88573159-01-06 - Horizon iX Tech Spec - 第10页
10 DEK Horizon iX Printer P roductivity O ptions Transport Specificati on Substrate Su pport Vacuum toolin g capability Vacuum toolin g sensor Vacuum cups Grid - Lok® tooli ng Universal waf er pallet Precision wafe r pal…
9
DEK Horizon iX
Printer Productivity Options
Process
Specification
Cycle Time Upgrade
10 seconds to 8 seconds
Print Method
Paste Dispenser
Paste Roll Height Monitor
ProFlow® ATx
Ball Placement
Printing Environment Control
Static – Air Ioniser
Temperature – Temperature Control Module (TCM)
Recommended Stencil Frame
VectorGuard
Adjustable Stencil Mount (ASM)
Frame variants – Fully adjustable to accommodate
frame sizes in the range of 305mm to 736mm
(12”* to 29”) by 38mm height.**
Image position: Centre/Front/Custom
Under Stencil Cleaning
Interchangeable Under Stencil (IUSC) cleaner, fully
programmable with wet/dry/vacuum wipe with external
solvent tank. Specify length (300mm, 400mm, 520mm)
Typhoon Under Stencil Cleaner, fully programmable
with wet/dry/vacuum wipe with external solvent tank
Specify length (300mm, 400mm, 460mm, 515mm)***
Vacuum Assist for Under Stencil
Cleaning
On board vacuum unit 35 litres/second airflow
On board vacuum unit 25 litres/second airflow
On board venturi vacuum unit
Stencil Positioning
Automatic loading incorporating squeegee drip tray
Semi automatic loading incorporating squeegee drip
tray
Semi automatic loading without squeegee drip tray
Temperature/Humidity Sensor
Monitoring of the process environment
* Minimum screen width limited to 381mm (15”) with 300mm IUSC and 250mm board clamps
**Not available for Dual Lane Configuration
*** If configured with an ASM, the cleaner chamber size should be matched with the minimum ASM
width and stencil frame width being used
Long Board Accommodation
Specification
Substrate Handling Size (maximum)
620mm (X) x 508.5mm (Y)
Under Stencil Cleaning
Typhoon Under Stencil Cleaner (620mm, poly blade
insert only)
Software & Communications
Specification
Substrate Handling
Flexible boards
Selective print pass through
Singulation
Virtual Panel Tooling (VPT)
Top Reference System (TRS)
Software & Communications
GEM on TCP/IP
Offline Programming
Statistical Process Control
On board, reported via operator interface (QC-CALC)
10
DEK Horizon iX
Printer Productivity Options
Transport
Specification
Substrate Support
Vacuum tooling capability
Vacuum tooling sensor
Vacuum cups
Grid-Lok® tooling
Universal wafer pallet
Precision wafer pallet
Substrate Transport
Single piece conveyor with flat belts (heavy board rails)
Heavy pallet rails
High Throughput Conveyor (HTC) with OTS*
Remote board stop (for use with heavy board option)
Dual lane with front print table**
Dual lane with rear print table**
Substrate Fixture
Over Top Snuggers (OTS)
Snuggers (edge clamping)
Foil-less clamps
* Not available for Dual Lane Configuration
** Please refer to dual lane spec on page 11
Vision & Verification
Specification
HawkEye® 750 Paste on Pad Verification
Enabled
HawkEye® 1700 Paste on Pad
Verification
Enabled (camera included)
HawkEye®
HawkEye® Bridging (requires HawkEye® 1700
camera)
Data Capture
Specification
Product Data Capture
Verification & Traceability
ProDEK closed loop
Camera Barcode Reader
SMART Factory Integration
Specification
Software & Communications
ASM OIB
IPC CFX
Closed-loop-to-SPI
Connection to ASM Process Expert
ASM Offline Printer Programming
11
DEK Horizon iX
Printer Productivity Options
Dual Lane Transport System
Specification
Minimum Distance between rails 2 and 3 (A)
DEK Manual Adjustable Dual Lane: 34.5mm #
DEK Manual Adjustable Dual Lane with edge clamp tooling:
100mm #
Available Distance between rails 1 and 3 (B)
251mm= SMEMA #
251.7mm= Siemens
ESD Compatibility
Black transport belts and guides with surface resistivity of
greater than 10
6
ohms.
Substrate Handling Size (minimum)
Single Lane: 50mm (X) x 40.5mm (Y)
Dual Lane: 50mm (X) x 40.5mm (Y)
Substrate Handling Size (maximum)
Single Lane: 620mm (X) x 450mm (Y)
Dual Lane: 620mm (X) x B-A (Y)
Table Top Size
237mm
Conveyor Height
830mm to 980mm
Transport Direction (print lane)
Left to Right
Right to Left
Left to Left
Right to Right
Transport Direction (pass thru lane)
Left to Right (factory configured)
Right to Left (factory configured)
Board Weight (maximum)
1kg
Print Lane Under Clearance
40mm
Board Thickness
0.2mm to 6mm
# See drawing on page 12 for details