00900330-01_UM_ASM-ProcessLens_EN - 第55页
3 Machine description 3.2 Technical data Instruction manual ASM ProcessLens 03/2021 55 3.2.5 Conveyor specifications Single conveyor Flexible dual con- veyor Dual conveyor in "single conveyor" mode Minimum PCB …
3 Machine description
3.2 Technical data
54 Instruction manual ASM ProcessLens 03/2021
3.2.2 Ambient conditions for packaging, transportation and storage
Temperature range Between -25°C and 55°C
Atmospheric humidity Up to 95%
Ambient pressure Up to 1700 m height without pressure equalization
3.2.3 Center of Gravity
Fig.37: Center of gravity of the ASM ProcessLens solder paste inspection machine
1 550 mm 2 610 mm
3 730 mm
3.2.4 Electrical Ratings
Supply voltage Fuses
Main power supply 1/N/PE
Current rating: 110 V
1)
- 9.1 A, 240 V - 4.2 A, 50/60Hz
2 x 15 A
Power consumption 1 kW
Power supply 100 ~ 240 VAC, Single Phase 50/60 Hz
Short circuit rating of
machine (SCCR)
2)
10 kA
Power connector MENNEKES: 32 A 230 V 2 P+E STRAIGHT
1)
110 V~ as an option
2)
With the original mains connection cable. The marked short circuit rating (SCCR) relates to the beginning of
the original mains cable. In the case of customer modifications, the factory-set length of the mains cable to
the machine may not be shortened nor the factory-set conductor cross-section increased, as this would
have a negative impact on the short circuit rating (SCCR).
3 Machine description
3.2 Technical data
Instruction manual ASM ProcessLens 03/2021 55
3.2.5 Conveyor specifications
Single conveyor Flexible dual con-
veyor
Dual conveyor in
"single conveyor"
mode
Minimum PCB size L x W 50 mm x 50 mm 50 mm x 45 mm 50 mm x 45 mm
Maximum PCB size L x W 610 mm x 560 mm 375 mm x 260 mm 375 mm x 460 mm
PCB thickness range 0.5 mm to 4.5 mm
PCB warpage See PCB warpage
Maximum PCB weight Max. 3.0 kg Max. 3.0 kg
Underside PCB clearance:
Along the stopper bar
Outside the stopper bar
25 mm
25 mm
PCB conveyor height:
Option
Standard
Option SMEMA
900 mm
930 mm
950 mm
Type of interface SMEMA or IPC-HERMES-9852
Conveyor communication
interface
Left to right
Right to left
Outer / outer
Right / right
Left / left
3.2.6 Inspection capabilities
Pixel size (camera resolution) 15 μm x 15 μm
PCB Warpage compensation range ±6.5 mm (incl. Z-axis travel range)
FoV size 30 mm x 30 mm
Inspection speed Up to 30 cm
2
/s
Height resolution 0.37 μm
Height accuracy on calibration target ≤ 1 μm
X/Y gantry accuracy ±12.5 µm at 3 σ
3.2.7 Solder paste inspection capabilities
Measurement Shadow-free
Paste measurement functions Volume, area, height, X-and Y-offset, shape,
bridging, coplanarity
Maximum paste height 1000 μm
Minimum paste size 90 μm x 130 μm
Minimum paste pitch 75 μm
Height repeatability on solder paste ≤ 1 μm at ± 3 σ
Volume repeatability on solder paste ≤ 3 % at ± 3 σ
Area repeatability on solder paste ≤ 3 % at ± 3 σ
Gage Repeatability and Reproducibility (GRR) ≤ 10 %
3.2.8 Program generation specifications
Program generation < 10 min.
Offline programming available
Supported Gerber formats RS-274X
3 Machine description
3.2 Technical data
56 Instruction manual ASM ProcessLens 03/2021