Nordson_EFD_10th_Edition_Product_Catalog - 第33页
31 Valve Selection Guide Jetting / Dispense / Spray Choosing the right dispense valve for an application starts with the uid. Use this guide to: • See which Nordson EFD valves work with specic uids and applications • …

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Precision Dispensing Tips
DISPENSING TIPS
Applications
Tapered Stainless Steel PTFE-Lined Flexible
MicroDot
Ceramic
MicroDot
Stainless Steel
Precision
Nozzle
Very Low Viscosity Fluids
Particle-Filled Pastes
Microdot Deposits
Fluid is Reactive to Metal
Depositing in Recesses
Spreading/Smearing
Fast-Curing Glues
Beading, Striping
Easily Scratched Substrates
Fluids
Adhesives
Anaerobics
Conformal Coatings
Cyanoacrylates
Gel Cyanoacrylates
Epoxies
Greases
Light-Cure Adhesives
Oils
Paints
Sealants
Silver Epoxy
Solder Paste/Braze Pastes
Solder Masks
Solvents
UV-Cure Adhesives
Key
l Recommended
s Satisfactory
X Do not use
*OK if used with tip shield, part #7017715 or 7017717.
+Chamfered tips are recommended for best results.
**Standard tapered tips are recommended for best results.

31
Valve Selection Guide
Jetting / Dispense / Spray
Choosing the right dispense valve for an application starts
with the uid.
Use this guide to:
• See which Nordson EFD valves work with specic uids
and applications
• Compare the features of EFD valves and controllers
• Select a type of uid for an application
For example, if you know you want to use a jet dispensing
valve because of its signicant precision and fast cycle rate,
you could use this guide to identify the types of uids most
suitable for jetting.
Benets
• Performance that’s proven for millions of dispense cycles
• Long service life with minimal maintenance
• Worldwide technical assistance
• Global application testing labs
Please note this guide does not include every EFD
dispensing solution available. It’s important to speak with an
experienced EFD application specialist when choosing the
right solution for your application.

32
FLUIDS
VALVE APPLICATIONS
Microdots* Dots Jetting Potting Encapsulating Lines/Stripes
Filling /
Packaging
Microspray Spray
Internal
Spray
Internal Band
Accelerators xQR41 752V-UHSS
PICO Pµlse / XP
P-Jet, P-Dot
— — xQR41V 752V-UHSS 781Mini 781S-SS 782RA 7860C-RS
Activators xQR41 752V-UHSS
PICO Pµlse / XP
P-Jet, P-Dot
— — xQR41V 752V-UHSS 781Mini 781S-SS 782RA 7860C-RS
Alcohol xQR41 752V-UHSS
PICO Pµlse / XP
P-Jet
— — xQR41V 752V-UHSS 781Mini 781S-SS 782RA 7860C-RS
Anaerobics
xQR41 PEEK**
752V-UHSS
xQR41 PEEK**
752V-UHSS
PICO Pµlse / XP
P-Jet
— — 752V-UHSS 725HF-A — — — 7860C-RS
Conformal Coatings xQR41 752V-UHSS
PICO Pµlse / XP
P-Jet
— 752V-UHSS 752V-UHSS 725HF-SS 781Mini 781S-SS — —
Copper Braze Paste — 725DA-SS — — — 725DA-SS 725HF-SS — — — —
Cyanoacrylates
xQR41 PEEK**
752V-UHSS
xQR41 PEEK **
752V-UHSS
PICO Pµlse / XP
P-Jet, P-Dot
— — 752V-UHSS — — — — 7860C-RS
Electrolytes xQR41 752V-UHSS
PICO Pµlse / XP
P-Jet
— — — 752V-UHSS 781Mini 781S-SS — —
Epoxies xQR41 752V-UHSS
PICO Pµlse / XP
P-Dot
725DA-SS 725DA-SS 725DA-SS 725HF-SS —
— — —
Fluxes, Liquid xQR41 752V-UHSS
PICO Pµlse / XP
P-Jet
— — 752V-UHSS 725HF-SS 781Mini 781S-SS — —
Fluxes, Paste xQR41 725DA-SS
PICO Pµlse / XP
P-Jet, P-Dot
— — 725DA-SS 725HF-SS — — — —
Grease: low pressure
(to 7.0 bar ,100 psi)
xQR41 725DA-SS
PICO Pµlse / XP
P-Jet, P-Dot
— — 725DA-SS 725HF-SS — 781S-SS — —
Grease: med. pressure
(to 20.7 bar, 300 psi)
xQR41 736HPA-NV
PICO Pµlse / XP
P-Jet, P-Dot
— — 736HPA-NV 736HPA-NV — 781S-SS — —
Grease: high pressure
(to 172 bar, 2500 psi )
— 736HPA-NV
PICO Pµlse / XP
P-Jet, P-Dot
— — 736HPA-NV 736HPA-NV — — — —
Inks / Paints xQR41 752V-UHSS
PICO Pµlse / XP
P-Jet
— — xQR41V 725HF-SS 781Mini 781S-SS 782RA 7860C-RS
Oils xQR41 752V-UHSS
PICO Pµlse / XP
P-Jet, P-Dot
— — xQR41V 725HF-SS 781Mini 781S-SS 782RA 7860C-RS
*Note: For microdot applications requiring general purpose tip sizes between 27 and 33 gauge, specify valve model xQR41 in place of 741V-SS. **Conditional use with cyanoacrylates.
Microdots: Any deposit having a
volume less than 5 µl (5 µl = 5 microliters
= 5/1000 cc).
Dots: Any deposit having a volume
larger than 5 µl.
Jetting: Applying microdots, dots, lines,
stripes, and encapsulates without making
contact with a surface – also called non-
contact dispensing.
Potting: Filling a cavity usually
containing an electronic device, electronic
circuit, or wires.
Encapsulating: Applying a coating to
an electronic component for protection from
mechanical or environmental damage.
Lines/Stripes: A line, bead or
stripe of material.
Filling/Packaging: Filling
containers such as small bottles,
cartridges, and tubes.
Microspray: Narrow spray pattern
capability as small as 1 mm (0.04”) wide.
Spray: Applying uids by using low
pressure air to break the uid into ne
droplets for coating or marking.
Internal Spray: Spraying the inside
diameter of holes and cylinders.
Application Denitions