SIPLACE D4-D4i 工程师手册_EN - 第18页

Operational Safety Preparatory Work... 2.1.5 Safety Instructions for Work on the Cu tting Device 18 Service Manual SIPLACE D4/D4i

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Operational Safety
2.1.5 Safety Instructions for Work on the Cutting Device Preparatory Work...
Service Manual SIPLACE D4/D4i 17
Testing
Service personnel may test circuits by energizing them briefly without suspending the Lock Out / Tag
Out Procedure. This may only be done when no other work is being performed by any other person on
the equipment being tested.
It is extremely important that all remote START switches be tagged with the "Do Not Operate" tag to pre-
vent inadvertent operation of the equipment during these periods.
Responsibilities
▪ It shall be the responsibility of the maintenance and service personnel to make sure this procedure
is adhered to.
▪ It shall be the responsibility of the maintenance and service personnel's immediate supervisor to in-
struct his personnel on this procedure.
▪ It shall be the responsibility of the Safety Officer with assistance from the Safety Committee, Health
Service Department, and the various managers and vice-presidents to administer the Lock Out / Tag
Out Procedure.
Operational Safety
Preparatory Work... 2.1.5 Safety Instructions for Work on the Cutting Device
18 Service Manual SIPLACE D4/D4i
Overview
3.1.1 SIPLACE D1 D-Series - General
Service Manual SIPLACE D4/D4i 19
3
3 Overview
Overview
3.1
3.1 D-Series - General
D-Series - General
3.1.1
3.1.1 SIPLACE D1
SIPLACE D1
3.1.2
3.1.2 SIPLACE D2
SIPLACE D2
SIPLACE D1 with one gantry
Overview
▪ 1 gantry
▪ 1 to 2 placement heads
▪ Pick&Place head: Twin or Highforce head
▪ Collect&Place head:
▪ Component spectrum: 0201 to 200 mm x 125 mm,
maximum component height: 25 mm
▪ Performance: 14.000 components/h (with C&P12)
▪ Accuracy: 30 µm at 3 sigma (40 µm at 4 sigma)
▪ Placement force: 1 N to 30 N (with Highforce head)
▪ Locations:
For more details, refer to the D1 specifications.
SIPLACE D2 with two gantries
Overview
▪ 2 gantries
▪ 2 placement heads
▪ Collect&Place head:
▪ Component spectrum: 01005 to 27 x 27 mm
▪ Performance: up to 31.100 components/h
▪ Accuracy: up to 52 µm at 3 sigma
▪Placement force: 2.4 N to 5 N
▪ Locations:
For more details, refer to the D2 specifications.