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114 www.nordsonefd.com info@nordsonefd.com USA & Canada 800-556-3484 Europe 00800 7001 7001 Asia +86 (21) 3866 9006 Solder Formulations Solder Formulations There are many possible options when formulating a solder pa…
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Solder Solutions
Solder Products
SolderPlus Solder Paste
SolderPlus
®
dispense pastes are used where solder joints are needed but printing is
not possible, and solder wire is neither practical nor efcient.
SolderPlus dispensing paste formulations are engineered to meet your specic alloy,
ux, and special project needs. This is how Nordson EFD delivers consistent solder
paste performance.
• Available in no clean, RMA, RA, and water-soluble formulations
• Clog-free, top-to-bottom dispensing of the entire barrel
• Consistent deposit size
• Packaged in EFD’s syringe barrels for best dispensing performance
• No missed deposits
• Reliable batch-to-batch consistency
SolderPlus’s printable solder pastes are formulated for application on printed circuit
boards through stencils. The dependable performance and wide process windows
helps reduce manufacturing costs by increasing rst-pass yields and reducing defects,
rework, and rejects. Printable solder pastes are available in a wide range of lead-free
and leaded alloys and particle sizes, as well as many ux formulations, including no
clean, RMA, and water soluble with halogen- and halide-free options.
• Long stencil life
• Consistent part quality with good print denition
• Reliable batch-to-batch consistency
TOP SOLDERPLUS SOLUTIONS
Product Name Product Description
NC 21
NC 21 is optimized for dispensing applications. It is available in dispensing solder paste and
printing solder paste options with all advertised alloy options. It is also available as paste ux.
NC 23
NC 23 is optimized for printing with 24-hour print life. It is available with all advertised
alloy options.
RA 41
RA 41 is a general-purpose RA formulation. It is available in dispensing solder paste and
printing solder paste options with all advertised alloy options. It is also available as paste ux.
RMA 03
RMA 03 is optimized for printing with 24-hour print life. It is available with all advertised
alloy options.
RMA 04
RMA 04 is optimized for dispensing applications. It is available in dispensing solder paste
and printing solder paste options, with all advertised alloy options. It is also available as paste
ux.
WS 67
WS 67 is a general purpose WS formulation. It is available in dispensing solder paste and
printing solder paste options with all advertised alloy options. It is also available as paste ux.
WS 70
WS 70 is optimized for printing with 24-hour print life. It is available with all advertised
alloy options.
WS 71
WS 71 is optimized for dispensing applications. It is formulated for high activity for soldering
to stainless steel and many industrial applications.
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Solder Formulations
Solder Formulations
There are many possible options when formulating a solder paste. Nordson EFD’s
general purpose solder pastes will meet most application requirements. For special
requirements, EFD offers a range of specialized formulations. Please contact your
Nordson EFD solder sales specialist for a free consultation.
LEADED ALLOYS
Alloy: Solidus (°C) Liquidus (°C)
Sn43 Pb43 Bi14 144 163
Sn62 Pb36 Ag2 179 189
Sn63 Pb37 183E*
Sn60 Pb40 183 191
Sn10 Pb88 Ag2 268 290
Sn10 Pb90 275 302
Sn5 Pb92.5 Ag2.5 287 296
Sn5 Pb95 308 312
POWDER SIZE
Powder Type
Powder Size
(micron)
Gullwing Lead
Pitch (mm / in)
Square / Circle
Aperture (mm / in)
Dispense Dot Dia.
