ACT - Accuracy Check Tool - 第198页
ACT with SSW 7xx / User Manual 07/2017 Edition 90 6 ACT on SIPLACE TX mi cron Placement Machi nes The SIPLACE T X micron series plac ement machin es are divided int o different accura cy classes: – TXmicron 20/25µm – TXm…
ACT with SSW 7xx / User Manual 07/2017 Edition
89
5.3 Restrictions
Tray in Conveyor for ACT for X-tables only
The Tray in Conveyor for ACT option is only possible for machines with X-tables.
Possible: X-series S, SX-series, DX-series, X-series with X-tables.
Number and position of the components in the tray
Feeding the tray In front of Board or Behind Board (see the Position on Conveyor parameter) is
only possible with SX1/2 and DX1/2 machines.
► Make sure that the components are correctly inserted into the tray.
► Adapt the tray description, because pickup will only be possible from a few rows.
Additionally, a "Short adapter" [03055995S01] is required to connect the glass plate with the tray at
the short side.
ACT with SSW 7xx / User Manual 07/2017 Edition
90
6 ACT on SIPLACE TX micron Placement Machines
The SIPLACE TX micron series placement machines are divided into different accuracy classes:
– TXmicron 20/25µm
– TXmicron 15µm
While the machines in the 20/25 μm accuracy class can still be measured using ACT as described
above, a special toolkit must be used for the 15 μm class because of the high requirements.
Overview: Configurations of the TX micron machines
TX micron 20/25 µm
TX micron 15 µm
X-/Y-axes – glass scale
X-/Y-axes – glass scale
X-fiducial bar between conveyor and nozzle
changer
X-fiducial bar between conveyor and nozzle
changer
Calibration tools and calibration nozzles
required in nozzle changer
Calibration tools and calibration nozzles
required in nozzle changer
C&P20 M2 / CPP M
C&P20 M2
Vakuum tooling – optional
Vakuum tooling - standard
Lifting table stabilizer for vacuum tooling
Y-fiducial bar at the vacuum tooling
Table 6-1: Differences between TX micron 20/25 µm and 15 µm
NOTICE
Placement Process
During the placement process, the X-fiducial bars are used for recalibration of the head
offset in both machine variants.
For this recalibration it is necessary that calibrating tools and one calibration nozzle in
the nozzle changer are available at both locations
The TX micron machine in accuracy class 15 μm / 3 S is specified for a board size up to 250 mm x
100 mm in I-Placement placement mode.
(I-Placement mode: Gantry 1 only places on Lane 1 and Gantry 2 only places on Lane 2).
If placement programs are placed in accuracy class 20/25 μm, the Alternating placement mode is
also permissible.
(Alternating mode: Gantry 1 and Gantry 2 can place on both conveyor lanes respectively).
For this reason, every TX micron machine in accuracy class 15 μm / 3 S must first be verified in
Alternating placement mode according to accuracy class 20 μm. (See also Table 4-5).
ACT with SSW 7xx / User Manual 07/2017 Edition
91
This results in the following procedure:
1. Vacuum tooling is installed.
2. ACT measurement with offset correction for 20 µm on Lane1 with Gantry 1 and 2 in
Alternating placement mode on "Micron ACT Plate 100 x 250 mm".
3. ACT measurement with offset correction for 20 µm on Lane2 with Gantry 1 and 2 in
Alternating placement mode on "Micron ACT Plate 100 x 250 mm".
4. Accepting the offset values of these measurements.
5. ACT measurement 15 µm on Lane 1 with Gantry 1 on "Micron ACT Plate 100 x 250 mm“
with vacuum tooling in I-Placement placement mode.
6. ACT measurement 5 µm on Lane 2 with Gantry 2 on "Micron ACT Plate 100 x 250 mm“
with vacuum tooling in I-Placement placement mode.
Working with ACT, see section 4.2.7 and section 4.2.8.