shape
There should be no through holes in a vertical direction around contact pins.
Contact pins should not be exposed on the under surface.
*1) Basically, assess the availability of recognition by reviewing / conducting experimental placement using
samples.
*2) In the case of placement of a large connector, its size may be limited due to a relationship between the
pickup position and the camera view as well as this condition.
●For details, contact us.
Supply type: Tape, tray, stick
・The measurement range of lead coplanarity is ±0.5 mm.
・ The planar portion of the lead under surface needs to be 0.2 mm or more in length
The planar portion of the under surface
0.2 mm or more
・Recognition may fail under certain under surface conditions of leads.
NPM-W2 EJM7DE-MB-09O-00
Specifi-
cation
Machine specifications/
Basic performance 6
Operating procedure
9-1-1
9-1-1-11
Recognition unit configuration 4
■Part thickness measurement function (Multi-recognition camera: [Type 2])
Improves placement quality through measurement of part thickness.
Item Description
Applicable
component
Each time 03015R
*1)
to Mini Tr / Di
Minimum part thickness: 0.1 mm
*To detect the pickup of a component being in a standing or slanted position, the difference
between any two of the following --- the thickness, width and length of the component ---
needs to be at least 50 μm.
Function
Part thickness
measurement
function
Each time
Part thickness is measured each time, which is
reflected in placement height. In addition, you can
simultaneously check the pickup of micro parts being
in a standing or slanted position and the reversing
pickup of Tr / Di.
Part teaching
You can make thickness measurement and chip data
entry on a per-part basis.
Nozzle top check
function
Checks the height of the nozzles for abnormalities.
*2)
Eject detection
function
If an error such as a recognition error has occurred, it checks the top of
the nozzles for any extraneous / foreign matter after ejecting parts.
・ This is not applicable to the measurement of nozzles with a pad or nozzles (e.g., 205A) the top of which is
dished.
・ Purchase on a per-table (front / rear) basis.
*1) When selecting “03015 placement support (option)”.
*2) Breaks, sliding failures in nozzle holders
NPM-W2 EJM7DE-MB-09O-00
9-1-1-12
At
a glance
2D inspection head specifications (option)
Item Specification
Mass
*1)
Inspection box
70 kg (per unit)
This section describes the specifications of machines equipped with the 2D inspection head.
For specifications common to machines with the placement head only (→P.9-1-1
-1 to P.9-1-1-3)
*1) Mass of the main body excluding the optional units
■Machine specifications
■Basic performance
*2) It varies depending on the inspection conditions
Item 2D inspection head (A) 2D inspection head (B)
Resolution 18 μm 9 μm
Field of view 44.4 x 37.2 mm 21.1 x 17.6 mm
Inspection
time
*2)
Solder 0.35 s / view
Component 0.5 s / view
Target
components
Solder
Chip component: 0.1 x 0.15 mm or
over
Package component: φ 0.15 mm or
over
Chip component: 0.08 x 0.12 mm or over
Package component: φ 0.12 mm or
over
Component
Square chip (0603 or over), SOP, QFP
(0.4 mm pitch or over), CSP, BGA,
aluminum electrolytic capacitor,
volume, trimmer, coil, connector,
resistor network, transistor, diode,
inductor, tantalum capacitor, MELF
Square chip (0402 or over), SOP, QFP
(0.3 mm pitch or over), CSP, BGA,
aluminum electrolytic capacitor, volume,
trimmer, coil, connector, resistor network,
transistor, diode, inductor, tantalum
capacitor, MELF
Inspection
item
Solder Oozing, blur, misalignment, shape defect, bridge
Component Component existence, misalignment, flip-over, polarity, foreign matter inspection
Inspection position
accuracy
Cpk≧1)
± 20 μm ± 10 μm
Inspection
point
Solder
Maximum 30 000 point per machine (component point: Maximum 10 000 points
per machine)
Component Maximum 10 000 points per machine