(mm / in)
General Purpose
Tip Gauge
Tapered Tip
Gauge
II 45−75 0.65 / 0.025 0.65 / 0.025 0.80 / 0.030 21 22
III 25−45 0.50 / 0.020 0.50 / 0.020 0.50 / 0.020 22 25
IV 20−38 0.30 / 0.012 0.30 / 0.012 0.30 / 0.012 25 27
V 15−25 0.20 / 0.008 0.15 / 0.006 0.25 / 0.010 27 –
VI 5−15 0.10 / 0.004 0.05 / 0.002 0.15 / 0.006 32 –
LEAD-FREE ALLOYS
Alloy: Solidus (°C) Liquidus (°C)
Sn42 Bi57 Ag1.0 137 139
Sn42 Bi58 138E*
Sn96.5 Ag3.0 Cu0.5 217 219
Sn96.3 Ag3.7 221E*
Sn95 Ag5 221 245
Sn100 232MP**
Sn99.3 Cu0.7 227E*
Sn95 Sb5 232 240
Sn89 Sb10.5 Cu0.5 242 262
Sn90 Sb10 243 257
Paste Features
Halide-Free
We offer a range of halide-free solder pastes that
meet environmental trends and regulations.
Rapid Reow
Our rapid reflow solder pastes will not spatter when
heated and melted by solder, iron, induction, laser,
hot bar, and other rapid reflow devices.
Pin Transfer and Dipping
Solder pastes that are applied by dipping a
component or pin into the paste.
Low Residue
The quantity of flux residue left after reflow is less
than with typical solder pastes.
Difcult-to-Solder Surfaces
Solder paste for difficult-to-wet metals such as
Alloy42 lead finishes and highly oxidized surfaces
of aged components and boards.
Gap Filling and/or Vertical Surfaces
The flux is designed to hold the alloy in place until
liquidus is reached. These formulas are suited to
bridging gaps, filling holes, and soldering joints on
vertical surfaces.
*Eutectic - Solidus and Liquidus are equal
**MP - Melting point
*Eutectic - Solidus and Liquidus are equal
**MP - Melting point
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Solder Formulations
No Clean (NC) NC ux consists of rosin, solvent, and a small amount of activator. NC
ux typically has low-to-moderate activity and is suited to easily solderable surfaces.
IPC classication is usually ROL0 or ROL1. NC residue is clear, hard, non-corrosive,
non-conductive, and designed to be left on many types of assemblies. Residue may be
removed with an appropriate solvent. Some, but not all, NC uxes are more difcult to
remove than RMA uxes.
Rosin (R) R ux consists of rosin and solvent. Rosin ux has very low activity
and is suitable only for easy-to-solder surfaces. IPC classication is ROL0. R residue
is hard, non-corrosive, non-conductive, and may be left on. Residue may be removed
with an appropriate solvent.
Rosin Mildly Activated (RMA) RMA ux consists of rosin, solvent, and a small
amount of activator. Most RMA ux is fairly low in activity and best suited to easily
solderable surfaces. IPC classication is usually ROL0, ROL1, ROM0, or ROM1. RMA
ux residue is clear and soft. Most are non-corrosive and non-conductive. Many RMA
uxes pass SIR testing as a NC ux. Residue may be removed with an appropriate
solvent.
Rosin Activated (RA) RA ux consists of rosin, solvent, and aggressive activators.
RA ux has similar and higher activity than RMA for moderately and highly oxidized
surfaces. IPC classication is usually ROM0, ROM1, ROH0, or ROH1. In the absence
of testing to prove otherwise, RA ux residue is assumed to be corrosive. Assemblies
sensitive to corrosion or the possibility of electrical conduction through the residue
should be cleaned as soon as possible after assembly. Residue may be removed with
an appropriate solvent.
Water Soluble (WS) WS ux consists of activators, thixotrope, and solvent.
WS ux comes in a wide range of activity levels, from no activity to extremely
high activity for soldering to even the most difcult surfaces, such as stainless
steel. IPC classication normally starts with OR for organic. They come in
L, M, H activity levels and halide content of 0 or 1. By denition, residue
may be removed with water.
FLUX COMPARISON
Low Activity Medium Activity High Activity
R
RMA
NC
RA
WS
Flux Comparison chart shows relative activity ranges of each ux category. Note overlap of activity levels between ux groups.