88573159-01-06 - Horizon iX Tech Spec - 第6页

6 DEK Horizon iX Printer S tandar d C onfigura tion Transpo rt System Specificati on Type Single piece w ith 3mm round t ransport bel ts, front r ail fixed Width Adjustm ent Programmabl e motorized re ar rail Transport D…

DEK Horizon iX

Printer Standard Configuration

Standard Configuration

Specification

Machine Alignment Capability

> 2.0 C

@ +/- 12.5µm, (±6 Sigma)

System Alignment Capability

> 2.0 C

@ +/- 20µm, (±6 Sigma), option to > 2.0 Cmk

@ +/- 15μm (±6 Sigma)*

Wet Print Capability

> 2.0 Cpk @ +/- 25μm, (±6 Sigma), option to > 2.0 Cpk

@ +/- 20μm, (±6 Sigma). Certified at Factory

Core Cycle Time

10 secs

Maximum Print Area

510mm** (X) x 508.5mm (Y)

Printer Construction

One piece optimised welded frame

ISCAN

Machine Control

Motion control using CAN BUS network

Operating System

Windows 10 IoT Enterprise

Operator Interface

Colour TFT touch screen display, keyboard and

trackball with DEK Instinctiv

software. Machine

mountable on either left or right hand side.

Camera

HawkEye® 750 digital camera, using IEEE 1394

interface. Multi channel. LED lighting. FOV 11.3mm x

8.7mm (split between two views). Inspection window

26mm

Camera Positioning

Rotary motors and encoders with 4 micron resolution

Squeegee Pressure Mechanism

Software controlled, motorised with closed loop

feedback

Stencil Positioning

Manual width screen depth adjuster

Stencil Alignment

Motorised via actuators X, Y, and Theta

Squeegee

Clamped double trailing edge squeegee

(1 set included)

Tooling Deviation Monitor

Verification of tooling setup via squeegee pressure

feedback

Machine Interface

Upline and downline FMI included

Connectivity

RJ-45LAN (networking) and USB2 interface available

ESD Compatibility

Compliant with EN/IEC 61340-5-1, EN/IEC 61340-5-2,

ANSI/ESD SP10.1, ANSI/ESD S20.20

Tri Colour Beacon

Programmable with audible alarm

Documentation

Hard copy manuals comprising: Operator, Installation,

Electrical Drawings. On board technical manuals and

tutorials supporting operator functions. DVD containing

manuals and tutorials.

* System Alignment Capability is certified by a 3

party software QC Calc and undertaken by applying

board loading/unloading, board clamping, camera/rising table movement and print process.

** For print area up to 600mm long please contact the Product Manager

DEK Horizon iX

Printer Standard Configuration

Transport System

Specification

Type

Single piece with 3mm round transport belts, front rail

fixed

Width Adjustment

Programmable motorized rear rail

Transport Direction

Left to right

Right to left

Left to left

Right to right

Substrate Handling Size (minimum)

50mm (X) x 40.5mm (Y)

Substrate Handling Size (maximum)

510mm (X) x 508.5mm (Y)

Substrate Length (Three Stage Mode)

370mm (X) with HTC option

Substrate Thickness

0.2mm to 6mm

Substrate Weight (maximum)

1kg

Substrate Warpage

Up to 7mm including substrate thickness

Substrate Fixture

Over the top clamps

Substrate Handling Features

Soft rail lift/land

Board clamp regulator

Substrate Underside Clearance

Programmable 3mm to 42mm

Process Parameter

Specification

Print Pressure

0kg to 20kg

Print Speed

2mm/sec to 300mm/sec

Print Gap

0mm to 6mm

Substrate Separation

Speed: 0.1mm/sec to 20mm/sec

Distance: 0mm to 20mm

Print Modes

ProFlow®

Print/Print

Print/Flood

Flood/Print

Adhesive

Paste Knead

Programmable: number; period; on demand

DEK Horizon iX

Printer Standard Configuration

Vision

Specification

Vision System

SFF

Fiducial Recognition

Automatic fiducial teach and find incorporating 0.3mm

fiducial capture

Fiducials

2 or 3

Fiducial Types

Synthetic fiducial library or unique pattern recognition

Fiducial Size

0.3mm to 3mm*

Fiducial Locations

Anywhere on substrate

Fiducial Error Recovery

Auto lighting adjustment

Auto fiducial search

Camera Lighting

Software controlled programmable LED lighting

*0.1mm to 3mm available via RFQ

Standard C Chase

Specification

Screen Frame Size (maximum)

736mm x 736mm (29” x 29”)

Screen Frame Thickness

25mm to 38mm (1” to 1.5”)

Image Position

Front

Centre

Custom

Operating Environment*

Specification

Temperature

10° to 35°C (50° to 95°F)

Humidity

30% to 70% relative humidity (non-condensing)

Altitude

Maximum 2,000 metres (6,500 feet)

Location

Internal only, not suitable for wet locations

*as described in the IPC Standard J-STD-001G-Reqirements for Soldered Electrical and Electronic

Assemblies Section 4 with respect to the following:

• Facilities - Cleanliness and ambient environments in all work areas be maintained at levels that

prevent contamination or deterioration of tools, materials, and surfaces to be soldered or

conformally coated. Eating, drinking, smoking, including use of e-cigarettes, and/or use of

tobacco products be prohibited in the work area.

• Environmental Controls - The soldering facility (controlled work area) be enclosed, temperature

and humidity controlled, and maintained at a positive pressure.

• Controlled Work Area (CWA) For the purpose of this statement, a Controlled Work Area

(CWA) is defined as an enclosed assembly / processing area maintained to a high degree of

shop cleanliness, environmental control, and foreign object debris (FOD) mitigation, either by

process or procedure, to limit the entry of contamination.